Integrated SOI pressure sensor having silicon stress isolation member

Patent metadata

Field	Value
Publication number	US-10151647-B2
Application number	US-201313921568-A
Country	US
Kind code	B2
Filing date	Jun 19, 2013
Priority date	Jun 19, 2013
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

In one embodiment a pressure sensor is provided. The pressure sensor includes a housing having an input port configured to allow a media to enter the housing. A support is mounted within the housing, the support defining a first aperture extending therethrough. A stress isolation member is mounted within the first aperture of the support, the stress isolation member defining a second aperture extending therethrough, wherein the stress isolation member is composed of silicon. sensor die bonded to the stress isolation member. The sensor die includes a silicon substrate having an insulator layer on a first side of the silicon substrate; and sensing circuitry disposed in the insulator layer on the first side, wherein a second side of the silicon substrate is exposed to the second aperture of the stress isolation member and the second side is reverse of the first side.

First claim

What is claimed is:

1. A pressure sensor comprising:
a housing comprising an input port configured to allow a media to enter the interior of the housing when the housing is placed in an environment containing the media;
a support mounted within the housing, the support defining a first aperture having a uniform cross-section extending through the support, and wherein the support is composed of an insulating material having a coefficient of thermal expansion similar to silicon;
a stress isolation member mounted within the first aperture of the support, the stress isolation member having a rectangular cuboid shape and defining a second aperture extending longitudinally through the rectangular cuboid shape, wherein the stress isolation member is composed of silicon, and wherein the cross-section of the first aperture substantially matches an outer cross section of the stress isolation member; and
a sensor die bonded to the stress isolation member, the sensor die including:
a silicon substrate having an insulator layer on a first side of the silicon substrate; and
sensing circuitry disposed in the insulator layer on the first side, wherein a second side of the silicon substrate is exposed to the second aperture of the stress isolation member and the second side is reverse of the first side; and wherein the second side of the silicon substrate is bonded to a first surface of the stress isolation member to form a silicon to silicon bond between the sensor die and the stress isolation member.

2. The pressure sensor of claim 1 , wherein the stress isolation member comprises a pedestal extending away from the second side of the silicon substrate, wherein the second aperture extends longitudinally through the pedestal, the sensor die being mounted to a first end of the pedestal, wherein the support is mounted proximate a second end of the pedestal, the second end reverse of the first end.

3. The pressure sensor of claim 1 , wherein the support is fabricated from a ceramic having a coefficient of thermal expansion similar to silicon.

4. The pressure sensor of claim 1 , further comprising an atomic layer deposition coating that covers an interior surface of the stress isolation member and the second side of the silicon substrate which are exposed to the media.

5. The pressure sensor of claim 4 , wherein the atomic layer deposition coating covers a portion of the support.

6. The pressure sensor of claim 4 , wherein the atomic layer deposition comprises a metal oxide.

7. The pressure sensor of claim 1 , wherein the housing defines a vacuum reference chamber, and the first side of the sensing die is exposed to the vacuum reference chamber.

8. The pressure sensor of claim 1 , wherein the support and the stress isolation member are mounted together using a braze.

9. The pressure sensor of claim 1 , wherein a crystalline orientation of the stress isolation member is substantially aligned with a crystalline orientation of the sensor die.

10. A method for fabricating a pressure sensor, the method comprising:
fabricating multiple sets of piezo-resistors in an insulator layer of a first silicon wafer, wherein each set of piezo-resistors corresponds to sensing circuitry for a sensor die;
etching a plurality of through holes in a second silicon wafer, wherein each through hole corresponds to an first aperture for a stress isolation member;
bonding the second silicon wafer to a side of the first silicon wafer reverse of the insulator layer using a low temperature silicon-to-silicon, surface-to-surface, diffusion process, wherein bonding includes aligning the second silicon wafer with the first silicon wafer such that each through hole is reverse of a set of peizo-resistors;
singulating the first and second silicon wafers to form a plurality of discrete pressure sensor primitives, each pressure sensor primitive including:
a sensor die composed of a portion of the first silicon wafer including a set of piezo-resistors; and
a stress isolation member composed of a portion of the second silicon wafer, the stress isolation member having a rectangular cuboid shape and defining the first aperture extending longitudinally through the rectangular cuboid shape;

providing a plurality of supports, each support defining a second aperture having a uniform cross-section extending through the support, and wherein the cross-section of the second aperture substantially matches an outer cross section of the stress isolation member, and wherein each support is composed of an insulating material having a coefficient of thermal expansion similar to silicon;
mounting each pressure sensor primitive to a support such that a portion of the outer surface of each stress isolation member is attached to the inner surface of the second aperture of a corresponding support.

11. The method of claim 10 , comprising:
coating surfaces of the stress isolation member and the sensor die that will be exposed to media with an atomic layer deposition of a metal oxide.

12. The method of claim 10 , comprising:
after bonding the second silicon wafer to the first silicon wafer, fabricating metal traces and wire bonding pads on a side of the first silicon wafer having the insulator layer to form sensing circuitry.

13. The method of claim 12 , comprising:
attaching each pressure sensor device with a support mounted thereto to a housing; and
sealing the housing such that the side of the sensor die having the sensing circuitry is within an environment having a known pressure and is hermetically isolated from the second aperture of the stress isolation member.

14. The method of claim 13 , wherein attaching each pressure sensor primitive with a support to a housing includes one of brazing or soldering each support to a corresponding housing.

15. The method of claim 12 , wherein bonding includes bonding at lower than 600 degrees Celcius.

16. The method of claim 12 , wherein bonding the second silicon wafer to a side of the first silicon wafer includes aligning a crystalline orientation of the second silicon wafer with a crystalline orientation of the first silicon wafer.

17. The method of claim 12 , wherein mounting each pressure sensor primitive to a support including brazing the pressure sensor device to the support.

18. The method of claim 12 , wherein fabricating multiple sets of piezo-resistors includes:
doping the insulator layer of the sensor die;
etching the insulator layer to form the multiple sets of piezo-resistors; and
polishing a diffusion surface flat.

19. A pressure sensor comprising:
a housing comprising an input port configured to allow a media to enter the interior of the housing when the housing is placed in an environment containing the media;
a support mounted within the housing, the support defining a first aperture having a uniform cross-section extending through the support, wherein the support is fabricated from a ceramic having a coefficient of thermal expansion similar to silicon;
a stress isolation member mounted within the first aperture of the support, the stress isolation member having a rectangular cuboid shape and defining a second aperture extending longitudinally through the rectangular cuboid shape, wherein the stress isolation member is composed of silicon, and wherein the cross-section of the first aperture substantially matches an outer cross section of the stress isolation member;
a sensor die bonded to the stress isolation member using a low temperature diffusion process, the sensor die including:
a silicon substrate having an insulator layer on a

Assignees

• Honeywell Int Inc

Inventors

• Brown Gregory C
• Rahn Curtis

Classifications

• H01L41/22

  Electricity · mapped topic

• H01L41/04

  Electricity · mapped topic

• G01L19/146 Primary

  using flexible element between the transducer and the support · CPC title

• G01L1/18 Primary

  using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title

• H10N30/01

  Manufacture or treatment · CPC title