Warpage control in package-on-package structures

Patent metadata

Field	Value
Publication number	US-9559064-B2
Application number	US-201314096456-A
Country	US
Kind code	B2
Filing date	Dec 4, 2013
Priority date	Dec 4, 2013
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate.

First claim

What is claimed is:

1. A package comprising:
a bottom package comprising:
a package substrate; and
a device die over and bonded to the package substrate;

a metal-particle-containing compound material over a top surface of the device die;
a rigid plate over and contacting the metal-particle-containing compound material;
a molding compound over the package substrate, wherein an entirety of the molding compound is lower than a top surface of the device die; and
a top package bonded to the bottom package through solder regions penetrating through the molding compound.

2. The package of claim 1 , wherein the metal-particle-containing compound material has a top-view area smaller than a top-view area of the device die, and wherein lower portions of the metal-particle-containing compound material have top-view areas greater than top-view areas of upper portions of the metal-particle-containing compound material.

3. The package of claim 1 , wherein the metal-particle-containing compound material comprises a rounded top corner.

4. The package of claim 1 , wherein the metal-particle-containing compound material and the molding compound comprise different materials.

5. The package of claim 1 , wherein the rigid plate comprises a non-metal plate.

6. The package of claim 1 , wherein the rigid plate comprises ceramic.

7. The package of claim 1 , wherein the metal-particle-containing compound material is spaced apart from a bottom surface of the top package by a space.

8. A method comprising:
bonding a device die over a package substrate;
applying a metal-containing paste over a top surface of the device die;
placing a rigid non-metal plate over and contacting the metal-containing paste;
curing the metal-containing paste; and
after curing the metal-containing paste, molding the device die in a molding compound, wherein the molding compound includes a portion overlying the package substrate, with a top surface of the device die exposed through the molding compound, wherein an entirety of the molding compound is lower than the top surface of the device die.

9. The method of claim 8 further comprising:
after the molding the device die, bonding a top package to a bottom package, wherein the bottom package comprises the package substrate, the device die, the metal-containing paste, and the molding compound.

10. The method of claim 8 , wherein the applying the metal-containing paste comprises applying a copper paste, wherein the copper paste comprises copper particles therein.

11. The method of claim 8 , wherein the placing the rigid non-metal plate comprises placing a ceramic plate.

12. A package comprising:
a bottom package comprising:
a package substrate; and
a device die over and bonded to the package substrate;

a metal-particle-containing compound material over a top surface of the device die, wherein the metal-particle-containing compound material comprises metal particles mixed in an adhesive;
a rigid plate over and contacting the metal-particle-containing compound material;
a molding compound over the package substrate and molding a lower portion of the device die therein, wherein all top surfaces of the molding compound are lower than a top surface of the device die; and
a top package bonded to the bottom package through solder regions penetrating through the molding compound.

13. The package of claim 12 , wherein the metal-particle-containing compound material has a top-view area smaller than a top-view area of the device die, and wherein lower portions of the metal-particle-containing compound material have top-view areas greater than top-view areas of upper portions of the metal-particle-containing compound material.

14. The package of claim 12 , wherein the metal-particle-containing compound material comprises a rounded top corner.

15. The package of claim 12 , wherein the metal-particle-containing compound material and the molding compound comprise different materials.

16. The package of claim 12 , wherein the rigid plate comprises a non-metal plate.

17. The package of claim 12 , wherein the rigid plate comprises ceramic.

18. The package of claim 12 , wherein the rigid plate comprises a metal plate.

19. The package of claim 12 , wherein the metal-particle-containing compound material is spaced apart from a bottom surface of the top package by a space.

20. The package of claim 12 , wherein the rigid plate extends laterally beyond a point where a respective edge of the metal-particle-containing compound material joins the rigid plate.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Wei-Yu
• Hu Yu-Hsiang (James)
• Lin Wei-Hung
• Cheng Ming-Da
• Liu Chung-Shi

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title