Joining method, apparatus of manufacturing joined body, joined body, ink jet head unit, and ink jet type recording apparatus

US9789691B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9789691-B2
Application numberUS-201514632801-A
CountryUS
Kind codeB2
Filing dateFeb 26, 2015
Priority dateFeb 27, 2014
Publication dateOct 17, 2017
Grant dateOct 17, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

First claim

Opening claim text (preview).

What is claimed is: 1. A joining method, comprising: applying a joining material including a thermosetting resin to a film, the joining material joining a first member and a second member; applying a first heat to the joining material applied to the film; transferring the joining material applied the first heat to the first member; joining the first member and the second member by the joining material that transferred to the first member; and applying a second heat to set the joining material joined the first member and the second member, wherein the joining material includes an addition-type silicone resin. 2. The joining method according to claim 1 , wherein the joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin. 3. An apparatus of manufacturing a joined body, wherein the method according to claim 2 is executed. 4. A joined body that is manufactured using the manufacturing apparatus according to claim 3 . 5. A joined body that is manufactured using the joining method according to claim 2 . 6. The joining method according to claim 1 , wherein a joined body is an ink jet head. 7. An apparatus of manufacturing a joined body, wherein the method according to claim 6 is executed. 8. A joined body that is manufactured using the manufacturing apparatus according to claim 7 . 9. A joined body that is manufactured using the joining method according to claim 6 . 10. An apparatus of manufacturing a joined body, wherein the method according to claim 1 is executed. 11. A joined body that is manufactured using the manufacturing apparatus according to claim 10 . 12. The joined body according to claim 11 , wherein the joined body is an ink jet head. 13. A joined body that is manufactured using the joining method according to claim 1 . 14. The joined body according to claim 13 , wherein the joined body is an ink jet head. 15. An ink jet head unit, comprising: the joined body according to claim 14 . 16. An ink jet type recording apparatus, comprising: the ink jet head unit according to claim 15 . 17. A joined body that is manufactured using the manufacturing apparatus according to claim 1 . 18. A joining method according to claim 1 , wherein a viscosity of the joining material after the first heat is applied is higher than a viscosity of the joining material before the first heat is applied.

Assignees

Inventors

Classifications

  • of stacked structure type, deformed by compression/extension and disposed on a diaphragm · CPC title

  • B41J2/1632Primary

    machining · CPC title

  • etching · CPC title

  • Polysiloxanes · CPC title

  • bonding and adhesion · CPC title

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Frequently asked questions

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What does patent US9789691B2 cover?
A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B41J2/1632. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 17 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).