Printed wiring board and method of producing the same

Patent metadata

Field	Value
Publication number	US-10178758-B2
Application number	US-201514951606-A
Country	US
Kind code	B2
Filing date	Nov 25, 2015
Priority date	Nov 28, 2014
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. A plurality of open stub EBG structures are disposed at an end of a bridge section in a power supply plane. The open stub EBG structure is an open stub state whose one end is connected to the power supply path and other end is in an open state.

First claim

What is claimed is:

1. A printed wiring board comprising:
a digital circuit;
an analog circuit;
a power supply path disposed on an insulating layer between the digital circuit and the analog circuit; and
a plurality of open stub electromagnetic band gap structures disposed on the insulating layer, on which the power supply path is disposed, at an end of a bridge section in a power supply plane,
wherein each of the plurality of open stub electromagnetic band gap structures comprises one end connected to the power supply path, and another end in an open state, and
wherein each of the plurality of open stub electromagnetic band gap structures does not have a via connected to another layer.

2. The printed wiring board according to claim 1 , wherein
the analog circuit is relatively smaller than the digital circuit, and
a slit is formed between the analog circuit and the power supply path to electrically insulate the analog circuit from the power supply path, and a slit is formed between the open stub electromagnetic band gap structures and a peripheral circuit to electrically insulate the open stub electromagnetic band gap structures from the peripheral circuit.

3. The printed wiring board according to claim 1 , wherein
the plurality of the open stub electromagnetic band gap structures are disposed on the insulating layer around the analog circuit so as to surround the analog circuit.

4. The printed wiring board according to claim 1 , wherein
the plurality of the open stub electromagnetic band gap structures are disposed on the insulating layer adjacent to the power supply path.

5. The printed wiring board according to claim 1 , further comprising:
a connector section connected to an external power supply; and
a power supply circuit electrically connecting the connector section to the digital circuit or the analog circuit,
wherein the plurality of open stub electromagnetic band gap structures are disposed on the insulating layer in the vicinity of the connector section.

6. The printed wiring board according to claim 1 , wherein
a plurality of the open stub electromagnetic band gap structures have a different length in accordance with a corresponding cutoff frequency.

7. The printed wiring board according to claim 1 , wherein
a magnetic body film is formed in an area of the open stub electromagnetic band gap structures.

8. The printed wiring board according to claim 7 , wherein
the magnetic body film has a thickness of 0.2 to 20 μm.

9. The printed wiring board according to claim 1 , wherein
each open stub electromagnetic band gap structure has a spiral shape, and the other end of each open stub electromagnetic band gap structure in the open state is positioned at the center of the spiral shape or adjacent to the center of the spiral shape.

10. The printed wiring board according to claim 7 , wherein
the magnetic body film is a thin ferrite plating film.

11. The printed wiring board according to claim 7 , wherein
the magnetic body film is formed on an open stub electromagnetic band gap.

12. The printed wiring board according to claim 5 , wherein
the plurality of the open stub electromagnetic band gap structures are disposed on the insulating layer between the power supply circuit and the digital circuit.

13. A method of producing a printed wiring board comprising:
forming a power supply path disposed on an insulating layer between a digital circuit and an analog circuit;
forming a plurality of open stub electromagnetic band gap structures on the insulating layer, on which the power supply path is disposed, at an end of a bridge section in a power supply plane by disposing an open stub comprising one end connected to the power supply path and another end in an open state; and
forming a magnetic body film on the open stub electromagnetic band gap structure,
wherein each of the plurality of open stub electromagnetic band gap structures do not have a via connected to another layer.

Assignees

• Nat Univ Corporation Okayama Univ
• Kyocera Circuit Solutions Inc
• Kyocera Corp

Inventors

• Toyota Yoshitaka
• Iokibe Kengo
• Yamashita Yuki
• Kaneko Toshiyuki
• Naito Masanori
• Kaiya Kiyohiko
• Uehara Toshihisa
• Kondo Koichi

Classifications

• H05K2201/083

  Magnetic materials · CPC title

• H05K1/0236 Primary

  Electromagnetic band-gap structures · CPC title

• H05K1/0262

  Arrangements for regulating voltages or for using plural voltages · CPC title