Semiconductor device and method
US-2024395867-A1 · Nov 28, 2024 · US
US10176987B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10176987-B2 |
| Application number | US-201715587258-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 4, 2017 |
| Priority date | Jun 19, 2012 |
| Publication date | Jan 8, 2019 |
| Grant date | Jan 8, 2019 |
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A SiC epitaxial wafer including: a SiC epitaxial layer that is formed on a SiC substrate having an off angle, wherein the surface density of triangular defects, in which a distance from a starting point to an opposite side in a horizontal direction is equal to or greater than (a thickness of the SiC epitaxial layer/tan(x))×90% and equal to or less than (the thickness of the SiC epitaxial layer/tan(x))×110%, in the SiC epitaxial layer is in the range of 0.05 pieces/cm 2 to 0.5 pieces/cm 2 (where x indicates the off angle).
Opening claim text (preview).
The invention claimed is: 1. A SiC epitaxial wafer comprising: a SiC epitaxial layer that is formed on a SiC substrate having an off angle, wherein a surface density of triangular defects, in which a distance from a starting point to an opposite side in a horizontal direction is equal to or greater than (a thickness of the SiC epitaxial layer/tan(x))×90% and equal to or less than (the thickness of the SiC epitaxial layer/tan(x))×110%, in the SiC epitaxial layer is in the range of 0.05 pieces/cm 2 to 0.5 pieces/cm 2 (where x indicates the off angle), and wherein the surface density of triangular defects with a starting point size of less than 20 μm is equal to or less than 0.05 pieces/cm 2 . 2. The SiC epitaxial wafer according to claim 1 , wherein the surface density of triangular defects including a piece of a member which is placed in a SiC-CVD furnace as a starting point in the SiC epitaxial layer is equal to or less than 0.5 pieces/cm 2 . 3. The SiC epitaxial wafer according to claim 2 , wherein the piece of the member as the starting point is made of one of carbon and silicon carbide.
Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title
N-type · CPC title
Crystal orientations · CPC title
Silicon carbide · CPC title
Silicon carbide · CPC title
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