Semiconductor device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10192880-B2
Application number	US-201715638496-A
Country	US
Kind code	B2
Filing date	Jun 30, 2017
Priority date	Nov 8, 2016
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

A semiconductor device includes gate stacked structures surrounding channel layers, a common source line filling a separation area between the gate stacked structures adjacent to each other and having an upper surface including first concave portions, and a support insulating layer filling the first concave portions and having sidewalls facing portions of the channel layers.

First claim

What is claimed is:

1. A semiconductor device comprising:
gate stacked structures surrounding channel layers;
a common source line filling a separation area between the gate stacked structures adjacent to each other and having an upper surface including first concave portions, wherein the first concave portions are arranged in a first direction crossing a lengthwise direction of the channel layer; and
a support insulating layer filling the first concave portions and having sidewalls facing portions of the channel layers.

2. The semiconductor device of claim 1 , wherein the separation area and the common source line extend in the first direction.

3. The semiconductor device of claim 2 , wherein the first concave portions are spaced apart from each other in the first direction.

4. The semiconductor device of claim 2 , wherein the separation area includes first slits and second slits arranged alternately with each other in the first direction and coupled to each other.

5. The semiconductor device of claim 4 , wherein the common source line comprises:
first portions arranged below the support insulating layer in the first slits; and
second portions arranged in the second slits and extending to be longer than the first portions in a third direction perpendicular to the first direction.

6. The semiconductor device of claim 1 , wherein the common source line includes a bottom surface including second concave portions overlapping with the first concave portions.

7. The semiconductor device of claim 1 , further comprising:
a source layer arranged below the gate stacked structures so as to contact the channel layers.

8. The semiconductor device of claim 7 , wherein the common source line comprises:
a first portion arranged between the source layer and the support insulating layer and spaced apart from the source layer; and
a second portion contacting the source layer and extending to face the sidewalls of the support insulating layer.

9. The semiconductor device of claim 8 , further comprising:
at least one insulating layer arranged between the first portion and the source layer.

10. The semiconductor device of claim 7 , wherein each of the channel layers extends into the source layer, the source layer including a contact source layer contacting sidewalls of the channel layers and a base source layer arranged below the contact source layer, and
the semiconductor device further comprises insulating plugs passing through the contact source layer and overlapping with the first concave portions.

11. A semiconductor device comprising:
gate stacked structures;
a channel layer penetrating each of the gate stacked structures; and
a common source line having uneven sidewalls facing the gate stacked structures and arranged between the gate stacked structures,
wherein each of the uneven sidewalls is defined by depressions and protrusions alternating with each other in a first direction crossing a lengthwise direction of the channel layer.

12. The semiconductor device of claim 11 , wherein the common source line includes:
an upper surface including first concave portions spaced apart from each other in the first direction; and
a bottom surface including second concave portions spaced apart from each other in the first direction and overlapping with the first concave portions.

13. The semiconductor device of claim 11 , further comprising:
first slits arranged in the first direction between the gate stacked structures and having lower portions filled with the common source line; and
a support insulating layer provided on the common source line to fill upper portions of the first slits.

14. The semiconductor device of claim 13 , further comprising:
second slits neighboring the first slits in the first direction, between the gate stacked structures, and filled with the common source line.

15. The semiconductor device of claim 11 , wherein
a portion of the common source line is higher than the gate stacked structures and the channel layer, and
a remaining portion of the common source line is lower than the gate stacked structures and the channel layer.

16. A semiconductor device comprising:
gate stacked structures; and
a common source line arranged between the gate stacked structures,
wherein the common source line has uneven sidewalls facing the gate stacked structures, an uneven bottom surface and an uneven upper surface.

17. The semiconductor device of claim 16 , further comprising:
a channel layer penetrating each of the gate stacked structures,
wherein each of the uneven sidewalls is defined by depressions and protrusions alternating with each other in a first direction crossing a lengthwise direction of the channel layer.

18. The semiconductor device of claim 16 , further comprising:
a channel layer penetrating each of the gate stacked structures,
wherein the uneven bottom surface is defined by depressions and protrusions alternating with each other in a first direction crossing a lengthwise direction of the channel layer.

19. The semiconductor device of claim 16 , further comprising:
a channel layer penetrating each of the gate stacked structures,
wherein the uneven upper surface is defined by depressions and protrusions alternating with each other in a first direction crossing a lengthwise direction of the channel layer.

Assignees

• Sk Hynix Inc

Inventors

• Lee Ki Hong

Classifications

• H01L27/11565

  Electricity · mapped topic

• H01L27/11568 Primary

  Electricity · mapped topic

• H01L27/1157

  Electricity · mapped topic

• H01L27/11582

  Electricity · mapped topic

• H10B41/50

  characterised by the boundary region between the core region and the peripheral circuit region · CPC title