Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer

Patent metadata

Field	Value
Publication number	US-10159142-B2
Application number	US-201615578701-A
Country	US
Kind code	B2
Filing date	Jun 1, 2016
Priority date	Jun 2, 2015
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.

First claim

The invention claimed is:

1. A printed wiring board comprising:
a base member that includes a ground wiring pattern; and
a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state, wherein
the printed wiring board reinforcing member includes:
a metal base material layer; and
a nickel layer bonded, with a diffusion layer, to at least a surface, on a side opposite to a side bonded to the ground wiring pattern, of the metal base material layer, wherein

when a thickness of the nickel layer is tNi, a relationship between a thickness tD of the diffusion layer and a distance {tNi+(tD/2)} from a center position of the diffusion layer to a superficial layer surface of the nickel layer is (tD/2)/{tNi+(tD/2)}≤0.80.

2. The printed wiring board according to claim 1 , wherein the diffusion layer has a thickness of 5 μm or less.

3. The printed wiring board according to claim 1 , wherein the metal base material layer is made of any of a stainless steel, an aluminum, and an aluminum alloy.

4. A printed wiring board reinforcing member disposed opposed to a ground wiring pattern in a printed wiring board, the printed wiring board reinforcing member having an opposed one surface bonded to the ground wiring pattern in a conductive state, the printed wiring board reinforcing member having another surface electrically conducted with an external ground member at a ground potential, the printed wiring board reinforcing member comprising:
a metal base material layer; and
a nickel layer bonded, with a diffusion layer, to at least one surface of the metal base material layer, wherein
when a thickness of the nickel layer is tNi, a relationship between a thickness tD of the diffusion layer and a distance {tNi+(tD/2)} from a center position of the diffusion layer to a superficial layer surface of the nickel layer is (tD/2)/{tNi+(tD/2)}≤0.80.

5. The printed wiring board reinforcing member according to claim 4 , wherein the diffusion layer has a thickness of 5 μm or less.

6. The printed wiring board reinforcing member according to claim 4 , wherein the metal base material layer is made of any of a stainless steel, an aluminum, and an aluminum alloy.

7. The printed wiring board reinforcing member according to claim 4 , comprising a conductive adhesive layer disposed at one surface side of the metal base material layer.

8. A printed circuit board comprising:
a base member that includes a ground wiring pattern on at least one surface;
a printed wiring board reinforcing member disposed opposed to the ground wiring pattern, the printed wiring board reinforcing member including a nickel layer formed on at least a surface on a side opposite to a side of the ground wiring pattern of the metal base material layer and bonded with a diffusion layer;
a conductive adhesive layer that bonds the ground wiring pattern of the base member and the printed wiring board reinforcing member together in a conductive state; and
an electronic component disposed at a position corresponding to the printed wiring board reinforcing member on another surface of the base member, wherein
when a thickness of the nickel layer is tNi, a relationship between a thickness tD of the diffusion layer and a distance {tNi+(tD/2)} from a center position of the diffusion layer to a superficial layer surface of the nickel layer is (tD/2)/{tNi+(tD/2)}≤0.80.

Assignees

• Tatsuta Electric Wire & Cable Co Ltd
• Tokushu Kinzoku Excel Co Ltd

Inventors

• Haruna Yuusuke
• Tajima Hiroshi
• Watanabe Masahiro
• Kobayashi Yukari
• Sekiguchi Kiyoharu
• Hosoya Yoshihiro

Classifications

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K2201/2009

  Reinforced areas, e.g. for a specific part of a flexible printed circuit · CPC title

• H05K1/0215 Primary

  Grounding of printed circuits by connection to external grounding means · CPC title

• B23K2101/42

  Printed circuits · CPC title

• B23K2103/18

  Dissimilar materials · CPC title