Method for producing surface discharge electrodes and semifinished product for carrying out the method

US10177367B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10177367-B2
Application numberUS-201515510061-A
CountryUS
Kind codeB2
Filing dateSep 7, 2015
Priority dateSep 9, 2014
Publication dateJan 8, 2019
Grant dateJan 8, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Method for producing metallic surface discharge electrodes on nonmetallic substrates comprising the following steps: a) producing a metallic seed layer on a substrate; b) electrically contacting the seed layer with a metal wire network and an electrolyte containing metal ions; c) electrodepositing a metal film from the electrolyte at least on the seed layer, with the metal wire network being embedded into the metal film, wherein d) metal wire filaments that are movable relative to one another are arranged to form an electrically percolating metal wire network, e) the arrangement of the metal wire filaments is cast into a gel and the gel is dried thereafter to the gel matrix, and f) the dried gel matrix with the metal wire network embedded therein is applied to the substrate and is wetted with a solvent of the gel matrix. Furthermore, the invention relates to a semifinished product for carrying out the method.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for the production of metallic surface discharge electrodes on non-metallic substrates with the steps a. producing a metallic seed layer on a substrate; b. electrically contacting the seed layer with a metal wire network and an electrolyte containing metal ions; and c. electrodepositing a metal film from the electrolyte at least on the seed layer, with the metal wire network being embedded into the metal film, wherein electrically contacting the seed layer with the metal wire network comprises: d. arranging metal wire filaments that are movable relative to one another are arranged to form an electrically percolating metal wire network; e. casting the metal wire into a gel; and f. drying the gel with the arrangement of metal wire filaments to form a gel matrix, wherein the dried gel matrix with the metal wire network embedded therein is applied to the seed layer on the substrate and is wetted with a solvent of the gel matrix. 2. The method of claim 1 , wherein the arrangement of metal wire filaments is randomized by pouring onto a flat surface. 3. The method according to claim 1 , wherein the metal wire filaments have lengths in the range of from 2 mm to 1 cm. 4. The method according to claim 1 , wherein the diameter of the metal wire filaments is in the range of from 50 to 500 microns. 5. The method according to claim 1 , characterized by a storage or transport step between the steps e. and f. 6. The method according to claim 1 , wherein chemical substances are mixed into the gel matrix/the gel, which upon contact with the substrate and in the presence of a reaction activator carry out a chemical deposition of the seed layer on the substrate. 7. The method according to claim 1 , wherein the substrate is made of silicon exhibiting an array of parallel, upright nanowires, wherein the dried gel matrix with the metal wire filaments is applied on the free ends of the nanowires. 8. The method according to claim 7 , wherein said method is used for producing electrodes for lithium-ion batteries. 9. The method according to claim 1 , wherein the metal wire filaments have lengths in the range of from 5-9 mm. 10. The method according to claim 1 , wherein the diameter of the metal wire filaments is in the range of from 100 to 200 micrometers.

Assignees

Inventors

Classifications

  • using reducing agents · CPC title

  • Electroplating of selected surface areas · CPC title

  • Wires · CPC title

  • of copper · CPC title

  • of electrodes based on metals, Si or alloys · CPC title

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What does patent US10177367B2 cover?
Method for producing metallic surface discharge electrodes on nonmetallic substrates comprising the following steps: a) producing a metallic seed layer on a substrate; b) electrically contacting the seed layer with a metal wire network and an electrolyte containing metal ions; c) electrodepositing a metal film from the electrolyte at least on the seed layer, with the metal wire network being em…
Who is the assignee on this patent?
Univ Kiel Christian Albrechts
What technology area does this patent fall under?
Primary CPC classification H01M4/0452. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 08 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).