Organic light-emitting display device
US-2018108720-A1 · Apr 19, 2018 · US
US10192890B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10192890-B2 |
| Application number | US-201715454337-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 9, 2017 |
| Priority date | May 18, 2016 |
| Publication date | Jan 29, 2019 |
| Grant date | Jan 29, 2019 |
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A transistor display panel including: a substrate; a gate electrode disposed on the substrate; a semiconductor that overlaps the gate electrode; an upper electrode disposed on the semiconductor; a source connection member and a drain connection member disposed on the same layer as the upper electrode and respectively connected with the semiconductor; a source electrode connected with the source connection member and the upper electrode; and a drain electrode connected with the drain connection member.
Opening claim text (preview).
What is claimed is: 1. A transistor display panel comprising: a substrate; and a transistor disposed on the substrate, wherein the transistor comprises: a gate electrode disposed on the substrate; a semiconductor that overlaps the gate electrode; an upper electrode disposed on the semiconductor and overlapping the gate electrode; a source connection member and a drain connection member disposed on the same layer as the upper electrode and respectively connected with the semiconductor; a source electrode connected with the source connection member and the upper electrode; and a drain electrode connected with the drain connection member. 2. The transistor display panel of claim 1 , wherein the upper electrode overlaps the semiconductor. 3. The transistor display panel of claim 2 , further comprising: a first insulation layer disposed between the gate electrode and the semiconductor; and a second insulation layer disposed between the semiconductor and the upper electrode. 4. The transistor display panel of claim 3 , wherein: the second insulation layer comprises a first opening and a second opening that overlap the semiconductor and are disposed apart from each other; and the source connection member and the drain connection member are connected with the semiconductor through the first opening and the second opening. 5. The transistor display panel of claim 4 , further comprising a third insulation layer that covers the upper electrode, the drain connection member, and the source connection member. 6. The transistor display panel of claim 5 , wherein: the third insulation layer comprises a first contact hole, a second contact hole, and a third contact hole; the first contact hole and the second contact hole respectively overlap the source connection member and the drain connection member; the source electrode is connected with the source connection member and the upper electrode through the first contact hole and the third contact hole; and the drain electrode is connected with the drain connection member through the second contact hole. 7. The transistor display panel of claim 1 , further comprising a pixel electrode that is electrically connected with the source electrode. 8. The transistor display panel of claim 1 , wherein the semiconductor comprises an oxide semiconductor. 9. The transistor display panel of claim 6 , further comprising: a switching semiconductor spaced apart from the semiconductor and disposed on the same layer as the semiconductor; and a gate line disposed on the switching semiconductor, disposed on the same layer as the upper electrode, and transmitting a gate signal, wherein a portion of the gate line overlaps the switching semiconductor. 10. The transistor display panel of claim 9 , further comprising a connection electrode disposed on the same layer as the source electrode and connecting the switching semiconductor and the gate electrode. 11. The transistor display panel of claim 10 , wherein: the third insulation layer has a fourth contact hole overlapping the gate electrode, and a fifth contact hole overlapping the connection electrode; and one end portion of the connection electrode is connected to the gate electrode through the fourth contact hole, and the other end portion of the connection electrode is connected to the switching semiconductor through the fifth contact hole. 12. The transistor display panel of claim 10 , wherein one end portion of the connection electrode overlaps the gate electrode in a plane view, and the other end portion of the connection electrode overlaps the switching semiconductor in a plane view. 13. The transistor display panel of claim 10 , wherein the switching semiconductor comprises an oxide semiconductor. 14. The transistor display panel of claim 10 , further comprising a data line disposed on the same layer as the connection electrode, wherein a portion of the data line overlaps the switching semiconductor. 15. The transistor display panel of claim 14 , wherein the portion of the data line is connected to the switching semiconductor. 16. A method of manufacturing a transistor display panel, comprising forming a transistor on a substrate, wherein the forming of the transistor comprises: forming a gate electrode on the substrate; forming a semiconductor that overlaps the gate electrode; forming an upper electrode, a source connection member, and a drain connection member, wherein the upper electrode overlaps the semiconductor and the gate electrode, and the source connection member and the drain connection member are connected with the semiconductor; and forming a source electrode that is connected with the upper electrode and the source connection member and a drain electrode that is connected with the drain connection member. 17. The method of claim 16 , wherein the upper electrode is formed on the semiconductor. 18. The method of claim 17 , further comprising: forming a first insulation layer that covers the gate electrode; forming a second insulation layer that covers the semiconductor; and forming a first opening and a second opening in the second insulation layer, the first opening and the second opening overlapping the semiconductor, wherein the source connection member and the drain connection member are connected with the semiconductor respectively through the first opening and the second opening. 19. The method of claim 18 , further comprising forming a third insulation layer that covers the upper electrode, the drain connection member, and the source connection member. 20. The method of claim 19 , further comprising forming a first contact hole, a second contact hole, and a third contact hole, wherein: the first contact hole and the second contact hole respectively overlap the source connection member and the drain connection member; the third contact hole overlaps the upper electrode; and the source electrode is connected with the source connection member and the upper electrode through the first contact hole and the third contact hole, and the drain electrode is connected with the drain connection member through the second contact hole.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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