Circuit board module and electronic device

Patent metadata

Field	Value
Publication number	US-10178754-B2
Application number	US-201815962207-A
Country	US
Kind code	B2
Filing date	Apr 25, 2018
Priority date	Apr 25, 2017
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

First claim

The invention claimed is:

1. A circuit board module comprising:
a first electronic component of a surface mounting type;
a second electronic component of an insertion mounting type comprising a lead terminal;
a circuit board which has a penetrating hole into which the lead terminal is inserted, and on which the first electronic component and the second electronic component are mounted; and
a heat transfer body provided in the circuit board,
wherein the first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction of the circuit board,
wherein the heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board,
wherein the second electronic component is mounted on a back surface of the circuit board by inserting the lead terminal into the penetrating hole from the back surface side of the circuit board, and
wherein the second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

2. The circuit board module according to claim 1 ,
wherein the heat transfer body comprises a metal core buried in the circuit board and is thermally connected to the first electronic component on the front surface side of the circuit board.

3. The circuit board module according to claim 1 ,
wherein the penetrating hole has a through hole provided at a position apart from the heat transfer body of the circuit board, and
wherein the lead terminal of the second electronic component is electrically connected to the circuit board in a state of being inserted into the through hole.

4. An electronic device comprising:
the circuit board module according to claim 1 ; and
the heat radiation body provided on the back surface side of the circuit board.

5. The electronic device according to claim 4 ,
wherein the heat radiation body comprises:
a projected thermal connection portion which protrudes toward the circuit board and is thermally connected to the heat transfer body; and
a recessed thermal connection portion which is recessed apart from the circuit board, into which a main body portion of the second electronic component is fitted, and which is thermally connected to the main body portion.

6. The electronic device according to claim 4 , further comprising:
a case which houses the circuit board, the first electronic component, the second electronic component, and the heat transfer body; and
a cooler that is installed on the case and cools the heat radiation body,
wherein the heat radiation body comprises a heat sink comprising a heat radiation fin, and is provided on the case so as to be disposed on the back surface side of the circuit board.

Assignees

• Kobayashi Ryo
• Kobayashi Tomoyoshi
• Omron Automotive Electronics

Inventors

• Kobayashi Ryo
• Kobayashi Tomoyoshi

Classifications

• H05K1/184

  associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes · CPC title

• H05K2201/10628

  Leaded surface mounted device · CPC title

• H05K7/20445

  the coupling element being an additional piece, e.g. thermal standoff · CPC title

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H05K2201/10166

  Transistor · CPC title