Method for producing cylindrical relief printing original plate

Patent metadata

Field	Value
Publication number	US-10195841-B2
Application number	US-201415032952-A
Country	US
Kind code	B2
Filing date	Oct 28, 2014
Priority date	Oct 29, 2013
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

A method includes (i) preparing a printing original plate sheet having an uncured photosensitive resin layer on a surface thereof, wherein compressive strength of the uncured photosensitive resin layer at 25° C. is 1.0 to 3.0 kgf/cm 2 ; (ii) mounting the printing original plate sheet around a cylindrical support in such a manner that a starting terminal of the mounting and an ending terminal of the mounting are overlapped; and (iii) applying pressure to the overlapped area of the starting terminal of the mounting and the ending terminal of the mounting at a temperature range of 10 to 40 ° C. so as to pressure-bond the overlapped area. The method may further include, after the step (iii), a step (iv) for photo-curing the uncured photosensitive resin layer and may further comprise, after the step (iv), a step (v) for grinding, abrading and/or machining the overlapped area.

First claim

The invention claimed is:

1. A method for producing a cylindrical relief printing original plate by mounting a printing original plate sheet around a cylindrical support, characterized in that the method comprises the following steps (i) to (iii):
(i) a step for preparing a printing original plate sheet having an uncured photosensitive resin layer on a surface thereof, wherein compressive strength of the uncured photosensitive resin layer at 25° C. is 1.0 to 3.0 kgf/cm 2 ;
(ii) a step for mounting the printing original plate sheet around a cylindrical support in such a manner that a starting terminal of the mounting and an ending terminal of the mounting are overlapped; and
(iii) a step for applying pressure to the overlapped area of the starting terminal of the mounting and the ending terminal of the mounting at a temperature range of 10 to 40° C. so as to pressure-bond the overlapped area.

2. The method according to claim 1 , wherein content of a binder polymer in the photosensitive resin layer is 35 to 55% by mass.

3. The method according to claim 2 , wherein the binder polymer in the photosensitive resin layer contains at least one kind of latex resin selected from polybutadiene latex, nitrile-butadiene latex, styrene-butadiene latex and methyl methacrylate-butadiene latex.

4. The method according to claim 1 , wherein, after the step (iii), the method further comprises a step (iv) for photo-curing the uncured photosensitive resin layer.

5. The method according to claim 4 , wherein, after the step (iv), the method further comprises a step (v) for grinding, abrading and/or machining the overlapped area.

Assignees

• Toyo Boseki

Inventors

• Yawata Yukimi
• Wada Toru

Classifications

• G03F7/24

  Curved surfaces {(G03F7/70 takes precedence)} · CPC title

• B41N1/22

  made of other substances · CPC title

• B29C65/002

  Joining methods not otherwise provided for · CPC title

• B41N1/12

  non-metallic other than stone {, e.g. printing plates or foils comprising inorganic materials in an organic matrix (B41N1/003, B41N1/006 take precedence)} · CPC title

• B41C1/006 Primary

  the relief or intaglio pattern being obtained by abrasive means, e.g. by sandblasting · CPC title