Method for detecting power of welding laser light and laser welding system
US-2024424610-A1 · Dec 26, 2024 · US
US10137533B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10137533-B2 |
| Application number | US-201615156194-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 16, 2016 |
| Priority date | Dec 27, 2012 |
| Publication date | Nov 27, 2018 |
| Grant date | Nov 27, 2018 |
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A multi-functional apparatus for testing and etching a substrate capable of increasing spatial efficiency and manufacturing efficiency by performing testing and etching operations in a same chamber body and a substrate processing apparatus including the same, the multi-functional apparatus including a chamber body having an entrance into which the substrate is injected in one of its sides and an exit from which the substrate is ejected in another one of its sides; a transfer unit disposed inside of the chamber body and for transferring the injected substrate in a direction from the entrance to the exit; a laser etching unit disposed on an upper portion of the transfer unit and for etching a part of the substrate disposed on the transfer unit; and a testing unit for testing the substrate disposed on the transfer unit.
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing an organic light-emitting apparatus, the method comprising: injecting a substrate through a chamber body of a multi-functional apparatus for testing and etching the substrate, the chamber body having an entrance in one of its sides and an exit in another one of its sides, wherein the injecting of the substrate into the chamber body is through the entrance of the chamber body; transferring the injected substrate in a direction from the entrance to the exit utilizing a transfer unit disposed inside of the chamber body; etching a part of the substrate disposed on the transfer unit utilizing a laser etching unit disposed above the transfer unit; testing the substrate disposed on the transfer unit utilizing a testing unit; and ejecting the substrate from the chamber body through the exit of the chamber body. 2. The method of claim 1 , further comprising rotating the substrate disposed on the transfer unit to face a side surface of the chamber body utilizing a rotation unit; and testing the rotated substrate, wherein the testing unit is disposed next to the transfer unit and configured to test the rotated substrate. 3. The method of claim 1 , wherein the inside of the chamber body is maintained in a nitrogen atmosphere. 4. The method of claim 1 , wherein the testing unit comprises a plate in which a plurality of holes are formed and testing devices engaged into at least a part of the plurality of holes. 5. The method of claim 4 , wherein the testing devices are detachably engaged into at least a part of the plurality of holes. 6. The method of claim 1 , wherein the multi-functional apparatus for testing and etching the substrate is configured to manufacture a bottom emission display apparatus. 7. The method of claim 6 , wherein the transfer unit is configured to contact and transfer the substrate through which light is to pass, and the substrate is an element of the bottom emission display apparatus. 8. The method of claim 1 , wherein the laser etching unit comprises: a laser beam irradiation unit for irradiating a laser beam onto the substrate; a guiding unit configured to guide the laser beam ejected from the laser beam irradiation unit onto the substrate; a first conveyer unit for conveying the guiding unit in the direction from the entrance to the exit or in an opposite direction to the direction; and a second conveyer unit for conveying the guiding unit in a direction crossing the direction from the entrance to the exit. 9. The method of claim 8 , wherein one of the first conveyer unit and the second conveyer unit is configured to be conveyed by the other one of the first conveyer unit and the second conveyer unit, along with the guiding unit. 10. The method of claim 8 , wherein a relative location of the laser beam irradiation unit with respect to the chamber body is fixed. 11. The method of claim 1 , wherein the laser etching unit comprises: a laser beam irradiation unit for irradiating a laser beam onto the substrate; a first conveyer unit for conveying the laser beam irradiation unit in the direction from the entrance to the exit or in an opposite direction to the direction; and a second conveyer unit for conveying the laser beam irradiation unit in a direction crossing the direction from the entrance to the exit. 12. The method of claim 11 , wherein one of the first conveyer unit and the second conveyer unit is configured to be conveyed by the other one of the first conveyer unit and the second conveyer unit, along with the laser beam irradiation unit. 13. The method of claim 11 , further comprising supporting the laser etching unit from the outside of the chamber body utilizing an etching unit support unit, wherein the chamber body has an upper opening formed in an upper portion thereof and comprises a transmission window that shields the upper opening, and wherein the laser beam irradiation unit is configured to irradiate the laser beam onto the substrate through the transmission window. 14. The method of claim 13 , wherein the etching unit support unit is configured not to contact the chamber body. 15. The method of claim 1 , wherein the testing unit is disposed under the transfer unit. 16. The method of claim 15 , wherein the chamber body has a lower opening in a lower portion thereof. 17. The method of claim 16 , further comprising moving the testing unit up by an up-down unit to be disposed adjacent to the lower opening of the chamber body prior to the testing of the substrate. 18. The method of claim 17 , wherein, during the moving up of the testing unit by the up-down unit, the testing unit shields the lower opening of the chamber body. 19. The method of claim 16 , further comprising moving the testing unit up and down through the lower opening utilizing an up-down unit in such a manner that the testing unit is disposed inside or outside of the chamber body. 20. The method of claim 19 , wherein the testing unit is configured to be moved up by the up-down unit to be disposed inside of the chamber body, and to test the substrate.
Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title
for drying etching · CPC title
by using a laser, e.g. laser cutting or laser direct writing · CPC title
Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays (testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309) · CPC title
Devices involving rotation of the workpiece · CPC title
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