Thermosetting resin composition

Patent metadata

Field	Value
Publication number	US-10160856-B2
Application number	US-201515533549-A
Country	US
Kind code	B2
Filing date	Dec 11, 2015
Priority date	Dec 25, 2014
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

First claim

The invention claimed is:

1. A thermosetting resin composition comprising (A) a polyalkenylphenol resin, (B) an aromatic polymaleimide compound and (C) a polymerization initiator, wherein the polyalkenylphenol resin (A) has in the molecule at least one each of (a1) an aromatic ring unit with a phenolic hydroxyl group, the aromatic ring unit having a 2-alkenyl group bonded thereto, and (a2) an aromatic ring unit with a phenolic hydroxyl group, the aromatic ring unit not having a 2-alkenyl group bonded thereto, each aromatic ring unit being bonded by a linking group, wherein the ratio of m to (m+n) is 40 to 90% where m is the number of aromatic ring units of (a1) and n is the number of aromatic ring units of (a2), and wherein the thermosetting resin composition comprises the polyalkenylphenol resin (A) in an amount such that the proportion of 2-alkenyl groups is 0.4 to 1.5 mol relative to 1 mol of maleimide groups in the aromatic polymaleimide compound (B),
wherein the aromatic ring unit of (a1) is a structural unit represented by formula (1) and the aromatic ring unit of (a2) is a structural unit represented by formula (2):

wherein, in formulas (1) and (2), each R 1 independently is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms or an alkoxy group having 1 to 5 carbon atoms, in formula (1), R 2 is a 2-alkenyl group represented by formula (3):

wherein, in formula (3), R 5 , R 6 , R 7 , R 8 and R 9 each independently are a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a cycloalkyl group having 5 to 10 carbon atoms or an aryl group having 6 to 12 carbon atoms, the symbol “*” in formula (3) representing a binding site with a carbon atom composing the aromatic ring, and
the linking group is a divalent linking group represented by formula (4):
-Q-  (4)

wherein each Q independently is an alkylene group represented by the formula CR 3 R 4 , a cycloalkylene group having 5 to 10 carbon atoms, a divalent organic group having an alicyclic fused ring having 7 to 10 carbon atoms, or a divalent group that is a combination thereof, and R 3 and R 4 each independently are a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, a cycloalkyl group having 5 to 10 carbon atoms or an aryl group having 6 to 12 carbon atoms.

2. A thermosetting resin composition according to claim 1 , wherein Q in formula (4) is CH 2 .

3. A thermosetting resin composition according to claim 1 , wherein the 2-alkenyl group represented by formula (3) is bonded to the carbon atom at the ortho position or the para position relative to the phenolic hydroxyl group.

4. A thermosetting resin composition according to claim 1 , wherein the 2-alkenyl group represented by formula (3) is an allyl group.

5. A thermosetting resin composition according to claim 1 , wherein the number-average molecular weight of the polyalkenylphenol resin (A) is 750 to 5000.

6. A thermosetting resin composition according to claim 1 , wherein the aromatic polymaleimide compound (B) is an aromatic bismaleimide compound having a maleimidephenyl group.

7. A thermosetting resin composition according to claim 1 , wherein the polymerization initiator (C) is an organic peroxide.

8. A thermosetting resin composition according to claim 1 , wherein the thermosetting resin composition comprises 0.1 to 5 parts by mass of the polymerization initiator (C) relative to 100 parts by mass of the total amount of the polyalkenylphenol resin (A) and the aromatic polymaleimide compound (B).

9. A thermosetting resin composition according to claim 1 , further comprising a filler.

10. A thermosetting resin composition according to claim 9 , wherein the filler is an inorganic filler selected from the group consisting of amorphous silica, crystalline silica, alumina, boron nitride, aluminum nitride, silicon nitride, and mixtures thereof.

11. A thermosetting resin composition according to claim 2 , wherein the 2-alkenyl group represented by formula (3) is bonded to the carbon atom at the ortho position or the para position relative to the phenolic hydroxyl group.

Assignees

• Showa Denko Kk

Inventors

• Otake Hiromi
• Nakano Aoi
• Yamashita Chika
• Ishibashi Yoshitaka
• Uchida Hiroshi

Classifications

• C08F290/14 Primary

  Polymers provided for in subclass C08G · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• C08K5/3415

  Five-membered rings · CPC title

• C08K3/00

  Use of inorganic substances as compounding ingredients · CPC title

• C08L61/16 Primary

  of ketones with phenols · CPC title