Joining method, apparatus of manufacturing joined body, joined body, ink jet head unit, and ink jet type recording apparatus

US10189259B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10189259-B2
Application numberUS-201715671035-A
CountryUS
Kind codeB2
Filing dateAug 7, 2017
Priority dateFeb 27, 2014
Publication dateJan 29, 2019
Grant dateJan 29, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

First claim

Opening claim text (preview).

What is claimed is: 1. A joining method, comprising: applying a joining material to a transfer medium, the joining material joining a first member and a second member; increasing a viscosity of the joining material that applied to the transfer medium than the viscosity of the joining material in applying the joining material to the transfer medium; transferring the joining material to the first member; and joining the first member and the second member by the joining material that transferred to the first member. 2. A joining method according to claim 1 , wherein the joining material includes a thermosetting resin. 3. A joining method according to claim 2 , wherein increasing the viscosity of the joining material that applied to the transfer medium increases the viscosity of the joining material by applying a first heat to the joining material. 4. A joining method according to claim 3 , applying a second heat to set the joining material joined the first member and the second member. 5. A joining method according to claim 2 , wherein the joining material includes an addition-type silicone resin. 6. The joining method according to claim 5 , wherein the joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin. 7. The joining method according to claim 1 , wherein a portion of the first member, to which the joining material is applied, is adjacent to a portion having a tubular structure. 8. The joining method according to claim 1 , wherein a joined body is an ink jet head. 9. An apparatus of manufacturing a joined body, wherein the method according to claim 1 is executed. 10. A joined body that is manufactured using the manufacturing apparatus according to claim 9 . 11. The joined body according to claim 10 , wherein the joined body is an ink jet head. 12. An ink jet head unit, comprising: the joined body according to claim 11 . 13. An ink jet type recording apparatus, comprising: the ink jet head unit according to claim 12 . 14. A joined body that is manufactured using the joining method according to claim 1 . 15. The joined body according to claim 14 , wherein the joined body is an ink jet head. 16. An ink jet head unit, comprising: the joined body according to claim 15 . 17. An ink jet type recording apparatus, comprising: the ink jet head unit according to claim 16 .

Assignees

Inventors

Classifications

  • Polysiloxanes · CPC title

  • of stacked structure type, deformed by compression/extension and disposed on a diaphragm · CPC title

  • etching · CPC title

  • bonding and adhesion · CPC title

  • B41J2/1632Primary

    machining · CPC title

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Frequently asked questions

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What does patent US10189259B2 cover?
A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B41J2/1632. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 29 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).