Method of forming metallic pattern on polymer substrate
US-2015376809-A1 · Dec 31, 2015 · US
Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving object
US9219218B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9219218-B2 |
| Application number | US-201414578991-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 22, 2014 |
| Priority date | Dec 27, 2013 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
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Abstract
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A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.
First claim
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What is claimed is: 1. A method of manufacturing an electric wiring layer including an electric wiring, the method comprising: obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder…
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- What does patent US9219218B2 cover?
- A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a gl…
- Who is the assignee on this patent?
- Seiko Epson Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K3/105. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).