Printed circuit board used as voice coil, method for manufacturing the same and loudspeaker with the same

Patent metadata

Field	Value
Publication number	US-10136207-B2
Application number	US-201715666023-A
Country	US
Kind code	B2
Filing date	Aug 1, 2017
Priority date	Apr 5, 2017
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

A printed circuit board used as a voice coil includes N board units stacked over one another, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region.

First claim

What is claimed is:

1. A printed circuit board used as a voice coil comprising N board units stacked over one another, where N≥1, the printed circuit board having a top surface and a bottom surface opposite to the top surface, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region, each first circuit structure starting in the first electrically connecting region, spiraling around and closes to the second electrically connecting region, and ending in the second electrically connecting region, each second circuit structure starting in the second electrically connecting region, spiraling around and away from the second electrically connecting region, and ending in the first electrically connecting region, each first circuit structure and second circuit structure spiraling around the second electrically connecting region along a clockwise direction or a counterclockwise direction, starting points in the first electrically connecting regions of the first circuit structures of the board units being staggered, and starting points in the second electrically connecting regions of the second circuit structures of the board units being staggered, ending points in the second electrically connecting regions of the first circuit structures of the board units being staggered, and ending points in the first electrically connecting regions of the second circuit structures of the board units being staggered.

2. The printed circuit board of claim 1 , wherein the first electrically connecting region of the first circuit structure of the board unit has a starting terminal positioned at one starting point, and the first electrically connecting region of the second circuit structure of the Nth board unit has an ending terminal positioned at one ending point.

3. The printed circuit board of claim 1 , wherein a plurality of holes are defined through the top surface and the bottom surface of the printed circuit board, each hole receives an electrically connecting portion.

4. The printed circuit board of claim 3 , wherein a number of the board units is N, a number of the plurality of holes is 2N−1.

5. The printed circuit board of claim 4 , wherein N−1 of the plurality of holes are positioned in the first electrically connecting regions, N of the plurality of holes are positioned in the second electrically connecting regions.

6. The printed circuit board of claim 1 further comprises a receiving channel formed through the top surface and the bottom surface of the printed circuit board.

7. The printed circuit board of claim 1 , wherein the first circuit structure starts in the first electrically connecting region, spirals around and closes to the second electrically connecting region and the receiving channel, and ends in the second electrically connecting region, the second circuit structure starts in the second electrically connecting region, spirals around and away from the second electrically connecting region and the receiving channel, and ends in the first electrically connecting region.

8. The printed circuit board of claim 1 , wherein the first electrically connecting regions and the second electrically connecting regions are positioned on opposite sides of the receiving channel or on one side of the receiving channel.

9. A method for manufacture a print circuit board used as a voice coil comprises:
providing N board units, where N≥1, each board unit having a first electrically connecting region and a second electrically connecting region, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, each first circuit structure starting in the first electrically connecting region, spiraling around and closing to the second electrically connecting region, and ending in the first electrically connecting region, each second circuit structure starting in the second electrically connecting region, spiraling around and away from the second electrically connecting region, and ending in the first electrically connecting region;
stacking the N board units, the first electrically connecting regions being stacked over one another, and the second electrically connecting regions being stacked over one another;
starting points in the first electrically connecting regions of the first circuit structures of the board units being staggered, and starting points in the second electrically connecting regions of the second circuit structures of the board units being staggered, ending points in the second electrically connecting regions of the first circuit structures of the board units being staggered, and ending points in the first electrically connecting regions of the second circuit structures of the board units being staggered; and
in each board unit, electrically connecting in series the first circuit structure and the second circuit structure in the second electrically connecting region, in each two adjacent board units, electrically connecting in series the first electrically connecting region of the second circuit structure of an upper board unit and the first electrically connecting region of the first circuit structure of a lower board unit.

10. The method of the claim 9 , wherein a plurality of adhering layers is disposed between each two adjacent board units.

11. The method of the claim 9 , wherein the first electrically connecting region of the first circuit structure of the board unit has a starting terminal positioned at one starting point, and the first electrically connecting region of the second circuit structure of the Nth board unit has an ending terminal positioned at one ending point.

12. The method of the claim 9 , wherein in the “in each board unit, electrically connecting in series the first circuit structure and the second circuit structure in the second electrically connecting region, in each two adjacent board units, electrically connecting in series the first electrically connecting region of the second circuit structure of an upper board unit and the first electrically connecting region of the first circuit structure of a lower board unit”, a plurality of holes are defined through the top surface and the bottom surface of the printed circuit board, each hole receives an electrically connecting portion.

13. The method of the claim 9 further comprises forming a receiving channel through the top surface and bottom surface of the printed circuit board.

14. The method of the claim 13 , wherein the first circuit structure starts in the first electrically connecting region, spirals around and closes to the second electrically connecting region and the receiving channel, and ends in the second electrically connecting region, the second circuit structure starts in the second electrically connecting region, spirals around and away from the second electrically connecting region and the receiving channel, and ends in the first electrically connecting region.

Assignees

• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co

Inventors

• Hu xian-qin
• Zhong Fu-Wei
• Zhuang yi-qiang
• Zhou Chun-Ming

Classifications

• H04R1/06 Primary

  Arranging circuit leads; Relieving strain on circuit leads · CPC title

• H04R9/025

  Magnetic circuit · CPC title

• H04R9/06 Primary

  Loudspeakers · CPC title

• H04R31/006 Primary

  Interconnection of transducer parts (of diaphragm and outer suspension by moulding H04R31/003) · CPC title

• H04R2400/11

  Aspects regarding the frame of loudspeaker transducers · CPC title