Resin, composition, cured film, method for manufacturing cured film and semiconductor device

Patent metadata

Field	Value
Publication number	US-10450417-B2
Application number	US-201815938528-A
Country	US
Kind code	B2
Filing date	Mar 28, 2018
Priority date	Dec 25, 2015
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.

First claim

What is claimed is:

1. A composition containing a resin selected from polyimide precursor and polybenzoxazole precursor,
wherein the resin has a polymerizable group; and
the resin has a total content of a starting monomer of the resin and a derivative thereof of 0.001 to 0.45% by mass,
wherein the derivative excludes oligomer and polymer having the starting monomers polymerized therein,
wherein the polyimide precursor contains a repeating unit represented by Formula (2):

wherein each of A 1 and A 2 independently represents an oxygen atom or NH, R 115 represents a tetravalent organic group, each of R 113 and R 114 independently represents a hydrogen atom or monovalent organic group, at least one of R 113 or R 114 represents a polymerizable group-containing group, R 111 represents a divalent organic group selected from formulae below:

wherein the “A” in the formulae represents a single bond, or, a group selected from a hydrocarbon group having 1 to 10 carbon atoms optionally substituted by fluorine atom(s), —O—, —C(═O)—, —S—, —S(═O) 2 —, —NHCO—, and combinations of them,
wherein the repeating unit represented by Formula (2) in the polyimide precursor accounts for more than 90 mol % of the total repeating units.

2. The composition of claim 1 , wherein the total content of the starting monomer of the resin and the derivative thereof is 0.005 to 0.15% by mass of the resin.

3. The composition of claim 1 , wherein the resin contains the repeating unit represented by Formula (2) or a repeating unit represented by Formula (3):

wherein R 121 represents a divalent organic group, R 122 represents a tetravalent organic group, each of R 123 and R 124 independently represents a hydrogen atom or monovalent organic group, and at least one of R 123 or R 124 represents a polymerizable group-containing group.

4. The composition of claim 3 , wherein
the resin contains the repeating unit represented by Formula (2), and contains at least one of a monomer represented by Formula (2-1) or a monomer represented by Formula (2-2) as a component with a molecular weight of 1,000 or smaller; or
the resin contains the repeating unit represented by Formula (3), and contains at least one of a monomer represented by Formula (3-1) or a monomer represented by Formula (3-2) as a component with a molecular weight of 1,000 or smaller;

wherein R 115 represents a group same as R 115 in Formula (2); and, R 111 represents a group same as R 111 in Formula (2);

wherein R 122 represents a group same as R 122 in Formula (3); and R 121 represents a group same as R 121 in Formula (3).

5. The composition of claim 1 , having a water content of 1.0% by mass or less.

6. The composition of claim 1 , having a total content of Na, K, Ca, Fe, Cu, Mg, Mn, Al, Li, Ni, Cr, Sn and Zn of 15 ppm by mass or less.

7. The composition of claim 1 , further containing a photo-polymerization initiator.

8. A method for manufacturing a cured film comprising applying the composition described in claim 1 to a substrate, and curing the composition applied to the substrate.

Assignees

• Fujifilm Corp

Inventors

• Kawabata Takeshi
• Iwai Yu
• Shibuya Akinori

Classifications

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/721

  of bump connectors · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title