Wood inlay card and method for making the same

US10163050B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10163050-B2
Application numberUS-201715823507-A
CountryUS
Kind codeB2
Filing dateNov 27, 2017
Priority dateNov 29, 2016
Publication dateDec 25, 2018
Grant dateDec 25, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A transaction card construction and a method for making a transaction card are provided for improving card performance. The transaction card construction comprises an inlay component comprising wood and a housing component. The inlay may comprise a wood or wood-containing layer and a backer layer. The backer layer may comprise the same or a different wood or wood-containing layer, or a non-woven fiber material.

First claim

Opening claim text (preview).

What is claimed is: 1. A transaction card, comprising: a housing component comprising a first housing surface, and a second housing surface opposite the first housing surface; and an inlay component having a thickness of between 1/24 and 1/16 of an inch comprising a first inlay surface, and a second inlay surface opposite the first inlay surface, the first inlay surface comprising a wood material; wherein the inlay component and the housing component are joined via the second inlay surface and the first housing surface, and wherein a visual blocker layer comprising a thin translucent plastic sheet is disposed between the first and second inlay surfaces, and wherein the second inlay surface is configured to prevent deformation of the first inlay surface. 2. The transaction card of claim 1 , wherein the inlay component comprises: a first inlay layer comprising a wood material; and a second inlay layer comprising a backer material. 3. The transaction card of claim 2 , wherein: the first inlay layer comprises a first wood material; and the backer material comprises a second wood material. 4. The transaction card of claim 3 , wherein the first inlay layer is rotated with respect to the second inlay layer such that a wood grain direction of the first inlay layer is non-parallel with a wood grain direction of the second inlay layer. 5. The transaction card of claim 2 , wherein the backer material comprises a non-woven fiber material. 6. The transaction card of claim 2 , wherein the backer material comprises poly-paraphenylene terephthalamide. 7. The transaction card of claim 1 , wherein the inlay component comprises medium-density fiberboard. 8. The transaction card of claim 1 , wherein the first inlay surface comprises a wood grain pattern formed thereon. 9. The transaction card of claim 1 , further comprising a data storage component joined to the housing. 10. The transaction card of claim 1 , further comprising a data storage component disposed between the inlay component and the housing component. 11. A transaction card, comprising: a housing component comprising a first housing surface, and a second housing surface opposite the first housing surface; and a wood inlay component having a thickness of between 1/24 and 1/16 of an inch comprising a first inlay surface, and a second inlay surface opposite the first inlay surface, wherein the wood inlay component and the housing component are joined via the second inlay surface and the first housing surface, and wherein a visual blocker layer comprising a thin translucent plastic sheet is disposed between the first and second inlay surfaces and wherein the second inlay surface is configured to prevent deformation of the first inlay surface. 12. The transaction card of claim 11 , wherein the wood inlay component comprises: a first inlay layer comprising a first wood material; and a second inlay layer comprising a second wood material as a backer material. 13. The transaction card of claim 12 , wherein the first inlay layer is rotated with respect to the second inlay layer such that a wood grain direction of the first inlay layer is non-parallel with a wood grain direction of the second inlay layer. 14. The transaction card of claim 11 , wherein the wood inlay comprises a non-woven fiber material as a backer material. 15. The transaction card of claim 11 , wherein wood inlay comprises poly-paraphenylene terephthalamide material as a backer material. 16. The transaction card of claim 11 , wherein the wood inlay component comprises medium-density fiberboard. 17. The transaction card of claim 11 , wherein the first inlay surface comprises a wood grain pattern formed thereon. 18. The transaction card of claim 11 , further comprising a data storage component joined to the housing. 19. The transaction card of claim 11 , further comprising a data storage component disposed between the wood inlay component and the housing component.

Assignees

Inventors

Classifications

  • the record carrier being manufactured in a continuous process, e.g. using endless rolls · CPC title

  • Cards, e.g. identity cards, credit cards · CPC title

  • characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title

  • the record carrier being at least partially made by a molding process (molding in general B29C45/14) · CPC title

  • the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

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What does patent US10163050B2 cover?
A transaction card construction and a method for making a transaction card are provided for improving card performance. The transaction card construction comprises an inlay component comprising wood and a housing component. The inlay may comprise a wood or wood-containing layer and a backer layer. The backer layer may comprise the same or a different wood or wood-containing layer, or a non-wove…
Who is the assignee on this patent?
Capital One Services Llc
What technology area does this patent fall under?
Primary CPC classification G06K19/07724. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).