Heat control device for power equipment

Patent metadata

Field	Value
Publication number	US-10149410-B2
Application number	US-201314653121-A
Country	US
Kind code	B2
Filing date	Mar 28, 2013
Priority date	Dec 18, 2012
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

This invention involves and discloses a heat control device for power equipment, which comprises heat source, heat sink base plate, heat insulation layer, dissipation heat sink and thermal control switch, wherein the heat source is placed on and in contact with dissipation heat sink, and its bottom is in direct lap joint with heat sink base plate, wherein the heat insulation layer is set around heat sink base plate, wherein the thermal control switch is placed on heat sink base plate. This invention of heat control device is one that demonstrates excellent low temperature thermal insulation property for key components or heat-sensitive elements of power equipment. The heat control device applying technical solutions described in this invention features easy manufacturing, low cost and reliable performance.

First claim

The invention claimed is:

1. A heat control device for power equipment including a heat source, comprising a heat sink substrate, a thermal insulation layer, a dissipation heat sink and a thermal control switch,
wherein the heat source includes a bottom surface configured to be in direct contact with the heat sink substrate, the dissipation heat sink arranged at least underlying both the heat source and the heat sink substrate, a space provided between the dissipation heat sink and the heat sink substrate; wherein the thermal insulation layer is arranged in the space and underlying and in contact with at least one side of the heat sink substrate, the thermal insulation layer providing thermal insulation between the dissipation heat sink and the heat source and the heat sink substrate; and wherein the thermal control switch comprises heat conducting material having different heat conductivity at different temperatures, the thermal control switch arranged at least in the space and in contact with the heat sink substrate, the dissipation heat sink and the thermal insulation layer,
wherein the heat conducting material comprises a heat transfer element having different heat conductivity at different temperatures, wherein one end of the heat transfer element is in contact with the heat sink substrate, another end of the heat transfer element is embedded in the dissipation heat sink, and wherein the thermal insulation layer is provided underlying and on at least one side of the heat sink substrate, wherein at least a portion of the heat transfer element underlying the heat sink substrate is coated with the thermal insulation layer.

2. The heat control device for power equipment in claim 1 , wherein the thermal insulation material comprises solid material.

3. The heat control device for power equipment in claim 1 , wherein the thermal insulation material comprises a gas.

4. The heat control device for power equipment in claim 3 , wherein the gas comprises air.

5. A heat control device for power equipment, comprising a heat source, a heat sink substrate, a thermal insulation layer, a dissipation heat sink and a thermal control switch,
wherein the heat source includes a bottom surface in contact with the heat sink substrate and in thermal contact with the dissipation heat sink; wherein the thermal insulation layer is arranged underlying and in contact with at least one side of the heat sink substrate; and wherein the thermal control switch is in contact with the heat sink substrate; and
wherein the thermal control switch comprises a first heat-conductive material device and a plurality of second heat-conductive material devices, wherein a heat conductivity of the first heat conductive material device is greater than a heat conductivity of the plurality of second heat conductive material devices; and
wherein the plurality of second heat-conductive material devices are arranged between the heat sink substrate and the dissipation heat sink with a distance therebetween, and the plurality of second heat-conductive material devices are in contact with the heat sink substrate and the dissipation heat sink, wherein the first heat-conductive material device is arranged between the second heat-conductive material devices, the first heat-conductive material device having a first surface arranged underlying the heat sink substrate providing a gap therebetween and an opposing second surface in contact with the dissipation heat sink, wherein the thermal insulation layer comprises the gap formed by a closed stagnant air layer between the heat sink substrate and the first surface of the first heat-conductive material device.

Assignees

• Accelink Tech Co Ltd

Inventors

• Wu Xijie
• Bu Qinlian
• Xiao Guangying
• Yu Chunping
• Yang Yuxiang

Classifications

• H10W40/10

  Arrangements for heating · CPC title

• H10W40/00 Primary

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H05K7/20409 Primary

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• G02B6/42

  Coupling light guides with opto-electronic elements · CPC title

• H01L23/34

  Electricity · mapped topic