Apparatus and method for ionic liquid electroplating

US10138567B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10138567-B2
Application numberUS-201615265693-A
CountryUS
Kind codeB2
Filing dateSep 14, 2016
Priority dateOct 14, 2013
Publication dateNov 27, 2018
Grant dateNov 27, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electroplating apparatus includes a container containing plural portions and an ionic liquid plating solution that is capable of flowing therebetween. The plural portions include at least a first portion containing a counter electrode that includes coating donor material and a second portion that includes a workpiece. A porous scrubber separating the first and second portions has a plurality of metallic outer surfaces in contact with the ionic liquid plating solution. Coating, repair, and regeneration methods using an ionic liquid plating solution are also described.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for coating at least a first surface of a workpiece with a metallic coating, the method comprising: electrolytically etching a first portion of the workpiece in a container holding an ionic liquid plating solution, the etching step comprising subjecting the workpiece to an anodic potential and subjecting a counter electrode to a cathodic potential to remove at least a portion of an applied displacement layer, thereby (i) accumulating ionic byproducts of the removed portion of the displacement layer in the ionic liquid plating solution in the container and (ii) exposing and activating the first surface; electrodepositing the metallic coating onto the exposed and activated portion of the first surface without removing the workpiece from the container or the ionic liquid plating solution, the electrodepositing step comprising subjecting the counter electrode to an anodic potential and subjecting the workpiece to a cathodic potential to deposit coating donor material from the counter electrode onto the surface to be coated; and during at least one of the etching step and the electrodepositing step, fluidly communicating a portion of the ionic liquid plating solution through a porous scrubber disposed in the ionic liquid plating solution in the container between the workpiece and the counter electrode, the scrubber having a plurality of metallic outer surfaces in contact with the ionic liquid plating solution to capture at least some of the accumulated ionic byproducts of the removed portion of the displacement layer from the ionic liquid plating solution; wherein a portion of the ionic byproducts adhere to the metallic outer surfaces of the scrubber during at least the etching mode, thereby regenerating the ionic liquid plating solution in situ by removing at least a portion of the ionic byproducts therefrom without removing the ionic liquid plating solution from the container. 2. The method of claim 1 , further comprising: pretreating a first portion of the workpiece that includes the first surface; prior to the electrolytically etching step, depositing the displacement layer onto at least the pretreated first portion of the workpiece. 3. The method of claim 1 , wherein the workpiece comprises a metallic component substrate selected from the group consisting of: aluminum, magnesium, chromium, nickel, molybdenum, iron, and alloys thereof. 4. The method of claim 2 , wherein the pretreating step comprises: one or more of grit blasting, acid etching, desmutting, rinsing, and drying. 5. The method of claim 2 , wherein the displacement layer comprises a metal selected from a group consisting of: zinc, tin, copper, zirconium, cerium, and alloys thereof. 6. The method of claim 5 , wherein the depositing step comprises: an immersion process including a zincating process. 7. The method of claim 1 , wherein the metallic coating comprises a substantially pure metal selected from the group consisting of: aluminum and magnesium. 8. The method of claim 3 , wherein the metallic component substrate comprises an aluminum alloy selected from the group consisting of: AA 6061 alloy, AA 7075 alloy, and AA 2024 alloy. 9. The method of claim 1 , wherein the workpiece comprises a turbine engine component. 10. The method of claim 1 , wherein the ionic liquid plating solution comprises an ionic liquid selected from: 1-ethyl-3-methylimidazolium chloride [EMIM][Cl]-AlCl 3 , 1-butyl-3-methylimidizolium chloride [BMIM][Cl]-AlCl 3 , and combinations thereof. 11. The method of claim 1 , further comprising: electrically biasing the porous scrubber at least during the etching step. 12. The method of claim 1 , further comprising: electrically biasing the porous scrubber at least during the electroplating step. 13. The method of claim 1 , further comprising: operating at least one agitator in the container, the agitator adapted to circulate the ionic liquid plating solution through the porous scrubber. 14. The method of claim 1 , wherein a configuration of the porous scrubber is selected from a group consisting of: a mesh, foam, a honeycomb, a powder bed, and a fluidized bed, and combinations thereof.

Assignees

Inventors

Classifications

  • of light metals · CPC title

  • of light metals · CPC title

  • Nickel; Chromium · CPC title

  • Electrodes {, e.g. composition, counter electrode} · CPC title

  • from ionic liquids · CPC title

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What does patent US10138567B2 cover?
An electroplating apparatus includes a container containing plural portions and an ionic liquid plating solution that is capable of flowing therebetween. The plural portions include at least a first portion containing a counter electrode that includes coating donor material and a second portion that includes a workpiece. A porous scrubber separating the first and second portions has a plurality…
Who is the assignee on this patent?
United Technologies Corp
What technology area does this patent fall under?
Primary CPC classification C25D21/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).