Method for inspecting cutting blade

Patent metadata

Field	Value
Publication number	US-10150198-B2
Application number	US-201615077469-A
Country	US
Kind code	B2
Filing date	Mar 22, 2016
Priority date	Mar 23, 2015
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

A method of inspecting a cutting blade having a cutting edge formed of abrasive grains of selected abrasive grain diameters which are bound by a bonding material, includes a cutting step of moving the chuck table and the cutting blade, which is being rotated at a high speed, relatively to each other along a direction perpendicular to an axis of rotation of a spindle, thereby forming a cut groove in the workpiece, and an inspecting step of capturing an image of the cut groove formed in the workpiece by image capturing means, and inspecting the state of the cut groove. The inspecting step examines whether or not the selected abrasive grain diameters are proper on the basis of any of the elements representing the size of an average chip, the number of chips, and the area of chips on both sides of the cut groove per unit length.

First claim

What is claimed is:

1. A method of inspecting a cutting blade having a cutting edge formed of abrasive grains of selected abrasive grain diameters which are bound by a bonding material, the method comprising:
a holding step of holding a workpiece on a chuck table;
an installing step of installing the cutting blade on a tip end of a spindle having an axis of rotation along a first direction;
a cutting step of moving the chuck table and the cutting blade, which is being rotated at a high speed, relatively to each other along a second direction perpendicular to the first direction, thereby forming a cut groove in the workpiece; and
an inspecting step of capturing an image of the cut groove formed in the workpiece by image capturing means, and inspecting the state of the cut groove;
wherein the inspecting step examines whether or not the selected abrasive grain diameters are proper on the basis of at least one of the following: size of an average chip, number of chips, and area of chips on both sides of the cut groove per unit length, from the captured image of the cut groove.

2. The method of inspecting a cutting blade according to claim 1 , further comprising:
a basic data generating step of generating basic data based on at least one of the following: the size of an average chip, the number of chips, and the area of chips on both sides of the cut groove per unit length, which has been formed in the workpiece by the cutting blade having the cutting edge formed of the abrasive grains of the selected abrasive grain diameters, and whose state has been examined during the inspecting step;
wherein the inspecting step examines whether or not the selected abrasive grain diameters are proper by comparing the state of the cut groove formed by the cutting step and the basic data with each other.

3. The method of inspecting a cutting blade according to claim 1 , wherein the cutting edge of the cutting blade includes an electroformed grinding stone formed of abrasive grains of diamond bound by nickel plating as a bonding material.

Assignees

• Disco Corp

Inventors

• Sekiya Kazuma

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B23Q17/249

  using image analysis, e.g. for radar, infrared or array camera images · CPC title

• B23Q17/2457

  of tools · CPC title

• B23Q17/0909

  Detection of broken tools · CPC title