Board terminal and board connector

Patent metadata

Field	Value
Publication number	US-10177478-B2
Application number	US-201415030072-A
Country	US
Kind code	B2
Filing date	Oct 22, 2014
Priority date	Nov 11, 2013
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

A board terminal 1 includes a base material 11 made of a metal material and a plating film 12 covering a surface of the base material 11. The plating film 12 includes an outermost layer 120 having a Sn mother phase 120 a and Sn—Pd-based alloy phases 120 b dispersed in the Sn mother phase 120 a, the Sn mother phase 120 a and the Sn—Pd-based alloy phases 120 b being present on an outer surface. A Pd content in the outermost layer 120 is not more than 7 atomic %. A board connector 2 includes the board terminal 1 and a housing 20 for holding the board terminal 1.

First claim

The invention claimed is:

1. A board terminal, comprising:
a base material made of a metal material; and
a plating film covering a surface of the base material;
wherein:
the plating film includes an outermost layer having a Sn mother phase and Sn-Pd-based alloy phases dispersed in the Sn mother phase, the Sn mother phase and the Sn-Pd-based alloy phases being present on an outer surface;
the outermost layer has a Pd content of not more than 7 atomic %, and
the outermost layer is in contact with an inner layer having a double layer structure composed of a Ni layer in contact with the base material and a Ni-Sn alloy layer in contact with the Ni layer or is in contact with the base material.

2. A board terminal according to claim 1 , wherein:
the base material has a fracture surface formed during processing into a terminal shape; and
the plating film covers the surface of the base material including the fracture surface.

3. A board terminal according to claim 1 , wherein the base material is Cu or Cu alloy.

4. A board terminal according to claim 1 , wherein an area ratio of the Sn-Pd alloy phases occupying the outer surface of the outermost layer is not less than 10% and not more than 80%.

5. A board connector, comprising:
a board terminal according to claim 1 ; and
a housing for holding the board terminal.

6. A board connector according to claim 5 , wherein the board terminal is used by being mounted on a printed circuit board by solder bonding.

7. A board terminal, comprising:
a base material made of a metal material; and
a plating film covering a surface of the base material, the plating film including an inner layer having a double layer structure composed of a Ni layer in contact with the base material and a Ni-Sn alloy layer in contact with the Ni layer or is in contact with the base material and an outermost layer in contact with the inner layer and having a Sn mother phase and Sn-Pd-based alloy phases dispersed in the Sn mother phase, the Sn mother phase and the Sn-Pd-based alloy phases being present on an outer surface of the outermost layer so that an area ratio of Sn-Pd alloy phases occupying the outer surface is not less than 10% and not more than 80%;
wherein:
the outermost layer is formed by performing a reflow process after a Pd plating layer having a thickness of not smaller than 10 nm and smaller than 20 nm and a Sn plating layer having a thickness of not smaller than 1 μm and not larger than 2μm are successively formed,
the outermost layer has a Pd content of not more than 7 atomic %.

8. A board terminal according to claim 7 , wherein:
the base material has a fracture surface formed during processing into a terminal shape; and
the plating film covers the surface of the base material including the fracture surface.

9. A board terminal according to claim 7 , wherein the base material is Cu or Cu alloy.

Assignees

• Autonetworks Technologies Ltd
• Sumitomo Wiring Systems
• Sumitomo Electric Industries

Inventors

• Watanabe Hajime
• Saitoh Yasushi
• Saka Yoshifumi

Classifications

• H01R12/58

  terminals for insertion into holes · CPC title

• H01R12/716

  Coupling device provided on the PCB · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• Y10T428/24917

  including metal layer · CPC title

• Y10T428/12708

  Sn-base component · CPC title