Film forming method and film forming system

Patent metadata

Field	Value
Publication number	US-10199268-B2
Application number	US-201715698498-A
Country	US
Kind code	B2
Filing date	Sep 7, 2017
Priority date	Sep 9, 2016
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

In a film forming method for forming a cobalt film on a target substrate having a recess formed in a surface thereof to fill the recess with the cobalt film, the recess is partially filled by forming a cobalt film on the target substrate by an ALD method or a CVD method using an organic metal compound gas. The cobalt film is partially etched by supplying an etching gas containing β-diketone gas and NO gas to the target substrate. Then, the recess is further filled by forming a cobalt film on the target substrate by the ALD method or the CVD method using an organic metal compound gas.

First claim

What is claimed is:

1. A film forming method for forming a cobalt film on a target substrate having a recess formed in a surface thereof to fill the recess with the cobalt film, the method comprising:
a first step of partially filing the recess by forming a cobalt film on the target substrate by an ALD method or a CVD method using an organic metal compound gas;
a second step of partially etching the cobalt film by supplying an etching gas containing β-diketone gas and NO gas to the target substrate; and
a third step of further filling the recess by forming a cobalt film on the target substrate by the ALD method or the CVD method using an organic metal compound gas.

2. The film forming method of claim 1 , wherein the second step and the third step are repeated twice or more.

3. The film forming method of claim 1 , wherein in the first step and the third step, the cobalt film is formed by using cobalt amidinate as the organic metal compound gas and using a reduction gas.

4. The film forming method of claim 3 , wherein the first step and the third step are performed while heating the target substrate to a temperature of 300° C. or less.

5. The film forming method of claim 1 , wherein in the second step, a compound in which an alkyl group containing a halogen atom is bonded to a carbonyl group in a molecule is used as the β-diketone.

6. The film forming method of claim 5 , wherein the β-diketone contains hexafluoroacetylacetonate.

7. The film forming method of claim 1 , wherein a flow rate ratio of a flow rate of the NO gas to a flow rate of the β-diketone gas is within a range from 0.02 to 0.5.

8. The film forming method of claim 7 , wherein the flow rate ratio of the flow rate of the NO gas to the flow rate of the β-diketone gas is within a range from 0.12 to 0.5.

9. The film forming method of claim 1 , wherein the second step is performed while heating the target substrate to a temperature of 200° C. to 250° C.

10. The film forming method of claim 9 , wherein the second step is performed while heating the target substrate to a temperature of 220° C. to 240° C.

11. The film forming method of claim 1 , wherein the first step and the third step are performed in a first chamber and the second step is performed in a second chamber different from the first chamber,
wherein the first to the third step are performed in a vacuum state, and
wherein the target substrate is transferred between the first chamber and the second chamber in a vacuum state.

12. The film forming method of claim 1 , wherein the first to the third step are performed in a same chamber.

13. A film forming system for performing the film forming method described in claim 1 , the system comprising:
a film forming apparatus configured to perform the first step and the third step;
an etching apparatus configured to perform the second step; and
a vacuum transfer chamber connected to the film forming apparatus and the etching apparatus, the vacuum transfer chamber having a transfer unit configured to transfer a target substrate between the film forming apparatus and the etching apparatus.

14. A film forming system for performing the film forming method described in claim 1 , the system comprising:
a film forming and etching apparatus including a single chamber, a film forming gas supply unit configured to supply a film forming gas used in the film formation of the first step and the third step into the chamber, and an etching gas supply unit configured to supply the etching gas used in the etching of the second step into the chamber.

15. A storage medium storing a program which is executed on a computer to control a film forming system, wherein the program, when executed, controls the film forming system through the computer to perform the film forming method described in claim 1 .

Assignees

• Tokyo Electron Ltd

Inventors

• Yamauchi Susumu
• Lin Jun
• Nishimura Kazuaki
• Hasegawa Toshio

Classifications

• H10P72/0464

  characterised by the construction of the transfer chamber · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P50/266

  by vapour etching only · CPC title

• H10P14/432

  using selective deposition · CPC title

• H10P14/418

  the conductive layers comprising transition metals · CPC title