Method and system for performing testing of photonic devices

Patent metadata

Field	Value
Publication number	US-10151627-B2
Application number	US-201514964144-A
Country	US
Kind code	B2
Filing date	Dec 9, 2015
Priority date	Aug 10, 2012
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.

First claim

What is claimed is:

1. A photonics system for wafer-level testing, the photonics system comprising:
a chip;
a transmitter, wherein:
the transmitter is on the chip; and
the transmitter is an optical transmitter;

a receiver, wherein:
the receiver is on the chip; and
the receiver is an optical receiver; and

a diagnostics waveguide, wherein:
the diagnostics waveguide is on the chip; and
the diagnostics waveguide optically couples light from the transmitter with an out-of-plane coupler or with both the out-of-plane coupler and the receiver.

2. The photonics system as recited in claim 1 , further comprising:
a transmit waveguide, wherein:
the transmit waveguide is on the chip; and
the transmit waveguide is coupled with the transmitter; and

a receive waveguide, wherein:
the receive waveguide is on the chip;
the receive waveguide is coupled with the receiver; and
the diagnostics waveguide optically couples light from the transmitter with the receiver by optically coupling the transmit waveguide with the receive waveguide.

3. The photonics system as recited in claim 1 , further comprising:
a first switch, wherein:
the first switch is on the chip; and
the first switch optically couples the transmitter with the diagnostics waveguide; and

a second switch, wherein:
the second switch is on the chip; and
the second switch optically couples the receiver with the diagnostics waveguide.

4. The photonics system as recited in claim 3 , further comprising:
a transmit port, wherein the transmit port is optically coupled with the first switch; and
a receive port, wherein the receive port is optically coupled with the second switch.

5. The photonics system as recited in claim 3 , wherein the first switch is a variable coupler.

6. The photonics system as recited in claim 1 , further comprising a wafer having a plurality of dies, and the chip is one of the plurality of dies.

7. The photonics system as recited in claim 1 , further comprising a test circuit on the chip.

8. The photonics system as recited in claim 7 , wherein the test circuit is configured to analyze signal to noise ratio, error detecting, signal bandwidth, and or optical frequency of an optical signal transmitted through the diagnostics waveguide.

9. The photonics system as recited in claim 1 , further comprising:
a tap on the diagnostics waveguide; and
a detector coupled with the tap.

10. A method of performing testing of a photonics transceiver, the method comprising:
providing a photonics system having:
a die that is part of a wafer, wherein the wafer is in undiced form;
a transmitter on the die that generates light;
a receiver on the die; and
a diagnostics waveguide on the die that optically couples light from the transmitter with the receiver;

generating a test pattern;
generating, with the transmitter, an optical signal associated with the test pattern;
coupling at least a portion of the optical signal from the transmitter into the diagnostics waveguide to provide a diagnostics signal;
coupling at least a portion of the diagnostics signal with the receiver;
testing the diagnostics signal; and
dicing the wafer after testing the diagnostics signal.

11. The method of claim 10 , wherein:
generating the test pattern is performed by using circuitry on the die; and
testing the diagnostics signal is performed by using circuitry on the die.

12. The method of claim 10 , wherein:
the photonics system further has:
a transmit waveguide optically coupling the diagnostics waveguide with the transmitter; and
a receive waveguide optically coupling the diagnostics waveguide with the receiver; and

the method further comprises transmitting the optical signal through the transmit waveguide; and
coupling at least the portion of the diagnostics signal with the receiver includes coupling the portion of the diagnostics signal with the receive waveguide.

13. The method of claim 10 , wherein:
the photonics system further has:
a first switch on the die optically between the transmitter and the diagnostics waveguide; and
a second switch on the die optically between the receiver and the diagnostics waveguide; and

the method further comprises:
actuating the first switch to couple light from the transmitter with the diagnostics waveguide; and
actuating the second switch to couple light from the diagnostics waveguide with the receiver.

14. The method of claim 10 , the method further comprising measuring a power associated with the portion of the optical signal using a photodiode and/or a power monitor, wherein the photodiode and/or the power monitor are on the die.

15. The method of claim 10 , the method further comprising coupling some of the portion of the optical signal off the wafer.

16. The method of claim 10 , the method further comprising:
receiving an off-die optical signal; and
coupling at least a portion of the off-die optical signal with the receiver.

17. The method of claim 10 , the method further comprising adjusting a parameter of the transmitter and/or the receiver after testing the diagnostics signal.

18. A photonics system including:
a transmit photonics module;
a receive photonics module;
a transmit waveguide coupled to the transmit photonics module;
a first optical switch integrated with the transmit waveguide;
a diagnostics waveguide optically coupled to the first optical switch;
a receive waveguide coupled to the receive photonics module;
an optical tap coupled to the diagnostics waveguide;
an optical coupler coupled to the optical tap, wherein the optical coupler comprises an out-of-plane coupler; and
a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.

19. The photonics system of claim 18 , wherein the transmit photonics module, the receive photonics module, the transmit waveguide, the first optical switch, the diagnostics waveguide, the optical tap, the optical coupler, and the second optical switch are part of an undiced optical ASIC.

20. The photonics system of claim 18 , wherein the out-of-plane coupler comprises an angled facet.

Assignees

• Skorpios Tech Inc

Inventors

• Stone Robert J
• Krasulick Stephen B

Classifications

• H04B17/0082

  using service channels; using auxiliary channels · CPC title

• H04B10/0731 Primary

  Testing or characterisation of optical devices, e.g. amplifiers · CPC title

• H04B10/035

  using loopbacks · CPC title

• G01J1/42

  using electric radiation detectors (optical or mechanical part G01J1/04; by comparison with a reference light or electric value G01J1/10) · CPC title

• H04B10/0779

  Monitoring line transmitter or line receiver equipment · CPC title