Wood inlay card and method for making the same

US10152670B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10152670-B2
Application numberUS-201715825077-A
CountryUS
Kind codeB2
Filing dateNov 28, 2017
Priority dateNov 29, 2016
Publication dateDec 11, 2018
Grant dateDec 11, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A transaction card construction and a method for making a transaction card are provided for improving card performance. The transaction card construction comprises an inlay component comprising wood and a housing component. The inlay may comprise a wood or wood-containing layer and a backer layer. The backer layer may comprise the same or a different wood or wood-containing layer, or a non-woven fiber material.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a transaction card, comprising: forming a housing component having a first housing surface and a second housing surface opposite the first housing surface; forming an inlay component having a first inlay surface having a thickness of between 1/24 and 1/16 of an inch and a second inlay surface opposite the first inlay surface, the first inlay surface comprising a natural wood layer, and a visual blocker layer comprising a thin translucent plastic sheet being disposed between the first and second inlay surfaces, and wherein the second inlay surface is configured to prevent deformation of the first inlay surface; and joining the inlay component and the housing component via the second inlay surface and the first housing surface, such that the first inlay surface is visible from the exterior of the transaction card. 2. The method of claim 1 , wherein forming the inlay component includes: forming a first inlay layer comprising a natural wood material; forming a second inlay layer comprising a backer material; and joining the first and second inlay layers. 3. The method of claim 2 , wherein: the second backer material comprises a second wood material. 4. The method of claim 3 , further including rotating the first inlay layer with respect to the second inlay layer such that a wood grain direction of the first inlay layer is non-parallel with a wood grain direction of the second inlay layer. 5. The method of claim 2 , wherein the first inlay surface further comprises a resin material. 6. The method of claim 2 , wherein the backer material comprises poly-paraphenylene terephthalamide. 7. The method of claim 1 , further comprising softening the wood material of the inlay component. 8. The method of claim 1 , the first inlay surface later further comprising a translucent protective coating. 9. The method of claim 1 , further comprising affixing a data storage component to the housing. 10. The method of claim 1 , further comprising disposing a data storage component between the inlay and the housing. 11. A method of manufacturing a transaction card, comprising: forming a housing component having a first housing surface and a second housing surface opposite the first housing surface; forming a wood inlay component having a first inlay surface having a thickness of between 1/24 and 1/16 of an inch and a second inlay surface opposite the first inlay surface, the first inlay surface comprising a natural wood layer, and a visual blocker layer comprising a thin translucent plastic sheet being disposed between the first and second inlay surfaces, and wherein the second inlay surface is configured to prevent deformation of the first inlay surface; and joining the wood inlay component and the housing component via the second inlay surface and the first housing surface, such that the first inlay surface is visible from the exterior of the transaction card. 12. The method of claim 11 , wherein forming the wood inlay component comprises: forming a first inlay layer comprising a first wood material; forming a second inlay layer comprising a second wood material; and joining the first and second inlay layers. 13. The method of claim 12 , further comprising orienting the first inlay layer with respect to the second inlay layer such that a wood grain direction of the first inlay layer is non-parallel with a wood grain direction of the second inlay layer. 14. The method of claim 12 , further comprising softening the first and second wood materials. 15. The method of claim 11 , wherein the first inlay surface further comprises a resin material. 16. The method of claim 11 , further comprising forming poly-paraphenylene terephthalamide material as a backer material for the wood inlay. 17. The method of claim 11 , the first inlay surface later further comprising a translucent protective coating. 18. The method of claim 11 , further comprising disposing a data storage component on the housing. 19. The method of claim 11 , further comprising disposing a data storage component between the inlay and the housing.

Assignees

Inventors

Classifications

  • Constructional details · CPC title

  • Record carriers for use with machines and with at least a part designed to carry digital markings · CPC title

  • the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit · CPC title

  • characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title

  • the record carrier being at least partially made by a molding process (molding in general B29C45/14) · CPC title

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What does patent US10152670B2 cover?
A transaction card construction and a method for making a transaction card are provided for improving card performance. The transaction card construction comprises an inlay component comprising wood and a housing component. The inlay may comprise a wood or wood-containing layer and a backer layer. The backer layer may comprise the same or a different wood or wood-containing layer, or a non-wove…
Who is the assignee on this patent?
Capital One Services Llc
What technology area does this patent fall under?
Primary CPC classification G06K19/07724. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).