Methods of forming oscillator systems having annular resonant circuitry

Patent metadata

Field	Value
Publication number	US-10143091-B2
Application number	US-201615009581-A
Country	US
Kind code	B2
Filing date	Jan 28, 2016
Priority date	Jul 29, 2011
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

Systems and apparatus are provided for solid-state oscillators and related resonant circuitry. An exemplary oscillator system includes an amplifier having an amplifier input and an amplifier output and resonant circuitry coupled between the amplifier output and the amplifier input. In exemplary embodiments, the resonant circuitry includes an annular resonance structure that is substantially symmetrical and includes a pair of arcuate inductive elements. In accordance with one or more embodiments, the resonant circuitry includes an additional inductive element that is capacitively coupled to the annular resonance structure via an air gap to improve the quality factor of the resonant circuitry.

First claim

What is claimed is:

1. A method for forming an oscillator arrangement that includes a resonant circuit, the method comprising:
forming a first inductive element on an electrical substrate; and
forming a second inductive element on the electrical substrate spaced apart from the first inductive element, the second inductive element substantially opposing the first inductive element to provide an annular resonance structure, wherein the first and second inductive elements have substantially identical electrical characteristics, the first and second inductive elements curve towards one another so that the annular resonance structure encompasses a voided interior region, a first longitudinal end of the first inductive element faces a first longitudinal end of the second inductive element across a first air gap, and a second longitudinal end of the first inductive element faces a second longitudinal end of the second inductive element across a second air gap.

2. The method of claim 1 , further comprising:
forming a third inductive element coupled between a first amplifier and the annular resonance structure, wherein the third inductive element is disposed proximate the annular resonance structure and separated from the annular resonance structure by a third air gap, the third inductive element being coupled to the annular resonance structure via a capacitance provided by the third air gap.

3. The method of claim 1 , wherein:
the first inductive element is a first arcuate inductive element,
the second inductive element is a second arcuate inductive element, and wherein the method further comprises
coupling a first capacitive element between the first longitudinal ends of the first and second arcuate inductive elements; and
coupling a second capacitive element between the second longitudinal ends of the first and second arcuate inductive elements.

4. The method of claim 3 , further comprising:
forming a third inductive element coupled between the first amplifier and the first arcuate inductive element, wherein:
the third inductive element is disposed proximate the first arcuate inductive element and separated from the first arcuate inductive element by a third air gap to provide a capacitance between the third inductive element and the first arcuate inductive element, and
the third inductive element is capacitively coupled to the first arcuate inductive element via the capacitance.

5. The method of claim 3 , wherein the first arcuate inductive element and the second arcuate inductive element are complementary in shape.

6. The method of claim 3 , wherein the annular resonance structure is symmetrical.

7. The method of claim 3 , wherein:
the first arcuate inductive element comprises a first substantially C-shaped conductive material; and
the second arcuate inductive element comprises a second substantially C-shaped conductive material.

8. The method of claim 3 , wherein:
the first arcuate inductive element comprises a first substantially U-shaped conductive material; and
the second arcuate inductive element comprises a second substantially U-shaped conductive material.

9. The method of claim 1 , wherein the annular resonance structure is symmetrical.

10. The method of claim 1 , further comprising:
coupling an amplifier to the annular resonance structure by coupling the first inductive element to an output of the amplifier, and coupling the second inductive element to an input of the amplifier.

11. The method of claim 1 , further comprising:
coupling a first capacitive element between the first longitudinal ends of the first and second inductive elements; and
coupling a second capacitive element between the second longitudinal ends of the first and second inductive elements.

12. The method of claim 11 , further comprising:
disposing a third inductive element proximate the first inductive element and separated from the first inductive element by a third air gap to provide a capacitance between the third inductive element and the first inductive element, wherein the third inductive element is capacitively coupled to the first inductive element via the capacitance.

13. The method of claim 12 , further comprising:
disposing a fourth inductive element proximate the second inductive element and separated from the second inductive element by a fourth air gap to provide a second capacitance between the fourth inductive element and the second inductive element, wherein the fourth inductive element is capacitively coupled to the second inductive element via the second capacitance.

14. The method of claim 13 , wherein the first inductive element and the second inductive element are complementary in shape and substantially oppose one another.

15. The method of claim 11 , wherein:
the first capacitive element has a first terminal coupled to the first longitudinal end of the first inductive element and a second terminal coupled to the first longitudinal end of the second inductive element; and
the second capacitive element has a third terminal coupled to the second longitudinal end of the first inductive element and a fourth terminal coupled to the second longitudinal end of the second inductive element.

Assignees

• Freescale Semiconductor Inc
• Nxp Usa Inc

Inventors

• Shi Tiefeng

Classifications

• H03B5/1847

  the active element in the amplifier being a semiconductor device · CPC title

• H03B2200/0076

  Power combination of several oscillators oscillating at the same frequency · CPC title

• H05K3/303 Primary

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• H03B1/02

  Structural details of power oscillators, e.g. for heating {(construction of transmitters H04B; features of generators for heating by electromagnetic fields H05B6/00)} · CPC title

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title