Devices including a diffusion barrier layer

Patent metadata

Field	Value
Publication number	US-10192574-B2
Application number	US-201715783164-A
Country	US
Kind code	B2
Filing date	Oct 13, 2017
Priority date	Mar 22, 2015
Publication date	Jan 29, 2019
Grant date	Jan 29, 2019

Abstract

Devices having an air bearing surface (ABS), the devices including a write pole; a near field transducer (NFT) that includes a peg and a disc, wherein the peg is at the ABS of the device; a heat sink positioned adjacent the disc of the NFT; a dielectric gap positioned adjacent the peg of the NFT at the ABS of the device; and a conformal diffusion barrier layer positioned between the write pole and the dielectric gap, the disc, and the heat sink, wherein the conformal diffusion barrier layer forms at least one angle that is not greater than 135°.

First claim

What is claimed is:

1. A device having an air bearing surface (ABS), the device comprising:
a write pole;
a near field transducer (NFT) comprising a peg and a disc, wherein the peg is at the ABS of the device;
a heat sink positioned adjacent the disc of the NFT;
a dielectric gap positioned adjacent the peg of the NFT at the ABS of the device;
a conformal diffusion barrier layer, wherein the conformal diffusion barrier layer forms at least one angle that is not greater than 135°; and
a peg coupler layer,
wherein the conformal diffusion barrier layer is positioned adjacent the write pole,
the peg coupler layer is positioned between the conformal diffusion barrier layer and the dielectric gap, the disc and the heat sink, and
the dielectric gap and the disc are positioned between the peg coupler layer and the heat sink and the peg.

2. The device according to claim 1 , wherein the conformal diffusion barrier layer comprises molybdenum (Mo), tantalum (Ta), niobium (Nb), hafnium (Hf), neodymium (Nd), holmium (Ho), molybdenum (Mo), tungsten (W), iridium (Ir), rhodium (Rh), ruthenium (Ru), rhenium (Re), titanium (Ti), zirconium (Zr), nickel (Ni), uranium (U), yttrium (Y), vanadium (V), or combinations thereof.

3. The device according to claim 1 , wherein the conformal diffusion barrier layer comprises ruthenium (Ru), iridium (Ir), tantalum (Ta), zirconium (Zr), niobium (Nb), hafnium (Hf), or combinations thereof.

4. The device according to claim 1 , wherein the conformal diffusion barrier layer comprises ruthenium (Ru), iridium (Ir), tantalum (Ta), zirconium (Zr), or combinations thereof.

5. The device according to claim 1 , wherein the conformal diffusion barrier layer is positioned directly adjacent the write pole.

6. The device according to claim 1 , wherein the conformal diffusion barrier layer has a thickness from about 5 nanometers (nm) to about 30 nm.

7. The device according to claim 1 wherein, the peg coupler layer comprises a material of the peg, the disc, the heat sink, or some combination thereof.

8. The device according to claim 1 , wherein the peg coupler layer comprises gold (Au) or an alloy thereof.

9. The device according to claim 1 , wherein the peg coupler layer has a thickness from about 8 nm to about 25 nm.

10. The device according to claim 1 further comprising an etch stop layer, the etch stop layer positioned adjacent the conformal diffusion barrier layer on the opposite side of the write pole.

11. The device according to claim 10 , wherein the etch stop layer comprises tantalum (Ta), titanium (Ti), chromium (Cr), tantalum nitride (TaN), titanium nitride (TiN), or combinations thereof.

12. A device having an air bearing surface (ABS), the device comprising:
a write pole;
a near field transducer (NFT) comprising a peg and a disc, wherein the peg is at the ABS of the device;
a heat sink positioned adjacent the disc of the NFT;
a dielectric gap positioned adjacent the peg of the NFT at the ABS of the device;
a conformal diffusion barrier layer, wherein the conformal diffusion barrier layer forms at least one angle that is not greater than 110° and comprises molybdenum (Mo), tantalum (Ta), niobium (Nb), hafnium (Hf), neodymium (Nd), holmium (Ho), molybdenum (Mo), tungsten (W), iridium (Ir), rhodium (Rh), ruthenium (Ru), rhenium (Re), titanium (Ti), zirconium (Zr), nickel (Ni), uranium (U), yttrium (Y), vanadium (V), or combinations thereof; and
a peg coupler layer,
wherein the conformal diffusion barrier layer is positioned adjacent the write pole,
the peg coupler layer is positioned between the conformal diffusion barrier layer and the dielectric gap, the disc and the heat sink, and
the dielectric gap and the disc are positioned between the peg coupler layer and the heat sink and the peg.

13. The device according to claim 12 , wherein the conformal diffusion barrier layer comprises zirconium (Zr), ruthenium (Ru), or combinations thereof.

14. The device according to claim 12 , wherein the NFT comprises gold (Au) or an alloy thereof.

15. The device according to claim 12 , wherein the conformal diffusion barrier has a thickness from about 5 nm to about 30 nm.

16. The device according to claim 12 wherein, the peg coupler layer comprises a material of the peg, the disc, the heat sink, or some combination thereof.

17. The device according to claim 12 further comprising an etch stop layer, the etch stop layer positioned adjacent the conformal diffusion barrier layer on the opposite side of the write pole.

18. A device having an air bearing surface (ABS), the device comprising:
a write pole;
a near field transducer (NFT) comprising a peg and a disc, wherein the peg is at the ABS of the device;
a heat sink positioned adjacent the disc of the NFT;
a dielectric gap positioned adjacent the peg of the NFT at the ABS of the device;
a conformal diffusion barrier layer, wherein the conformal diffusion barrier layer comprises rhenium (Re), vanadium (V), or combinations thereto; and
a peg coupler layer,
wherein the conformal diffusion barrier layer is positioned adjacent the write pole,
the peg coupler layer is positioned between the conformal diffusion barrier layer and the dielectric gap, the disc and the heat sink, and
the dielectric gap and the disc are positioned between the peg coupler layer and the heat sink and the peg.

19. The device according to claim 18 , wherein the conformal diffusion barrier layer forms at least one angle that is not greater than 160°.

20. The device according to claim 18 , wherein the conformal diffusion barrier layer has a thickness from about 8 nm to about 15 nm.

Assignees

• Seagate Technology Llc

Inventors

• Sahoo Sarbeswar
• Blaber Martin
• Brickner Hui
• Zhao Tong
• Cheng Yuhang
• Duda John
• Lee Tae-Woo

Classifications

• G11B5/40

  Protective measures on heads, e.g. against excessive temperature  (G11B5/31 takes precedence; protection against wear G11B5/255  {; protective structure of the head: see under structures, e.g. G11B5/3106}) · CPC title

• G11B5/1272

  Assembling or shaping of elements (G11B5/1278 takes precedence) · CPC title

• G11B5/6082 Primary

  Design of the air bearing surface · CPC title

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

• G11B5/3136

  for reducing the pole-tip-protrusion at the head transducing surface, e.g. caused by thermal expansion of dissimilar materials · CPC title