Power supply device

Patent metadata

Field	Value
Publication number	US-9445525-B2
Application number	US-201414477401-A
Country	US
Kind code	B2
Filing date	Sep 4, 2014
Priority date	Sep 6, 2013
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

In a power supply device 1 , a first space R 1 and a second space R 2 are delimited, a coil component 20 is arranged in the first space R 1 , and heat-generating components and components having weak resistance to heat are arranged in the second space R 2 . The power supply device 1 is configured to contain the coil component 20 in the first space R 1 so that ambient air of the coil component 20 can contact a first side wall 72 , which constitutes the first space R 1 , making it possible to expect discharge of heat to coolant in a coolant channel W via the first side wall 72 . Therefore, heat can be discharged from the ambient air of the coil component, the temperature of which has been raised by heat generation, towards the coolant efficiently.

First claim

What is claimed is:

1. A power supply device comprising:
a housing having a first bottom surface, a first side wall extending upwards from a peripheral edge of the first bottom surface, a second bottom surface provided on the first side wall above the first bottom surface, a second side wall extending upwards from a peripheral edge of the second bottom surface, and a coolant channel provided below the second bottom surface so that coolant flows through the coolant channel;
a main substrate contained in an interior of the housing, wherein electronic components are provided on a first main surface and a part of a second main surface, which is opposite the first main surface, is arranged on the second bottom surface of the housing while facing the second bottom surface; and
a coil component contained in the interior of the housing and electrically connected to the main substrate, wherein
the interior of the housing is delimited into a first space surrounded by the first bottom surface and the first side wall, and a second space provided above the first space and surrounded by the second bottom surface and the second side wall,
the coil component is arranged in the first space,
the electronic components provided on the first main surface of the main substrate are arranged in the second spacer, and
the coolant channel is provided along the first side wall above the first bottom surface.

2. The power supply device according to claim 1 , wherein the first space and the second space are delimited by the main substrate.

3. The power supply device according to claim 1 , wherein the first space and the second space are delimited by a heat shield plate, and
the main substrate is arranged on a side of the second space.

4. The power supply device according to claim 1 , wherein the electronic components are heat-generating components and components having weak resistance to heat.

5. The power supply device according to claim 3 , wherein the heat shield plate is provided at the substantially same height as the second bottom surface or below the second bottom surface.

6. The power supply device according to claim 3 , wherein the heat shield plate has an opening near its peripheral edge so that a connection member, which connects the coil component and the main substrate, extends through the opening.

7. The power supply device according to claim 3 , wherein the heat shield plate has a pressing member on its lower surface side to fix the coil component.

8. The power supply device according to claim 1 , wherein lower surfaces of the electronic components provided on the first main surface of the main substrate are arranged on the second bottom surface of the housing so that heat is discharged to the coolant channel.

9. The power supply device according to claim 5 , wherein the heat shield plate has an opening near its peripheral edge so that a connection member, which connects the coil component and the main substrate, extends through the opening.

10. A power supply device comprising: a housing including a base plate, the base plate having a first bottom surface, a first side wall extending upwards from a peripheral edge of the first bottom surface, a second bottom surface provided on the first side wall above the first bottom surface, a second side wall extending upwards from a peripheral edge of the second bottom surface, and a coolant channel provided below the second bottom surface so that coolant flows through the coolant channel; a main substrate contained in an interior of the housing, wherein electronic components are provided on a first main surface and a part of a second main surface, which is opposite the first main surface, is arranged on the second bottom surface of the housing while facing the second bottom surface; and a coil component contained in the interior of the housing and electrically connected to the main substrate, wherein the interior of the housing is delimited into a first space surrounded by the first bottom surface and the first side wall, and a second space provided above the first space and surrounded by the second bottom surface and the second side wall, the coil component is arranged in the first space, the electronic components provided on the first main surface of the main substrate are arranged in the second space, and lower surfaces of the electronic components provided on the first main surface of the main substrate are thermally connected to a metal abutting portion of the base plate which abuts the electronic components and an end portion of which is part of the second side wall, and heat from the electronic components is discharged to the coolant channel via the abutting portion, and wherein the coolant channel is provided along the first side wall above the first bottom surface.

11. The power supply device according to claim 10 , wherein the first space and the second space are delimited by the main substrate.

12. The power supply device according to claim 10 , wherein the first space and the second space are delimited by a heat shield plate, and
the main substrate is arranged on a side of the second space.

13. The power supply device according to claim 10 , wherein the electronic components are heat-generating components and components having weak resistance to heat.

14. The power supply device according to claim 12 , wherein the heat shield plate is provided at the substantially same height as the second bottom surface or below the second bottom surface.

15. The power supply device according to claim 12 , wherein the heat shield plate has an opening near its peripheral edge so that a connection member, which connects the coil component and the main substrate, extends through the opening.

16. The power supply device according to claim 12 , wherein the heat shield plate has a pressing member on its lower surface side to fix the coil component.

17. The power supply device according to claim 14 , wherein the heat shield plate has an opening near its peripheral edge so that a connection member, which connects the coil component and the main substrate, extends through the opening.

Assignees

• Tdk Corp

Inventors

• Hara Yasuhiro
• Nakahori Wataru
• Miyazaki Hiroshi
• Sanae Haruhiko

Classifications

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/209

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title