Method for metalizing vias

Patent metadata

Field	Value
Publication number	US-10165681-B2
Application number	US-201314416916-A
Country	US
Kind code	B2
Filing date	Jul 26, 2013
Priority date	Jul 30, 2012
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

First claim

It is claimed:

1. A method for producing an electric via in a circuit board, comprising the steps of:
mixing an oil, an electrically conductive material and a filler to form a paste, wherein the electrically conductive material comprises copper particles;
introducing the paste into a hole of a circuit board; and
curing the paste under the effect of heat;
wherein while curing, the filler increases in volume such that a volume shrinkage of the electrically conductive material is compensated by the curing under the effect of heat;
wherein the filler comprises a swelling non-metal clay which swells under the effect of heat and thus increases in volume during the curing step and from 1 to 10 wt. % of an elemental form of at least one member selected from the group consisting of aluminum, titanium and zirconium;
an adhesive; and
further comprising a step of nitrating the clay, wherein the nitrating is provided by burning-in at a temperature between 800 and 1000° C. under a nitrogen atmosphere, wherein the clay increases in volume during nitration.

2. A method according to claim 1 , wherein the circuit board comprises a ceramic.

3. A method according to claim 1 , wherein the filler constitutes 2-25% by weight, of the overall mass of the paste.

4. A method according to claim 1 , wherein the filler comprises aluminum.

5. A method according to claim 1 , wherein the filler comprises a swelling non-metal which swells as under the effect of heat and thus experience an increase in volume during curing.

6. A method according to claim 1 , wherein the clay comprises bentonite.

7. A method according to claim 1 , wherein the circuit board comprises a ceramic, and wherein the clay is selected in such a way that they have an affinity to the ceramic of the circuit board.

8. A method according to claim 1 , wherein the clay comprises at least one member selected from the group consisting of bentonite and montmorillonite.

9. A method according to claim 1 , wherein the paste further comprises an adhesion-promoting substance which enhance the affinity of the paste or the metallization to the substrate of the circuit board, wherein the adhesion promoting substance is selected from the group consisting of an oxide and CuCl.

10. A method according to claim 9 , wherein the adhesion-promoting substance is an oxide selected from the group consisting of ZnO, SiO 2 , CaO, TiO 2 and B 2 O 3 .

11. A method according to claim 9 , wherein the adhesion promoting substance is CuCl.

12. A method according to claim 1 , wherein the paste is introduced by means of a screen printing method.

13. A circuit board with the via prepared according to the process the method according to claim 1 , comprising the electrically conductive material and the filler, wherein the metallization hermetically seals a hole in the circuit board.

14. A circuit board according to claim 13 , wherein the helium leak test according to DIN EN 1779:1999 results in values of less than 10 −7 mbar/l*sec for the via.

15. The method of claim 1 , wherein the oil comprises a thixotropic oil and an oil for screen printing medium.

16. A method for producing electric vias in a circuit board, comprising the steps of:
mixing an oil, an electrically conductive material and a filler to form a paste, wherein the electrically conductive material comprises copper particles;
introducing the paste into a hole of a circuit board; and
curing the paste with heat;
wherein while curing, the filler increases in volume such that a volume shrinkage of the electrically conductive material is compensated by the curing under the effect of heat;
wherein the filler comprises a swelling non-metal comprises a clay, wherein said clay which swells under the effect of heat and thus experiences an increase in volume during the curing step;
wherein the filler further comprises at least one metal selected from the group consisting of aluminum, titanium and zirconium; and
wherein the metal is nitrated under a nitrogen atmosphere; and
further comprising a step of nitrating the clay, wherein the nitrating is provided by burning-in at a temperature between 800 and 1000° C. under a nitrogen atmosphere, wherein the clay increases in volume during nitration.

17. The method of claim 16 , wherein the oil comprises a thixotropic oil and an oil for screen printing medium.

18. A method for producing electric vias in a circuit board, comprising the steps of:
mixing of a paste;
introducing the paste into a hole of a circuit board; and
curing the paste under the effect of heat;
wherein the paste consists of an oil, an electrically conductive material, an adhesion promoting substance, an adhesive glass and a filler, wherein the electrically conductive material comprises copper particles,
wherein while curing, the filler increases in volume such that a volume shrinkage of the electrically conductive material is compensated by the curing under the effect of heat;
wherein the filler comprises a swelling non-metal comprises a clay, and an elemental metal;
wherein the adhesive promoting substance is an oxide
wherein said clay which swells under the effect of heat and thus experiences an increase in volume during the curing step; and
wherein the filler further comprises a nitrated elemental form of at least one member selected from the group consisting of aluminum, titanium and zirconium; and
further comprising a step of nitrating the clay, wherein the nitrating is provided by burning-in at a temperature between 800 and 1000° C. under a nitrogen atmosphere, wherein the clay increases in volume during nitration.

19. The method of claim 18 , wherein the oil comprises a thixotropic oil and an oil for screen printing medium.

Assignees

• Ceram Gmbh

Inventors

• Thimm Alfred
• Herrmann Klaus

Classifications

• C04B2111/00844

  for electronic applications · CPC title

• H05K3/42 Primary

  Plated through-holes {or plated via connections} · CPC title

• C04B41/88

  Metals · CPC title

• H01B1/16

  the conductive material comprising metals or alloys · CPC title

• C04B41/5127

  Cu, e.g. Cu-CuO eutectic · CPC title