Method for obtaining a wavy layer locally suspended on a substrate using a deformation by formation of wrinkles

Patent metadata

Field	Value
Publication number	US-10183441-B2
Application number	US-201415028876-A
Country	US
Kind code	B2
Filing date	Oct 16, 2014
Priority date	Oct 17, 2013
Publication date	Jan 22, 2019
Grant date	Jan 22, 2019

Abstract

A method forming an elastic undulated layer locally lying on a substrate from a structure including a strained elastic layer on a foundation in a solid state present at a surface of a rigid substrate, the method including: melting a foundation for a duration of at least 50 ns, the foundation thickness being at least 20 nm and lower than a predetermined thickness corresponding to a theoretical peak-to-peak amplitude of wrinkles, the melting generating a simultaneous deformation, by forming wrinkles, of the elastic layer and the foundation and accompanied by localized adherent contact between the elastic layer and the rigid substrate in zones separating regions of the foundation; solidifying the foundation to bring it back to the solid state; removing the foundation brought back to the solid state to suspend a layer above the substrate outside the zones of localized adherent contact, the suspended layer being undulated in accordance with the wrinkles.

First claim

The invention claimed is:

1. A method for forming an elastic undulated layer locally lying on a substrate from a structure including a strained elastic layer on a foundation in a solid state present at a surface of a rigid substrate, the foundation made of a material other than a polymeric material, the method comprising:
melting the foundation to bring the foundation to a liquid state for a duration higher than or equal to 50 ns, thickness of the foundation being at least 20 nm and lower than a predetermined thickness corresponding to a theoretical peak-to-peak amplitude of wrinkles, the melting resulting in a stress relaxation of the elastic layer which generates a simultaneous deformation, by formation of wrinkles, of the elastic layer and of the foundation, the formation of the wrinkles separating regions of the foundation between zones of localized adherent contact between the elastic layer and the rigid substrate;
solidifying the foundation to bring the foundation back to the solid state, the solidification forming a solid structure having wrinkles at the surface; and
removing the separated regions of the foundation brought back to the solid state to suspend a layer above the substrate outside of the zones of localized adherent contact, the suspended layer being undulated in accordance with the wrinkles at the surface of the solid structure, said removing being made by chemical etching of the foundation, said chemical etching being selective with respect to the rigid substrate and with respect to the undulated suspended layer being in adherent contact with the rigid substrate at the zones of localized adherent contact such that the rigid substrate and the undulated suspended layer are not removed by the chemical etching.

2. The method according to claim 1 , wherein the melting is made by a selective energy supply by which energy is absorbed by at least part of the foundation rather than by the elastic layer with a ratio of 100/1.

3. The method according to claim 1 , wherein the melting is made by a selective energy supply by which energy is absorbed by at least part of the foundation rather than by the elastic layer with a ratio of 1000/1.

4. The method according to claim 1 , wherein the duration of each of the melting and solidification is lower than 1 microsecond.

5. The method according to claim 1 , wherein the duration of each of the melting and solidification is lower than 1 second.

6. The method according to claim 1 , wherein the rigid substrate comprises a thermally insulating superficial layer.

7. The method according to claim 1 , wherein the foundation is electrically conducting and inserted between electrically insulating materials, and the melting of at least one part of the foundation is made by a thermal energy supply making use of joule effect.

8. The method according to claim 1 , wherein the foundation is inserted between electrically insulating materials and has a resistivity higher than that of the electrically insulating materials, the melting of at least one part of the foundation is made by a thermal energy supply making use of a resistive heating.

9. The method according to claim 1 , wherein the melting and solidification are reiterated before the removing the foundation brought back to the solid state, to gradually increase at each reiteration an amplitude of the wrinkles and an interval between the separated regions of the foundation without reaching a yield point of the strained elastic layer.

10. The method according to claim 1 , wherein the suspended layer is formed by the elastic layer.

11. The method according to claim 1 , further comprising, after solidifying the foundation and before removing the foundation, removing the elastic layer and depositing a new layer at the surface of the solid structure, so that, after said removing of the foundation, the new layer forms the suspended layer.

12. The method according to claim 1 , wherein the elastic layer initially has a stress having a discontinuity in the plane of the layer.

13. The method according to claim 12 , further comprising creating patterns at the surface of the elastic layer and/or of the foundation to induce the discontinuity.

Assignees

• Commissariat Energie Atomique
• Commissariat Energie Atomique

Inventors

• Benaissa Lamine
• Moulet Jean-Sebastien

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H01L41/1132

  Electricity · mapped topic

• C03B23/02

  Re-forming glass sheets · CPC title

• H01L21/3105

  Electricity · mapped topic