Method for manufacturing photo cured material

Patent metadata

Field	Value
Publication number	US-10150231-B2
Application number	US-201314391069-A
Country	US
Kind code	B2
Filing date	Apr 23, 2013
Priority date	Apr 27, 2012
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

Provided is a method for manufacturing a photo cured material, by which transferring precision can be improved and a small surface roughness can be obtained. The method includes the steps of: placing a photo-curable composition on a substrate; brining a mold into contact with the photo-curable composition; irradiating the photo-curable composition with light; and releasing the mold from the photo-curable composition. The contact is performed in a condensable gas atmosphere, the condensable gas condensing under a temperature condition at the contact and under a pressure condition that the condensable gas receives when the photo-curable composition intrudes gaps between the substrate and the mold or concavities provided on the mold, and the photo-curable composition includes a gas dissolution inhibitor having a rate of weight change with reference to the condensable gas that is −1.0% to 3.0%.

First claim

The invention claimed is:

1. A method for manufacturing a photo cured material having a predetermined patterned shape, the method comprising the steps of:
placing a photo-curable composition on a substrate;
bringing a mold into contact with the photo-curable composition;
irradiating the photo-curable composition with light; and
releasing the mold from the photo-curable composition,
wherein the contact is performed in an atmosphere of a condensable gas,
wherein the condensable gas condenses under a temperature condition at the contact and under a pressure condition that the condensable gas receives when the photo-curable composition intrudes into a plurality of gaps between the substrate and the mold or concavities provided on the mold,
wherein the photo-curable composition comprises a polymerizable monomer and a gas dissolution inhibitor against the condensable gas,
wherein the gas dissolution inhibitor has a rate of weight change with reference to the condensable gas that is −1.0% to 3.0%, where the rate of weight change with reference to the condensable gas is (weight after being exposed to the condensable gas)/(weight before being exposed to the condensable gas) (%) −100,
wherein the gas dissolution inhibitor comprises at least one of an oligomer and a polymer, and
wherein the condensable gas has a vapor pressure of 0.05 MPa to 1.00 MPa at room temperature and has a boiling point of 15° C. to 30° C. under atmospheric pressure.

2. The method according to claim 1 , wherein at the placing, the photo-curable composition is placed at a plurality of positions to be away from each other.

3. The method according to claim 1 , wherein at the placing, the photo-curable composition is placed at an entire face of the substrate.

4. The method according to claim 1 , wherein the gas dissolution inhibitor includes a styrene derivative.

5. The method according to claim 4 , wherein the styrene derivative includes a styrene copolymer.

6. The method according to claim 4 , wherein the styrene derivative includes a polystyrene.

7. The method according to claim 1 , wherein the condensable gas includes fluorocarbons.

8. The method according to claim 7 , wherein the fluorocarbons include at least one of 1,1,1,3,3-pentafluoropropane, trichlorofluoromethane and methylpentafluoroethyl ether.

9. The method according to claim 1 , wherein the mold lets light used at the irradiating pass therethrough.

10. The method according to claim 1 , wherein the photo cured material has pattern intervals of 20 nm or less.

11. The method according to claim 1 , wherein:
the mold has an area smaller than an area of the substrate,
the placing, the bringing into contact, the irradiating, and the releasing are performed at a plurality of regions on the substrate using the mold, and
a plurality of photo cured materials each having a patterned shape following a convexo-concave shape of the mold are disposed on the substrate.

Assignees

• Canon Kk

Inventors

• Ito Toshiki
• Iimura Akiko

Classifications

• H10P76/204

  of organic photoresist masks · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B29C2035/0827

  using UV radiation · CPC title

• H05K3/064

  Photoresists · CPC title

• H05K3/0082

  characterised by the exposure method of radiation-sensitive masks · CPC title