Via structures for solar cell interconnection in solar module
US-2017084766-A1 · Mar 23, 2017 · US
US10164127B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10164127-B2 |
| Application number | US-201615346444-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 8, 2016 |
| Priority date | Jan 11, 2013 |
| Publication date | Dec 25, 2018 |
| Grant date | Dec 25, 2018 |
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One embodiment of the present invention provides a solar module. The solar module includes a front-side cover, a back-side cover, and a plurality of solar cells situated between the front- and back-side covers. A respective solar cell includes a multi-layer semiconductor structure, a front-side electrode situated above the multi-layer semiconductor structure, and a back-side electrode situated below the multi-layer semiconductor structure. Each of the front-side and the back-side electrodes comprises a metal grid. A respective metal grid comprises a plurality of finger lines and a single busbar coupled to the finger lines. The single busbar is configured to collect current from the finger lines.
Opening claim text (preview).
What is claimed is: 1. A bi-facial photovoltaic structure, comprising: a first electrode grid positioned on a first surface of a multilayer body; and a second electrode grid positioned on a second surface of the multilayer body; wherein each of the electrode grids comprises a plurality of finger lines that are aligned substantially parallel to each other and includes only a single busbar that is substantially perpendicular to the finger lines; wherein a first single busbar of the first electrode grid is positioned substantially near a center of the first surface; and wherein a second single busbar of the second electrode grid is positioned substantially near a center of the second surface. 2. The photovoltaic structure of claim 1 , wherein a respective electrode grid comprises a Cu grid formed using an electroplating technique. 3. The photovoltaic structure of claim 2 , wherein the Cu grid is coated with a protective layer comprising Ag or Sn. 4. The photovoltaic structure of claim 2 , wherein the electrode grid further comprises a Cu seed layer formed using a physical vapor deposition technique. 5. The photovoltaic structure of claim 1 , wherein a width of the single busbar is between 0.5 and 3 mm. 6. A solar module, comprising: a first cover; a second cover; and a plurality of bi-facial photovoltaic structures positioned between the first and second covers, wherein a respective photovoltaic structure comprises: a multilayer body; a first electrode grid positioned on a first surface of a multilayer body; and a second electrode grid positioned on a second surface of the multilayer body; wherein each of the electrode grids comprises a plurality of finger lines that are aligned substantially parallel to each other and includes only a single busbar that is substantially perpendicular to the finger lines; wherein a first single busbar of the first electrode grid is positioned substantially near a center of the first surface; and wherein a second single busbar of the second electrode grid is positioned substantially near a center of the second surface. 7. The solar module of claim 6 , further comprising a stringing ribbon configured to couple the first single busbar of the first electrode grid of a first photovoltaic structure to the second single busbar of the second electrode grid of an adjacent photovoltaic structure, wherein a width of the stringing ribbon is substantially similar to a width of the single busbar. 8. The solar module of claim 6 , wherein a respective electrode grid comprises a Cu grid formed using an electroplating technique. 9. The solar module of claim 8 , wherein the Cu grid is coated with a protective layer comprising Ag or Sn. 10. The solar module of claim 8 , wherein the electrode grid further comprises a Cu seed layer formed using a physical vapor deposition technique. 11. The solar module of claim 6 , further comprising one or more maximum power point tracking (MPPT) integrated circuit (IC) chips.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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