Component mounting method and component mounting system

Patent metadata

Field	Value
Publication number	US-10149420-B2
Application number	US-201514794368-A
Country	US
Kind code	B2
Filing date	Jul 8, 2015
Priority date	Jul 17, 2014
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

A component mounting method is provided in a component mounting apparatus that mounts a component onto a board using a plurality of pieces of production data linked to component data. The method includes executing, when the component data is changed, a simulation of a production cycle time based on the production data, and comparing a simulation result of the production cycle time after change of the component data with a production cycle time or a simulation result of the production cycle time before change of the component data, and outputting a comparison result.

First claim

What is claimed is:

1. A component mounting method in a plurality of component mounting apparatuses that mounts components onto a board using a plurality of pieces of production data linked to component data, the method comprising:
changing the component data in order to suppress an operational error with respect to a component type;
executing, after changing the component data, a simulation of a production cycle time based on a changed production data; and
comparing a simulation result of the production cycle time after change of the component data with a production cycle time or a simulation result of the production cycle time before change of the component data, and outputting a comparison result regarding a bottleneck stage that has a longest production cycle time among the plurality of component mounting apparatuses,
wherein the component data includes at least one of a component shape, component size, a number of leads, lead width, lead length, and a mounting operation condition information.

2. The component mounting method according to claim 1 , wherein the mounting operation condition information regulates a component mounting operation condition in the plurality of component mounting apparatuses.

3. The component mounting method according to claim 1 wherein the mounting operation condition information includes at least one of a suction speed in suctioning and extracting the components by a suction nozzle, an imaging condition in imaging the extracted components by an imaging tool, a mounting speed in mounting the components on the board, and a type of suction nozzle that is used, in the plurality of component mounting apparatuses.

4. The component mounting method according to claim 1 , wherein the operational error comprises a suction error or a mounting position shift with respect to the components.

5. A component mounting system configured to mount components onto a board using a plurality of pieces of production data linked to component data, the system comprising:
a component mounting line that includes a plurality of component mounting apparatuses that executes an operation of mounting the components onto the board;
an operation input and display section configured to display a component data registration and editing screen and configured to input a change to the component data in order to suppress an operational error with respect to a component type;
a simulation executing section that executes, after the component data is changed, a simulation of a production cycle time based on the production data; and
a comparison result output section that compares a simulation result of the production cycle time after change of the component data with a production cycle time or a simulation result of the production cycle time before change of the component data, and outputs a comparison result regarding a bottleneck stage that has a longest production cycle time among the plurality of component mounting apparatuses,
wherein the component data includes at least one of a component shape, component size, a number of leads, lead width, lead length, and a mounting operation condition information.

6. The component mounting system according to claim 5 , wherein the mounting operation condition information regulates a component mounting operation condition in the plurality of component mounting apparatuses.

7. The component mounting system according to claim 5 , wherein the mounting operation condition information includes at least one of a suction speed in suctioning and extracting the components by a suction nozzle, an imaging condition in imaging the extracted components by an imaging toot, a mounting speed in mounting the components on the board, and a type of suction nozzle that is used, in the plurality of component mounting apparatuses.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Iwata Isato
• Takehara Hirokazu
• Yamazaki Takuya
• Sagara Hiroki

Classifications

• H05K2203/043

  Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste · CPC title

• H05K13/0465

  by soldering (H05K13/0469 takes precedence) · CPC title

• H05K13/0417

  Feeding with belts or tapes · CPC title

• H05K13/0408

  Incorporating a pick-up tool · CPC title

• H05K3/3494 Primary

  Heating processes for reflow soldering · CPC title