Electrical components and methods and systems of manufacturing electrical components

US10154595B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10154595-B2
Application numberUS-201514711453-A
CountryUS
Kind codeB2
Filing dateMay 13, 2015
Priority dateOct 5, 2012
Publication dateDec 11, 2018
Grant dateDec 11, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing an electrical component, the method comprising: providing an electrically insulating substrate having an outer surface; applying a coating layer, including metallic material and non-metallic material, on the outer surface by selectively printing the coating layer in a circuit pattern on the outer surface, the coating layer having an interior volume defined between an inner surface of the coating layer on the outer surface of the s…

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What does patent US10154595B2 cover?
A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical condu…
Who is the assignee on this patent?
Tyco Electronics Corp, Tyco Electronics Amp Gmbh, Te Connectivity Corp, and 1 more
What technology area does this patent fall under?
Primary CPC classification H05K3/105. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).