Method for manufacturing integrated substrate for organic light emitting diode, organic light emitting diode, and method for manufacturing organic light emitting diode

Patent metadata

Field	Value
Publication number	US-10147900-B2
Application number	US-201715400801-A
Country	US
Kind code	B2
Filing date	Jan 6, 2017
Priority date	Jan 20, 2016
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

Provided are a method for manufacturing an integrated substrate for an organic light emitting diode, an organic light emitting diode, and a method for manufacturing an organic light emitting diode, wherein the method for manufacturing an organic light emitting diode may include forming a sacrificial layer on a release substrate, forming a first electrode on the sacrificial layer, forming on the first electrode an auxiliary electrode pattern having an opening, forming a buffer layer on the auxiliary electrode pattern and in the opening, providing a substrate on the buffer layer, removing the release substrate and the sacrificial layer to expose a first surface of the first electrode, and laminating an organic light emitting layer and a second electrode on the first surface of the first electrode.

First claim

What is claimed is:

1. A method for manufacturing an organic light emitting diode, the method comprising:
forming a sacrificial layer on a release substrate;
forming an insulating pattern on the sacrificial layer;
forming on the sacrificial layer a first electrode having a first surface and a second surface which are facing each other, the first electrode extending onto the insulating pattern;
forming an auxiliary electrode pattern having an opening on the first electrode, wherein the opening exposing the second surface of the first electrode;
forming a buffer layer on the auxiliary electrode pattern and in the opening;
providing a substrate on the buffer layer;
removing the release substrate and the sacrificial layer to expose the first surface of the first electrode;
forming an organic light emitting layer on the first surface of the first electrode;
forming a second electrode on the organic light emitting layer; and
forming a second electrode pad on the second electrode, wherein the second electrode pad overlaps the insulating pattern when viewed on a plane.

2. The method of claim 1 , wherein the organic light emitting layer exposes the insulating pattern, the second electrode extending onto the insulating pattern.

3. The method of claim 1 , further comprising forming a first electrode pad on the first electrode.

4. The method of claim 3 , wherein:
the organic light emitting layer and the second electrode expose a portion of the first surface of the first electrode; and
the first electrode pad is disposed on the portion of the first surface of the first electrode.

5. The method of claim 1 , wherein the forming of the auxiliary electrode pattern is performed through a screen printing method, an offset printing method, a gravure printing method, or a nozzle printing method.

6. The method of claim 1 , wherein the forming of the buffer layer comprises:
applying a precursor solution onto the auxiliary electrode pattern to form a precursor layer which fills in the opening; and
curing the precursor layer.

7. The method of claim 1 , wherein the substrate comprises a first region, a second region, and a third region,
the first electrode and the first electrode pad overlapping the first region of the substrate,
the first electrode, the organic light emitting layer, and the second electrode overlapping the second region of the substrate, and
the insulating pattern, the second electrode, and the second electrode pad overlapping the third region of the substrate.

8. The method of claim 1 , wherein the buffer layer comprises:
a first buffer layer covering the auxiliary electrode pattern and including a light extraction layer; and
a second buffer layer provided between the first buffer layer and the substrate.

Assignees

• Electronics & Telecommunications Res Inst

Inventors

• Cho Doo-Hee
• Lee Jonghee
• Cho Hyunsu
• Kwon Byoung-Hwa
• Moon Jaehyun
• Park Young Sam
• Shin Jin Wook
• Yu Byoung Gon
• Lee Jeong Ik
• Lee Hyunkoo
• Lim Jong Tae
• Cho Nam Sung
• Joo Chul Woong
• Han Jun-Han

Classifications

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H01L51/56

  Electricity · mapped topic

• H01L51/0022

  Electricity · mapped topic

• H01L51/0023

  Electricity · mapped topic