Energy harvester
US-2015380590-A1 · Dec 31, 2015 · US
US9287431B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9287431-B2 |
| Application number | US-201414243320-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 2, 2014 |
| Priority date | Dec 10, 2012 |
| Publication date | Mar 15, 2016 |
| Grant date | Mar 15, 2016 |
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Voltage-matched thin film multijunction solar cell and methods of producing cells having upper CdTe pn junction layers formed on a transparent substrate which in the completed device is operatively positioned in a superstate configuration. The solar cell also includes a lower pn junction formed independently of the CdTe pn junction and an insulating layer between CdTe and lower pn junctions. The voltage-matched thin film multijunction solar cells further include a parallel connection between the CdTe pn junction and lower pn junctions to form a two-terminal photonic device. Methods of fabricating devices from independently produced upper CdTe junction layers and lower junction layers are also disclosed.
Opening claim text (preview).
What is claimed is: 1. A voltage-matched multijunction solar cell comprising: a CdTe pn junction layer comprising a CdTe upper sub-cell; a lower pn junction layer comprising a lower sub-cell; a transparent insulating layer positioned between the CdTe pn junction layer and the lower pn junction layer; a transparent superstrate positioned opposite the CdTe pn junction layer from the transparent insulating layer; and an interdigitated p-type and n-type back contact comprising Si and associated with the lower sub-cell on the side of the lower sub-cell opposite the transparent insulating layer, wherein the CdTe upper sub-cell and the lower sub-cell are voltage-matched and are connected to each other in parallel. 2. The voltage-matched multijunction solar cell of claim 1 , wherein the lower pn junction layer comprises Si. 3. The voltage-matched multijunction solar cell of claim 2 , further comprising: a transparent first front contact and a transparent first back contact associated with the CdTe upper sub-cell, wherein the transparent first back contact is positioned between the transparent insulating layer and the CdTe upper sub-cell. 4. The voltage-matched multijunction solar cell of claim 1 , wherein the lower pn junction layer is crystalline and has a thickness equal to or less than 80 micrometers. 5. The voltage-matched multijunction solar cell of claim 1 , wherein: the CdTe upper sub-cell comprises at least one of single crystalline or polycrystalline CdTe, and the lower sub-cell comprises at least one of single crystalline or polycrystalline Si. 6. The voltage-matched multijunction solar cell of claim 1 , wherein the CdTe pn junction layer comprises a CdTe absorber layer and a CdS emitter layer. 7. The voltage-matched multijunction solar cell of claim 1 , wherein: the CdTe pn junction layer comprises a first string of serially connected CdTe upper sub-cells, the lower pn junction layer comprises a second string of serially connected lower sub-cells, and the first string and the second string are voltage-matched and are connected to each other in parallel. 8. The voltage-matched multijunction solar cell of claim 1 , wherein the transparent insulating layer comprises an oxide grown on the lower pn junction layer. 9. The voltage-matched multijunction solar cell of claim 1 , wherein the transparent superstrate comprises glass. 10. A method of fabricating a voltage-matched multijunction solar cell, the method comprising: forming a CdTe upper sub-cell within a CdTe pn junction layer on a transparent substrate; forming a lower sub-cell within a lower pn junction layer; providing a transparent insulating layer between the CdTe pn junction layer and the lower pn junction layer; forming an interdigitated p-type and n-type back contact comprising Si and associated with the lower sub-cell on the side of the lower sub-cell opposite the transparent insulating layer; subsequently joining the CdTe pn junction layer and the lower pn junction layer such that the transparent substrate is positioned in a superstrate configuration; and connecting the CdTe upper sub-cell and the lower sub-cell to each other in parallel, wherein the CdTe upper sub-cell and the lower sub-cell are voltage-matched. 11. The method of claim 10 , wherein the lower pn junction layer comprises Si. 12. The method of claim 11 , further comprising: forming a transparent first front contact and a transparent first back contact associated with the CdTe upper sub-cell, wherein the transparent first back contact is positioned between the transparent insulating layer and the CdTe upper sub-cell. 13. The method of claim 10 , further comprising: forming a transparent first front contact and a transparent first back contact associated with the CdTe upper sub-cell, wherein the transparent first back contact is positioned between the transparent insulating layer and the CdTe upper sub-cell; and forming a transparent second front contact and a transparent second back contact associated with the lower sub-cell, wherein the transparent second front contact and the transparent second back contact are formed on opposite sides of the lower pn junction layer. 14. The method of claim 10 , wherein: the lower sub-cell is physically supported by the transparent substrate, and the lower pn junction layer is crystalline and has a thickness equal to or less than 80 micrometers. 15. The method of claim 10 , wherein the CdTe pn junction layer comprises a CdTe absorber layer and a CdS emitter layer. 16. The method of claim 10 , further comprising: forming a first string of serially connected CdTe upper sub-cells within the CdTe pn junction layer; forming a second string of serially connected Si lower sub-cells within the lower pn junction layer; and connecting the first string and the second string to each other in parallel. 17. The method of claim 10 , wherein providing the transparent insulating layer comprises forming an oxide on the lower pn junction layer. 18. The method of claim 10 , wherein providing the transparent insulating layer comprises bonding a first side of a standalone insulating layer to the CdTe pn junction layer and bonding a second side of the standalone insulating layer opposite the first side to the lower pn junction layer. 19. The method of claim 10 , wherein the transparent insulating layer comprises polyethylene terephthalate.
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