Semiconductor lamp

Patent metadata

Field	Value
Publication number	US-10197223-B2
Application number	US-201515324155-A
Country	US
Kind code	B2
Filing date	Apr 29, 2015
Priority date	Jul 9, 2014
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

A semiconductor lamp (1) has at least one semiconductor light source (8) arranged on a front face (7) of a substrate (6) and a driver circuit (11) for activating the at least one semiconductor light source (8), at least part of the driver circuit (11) being secured on a rear face (10) of the substrate (6), facing away from the at least one semiconductor light source (8). The invention can be used, in particular, for retrofit lamps, in particular incandescent- or halogen retrofit lamps.

First claim

The invention claimed is:

1. A semiconductor lamp, comprising:
at least one semiconductor light source arranged on a front side of a substrate;
a driver circuit for controlling the at least one semiconductor light source, wherein at least part of the driver circuit is attached to a back side of the substrate facing away from the at least one semiconductor light source;
a cooling body lying superficially on the front side of the substrate, wherein the cooling body has at least one recess for the at least one semiconductor light source, and wherein the cooling body is a dish-like cooling body with a plate-like base and a side edge protruding therefrom at an angle; and
at least one optical element disposed over the cooling body and having legs protruding to a rear, wherein each leg extends through a respective recess in the plate-like base of the cooling body as far as the substrate such that material of the cooling body physically intervenes between the legs and the at least one semiconductor light source.

2. The semiconductor lamp according to claim 1 , wherein the at least one recess for the at least one semiconductor light source is made in the plate-like base.

3. The semiconductor lamp according to claim 1 , wherein the cooling body is attached to the substrate by means of an adhesive heat-conductive layer.

4. The semiconductor lamp according to claim 1 , wherein the substrate is accommodated in a housing.

5. The semiconductor lamp according to claim 4 , wherein the housing has a socket region on a back of the housing and is open at a front of the housing.

6. The semiconductor lamp according to claim 4 , wherein the side edge of the cooling body lies superficially on an inside of the housing.

7. The semiconductor lamp according to claim 4 , wherein the driver circuit in the housing is surrounded by potting compound.

8. The semiconductor lamp according to claim 1 , wherein the substrate has a conductive structuring on one side only, and components attached on the other side of the substrate are electrically connected to the conductive structuring via electrically conductive passages through the substrate.

9. The semiconductor lamp according to claim 1 , wherein the semiconductor lamp is a retrofit lamp.

10. The semiconductor lamp according to claim 1 , wherein the plate-like base of the cooling body has different recesses for the at least one semiconductor light source and for the legs protruding to the rear.

11. The semiconductor lamp according to claim 1 , wherein the at least one recess for the at least one semiconductor light source and the recesses in the plate-like base of the cooling body through which each leg extends are co-planar.

12. The semiconductor lamp according to claim 1 , wherein the cooling body further has at least one recess for protrusions on the front side of the substrate from conductive passages.

13. The semiconductor lamp according to claim 12 , wherein material of the cooling body physically intervenes between the protrusions on the front side of the substrate from conductive passages and the at least one semiconductor light source.

14. The semiconductor lamp according to claim 12 , wherein the at least one recess for the at least one semiconductor light source and the at least one recess for protrusions on the front side of the substrate from conductive passages are co-planar.

15. The semiconductor lamp according to claim 1 , wherein only the legs of the at least one optical element are disposed within the cooling body.

16. The semiconductor lamp according to claim 15 , wherein a main body portion of the at least one optical element is external to the cooling body.

17. The semiconductor lamp according to claim 16 , wherein the main body portion of the at least one optical element is not in physical contact with the cooling body.

18. The semiconductor lamp according to claim 1 , wherein the at least one optical element is further configured to reside on a shoulder of a housing of the semiconductor lamp.

19. The semiconductor lamp according to claim 1 , wherein the cooling body is adhered to the front side of the substrate.

20. The semiconductor lamp according to claim 1 , wherein the at least one optical element is disposed over of the cooling body such that an air gap separates a rear side of the at least one optical element and a front side of the cooling body.

Assignees

• Osram Gmbh
• Ledvance Gmbh

Inventors

• Weng Thomas
• Ringler Stefan
• Klafta Thomas
• Auernhammer Marianne

Classifications

• F21V5/004

  using microlenses · CPC title

• F21V5/04

  of lens shape · CPC title

• F21V29/503

  of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858) · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21K9/238

  Arrangement or mounting of circuit elements integrated in the light source · CPC title