Sensor, filter element comprising a sensor and use of said type of filter element
US-2017217763-A1 · Aug 3, 2017 · US
US10189701B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10189701-B2 |
| Application number | US-201515500545-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 23, 2015 |
| Priority date | Aug 1, 2014 |
| Publication date | Jan 29, 2019 |
| Grant date | Jan 29, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A sensor has an electronic chip and a sensor chip which are arranged within a functional volume which is at the most 4-5 mm long, a maximum 2-3 mm wide, and with a maximum height of 0.5-0.8 mm, thereby provide a potentially economical filter element having a compact sensor.
Opening claim text (preview).
The invention claimed is: 1. A filter element, comprising: a main part; and a sensor, comprising: an electronic chip; and a sensor chip, wherein the electronic chip and sensor chip are arranged within a functional space which is at most 5 mm long, at most 3 mm wide, and at most 0.8 mm high, wherein the sensor is arranged on the main part, wherein the main part includes a filter medium including an upstream side and a downstream side, wherein the sensor chip is high-resolution such that a pressure differential between the upstream side and the downstream side in a range of from 10 to 500 Pa can be detected, and wherein the sensor chip has a resolution of 5 Pa.
between laterally-adjacent chips · CPC title
being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title
Bond wires · CPC title
Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title
the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.