Method of forming a semiconductor component having multiple bipolar transistors with different characteristics

Patent metadata

Field	Value
Publication number	US-10134637-B1
Application number	US-201715827125-A
Country	US
Kind code	B1
Filing date	Nov 30, 2017
Priority date	Nov 30, 2017
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

A semiconductor component is formed by providing a substrate having partially formed first and second transistors, a base electrode stack formed over the transistors, first and second emitter windows formed in the electrode stack over first and second collector regions of the transistors, and an oxide layer extending over the collector regions. A process entails forming a mask layer in a selected emitter window, optionally forming a selectively implanted collector (SIC) in an un-masked emitter window, and removing an oxide layer and forming an epitaxial layer in the un-masked emitter window. The process further entails forming an oxide layer over the epitaxial layer and repeating the operations of forming a mask layer for another selected emitter window, optionally forming a SIC in another un-masked emitter window, and removing an oxide layer and forming an epitaxial layer in the un-masked emitter window. The epitaxial layers may have different epitaxial growth profiles.

First claim

What is claimed is:

1. A method of manufacturing a semiconductor component comprises:
providing a substrate having first and second bipolar transistors partially formed therein, a base electrode stack formed over each of the first and second bipolar transistors, a first emitter window formed in the base electrode stack over a first collector region of the first bipolar transistor, and a second emitter window formed in the base electrode stack over a second collector region of the second bipolar transistor, wherein a nitride layer covers a sidewall of the base electrode stack in each of the first and second emitter windows and a first oxide layer extends over the first and second collector regions;
forming a first mask layer over the first oxide layer in the second emitter window;
removing the first oxide layer from the first collector region in the first emitter window;
forming a first epitaxial layer in the first emitter window following removal of the first oxide layer from the first collector region, wherein the first mask layer protects the first oxide layer in the second emitter window to prevent growth of the first epitaxial layer in the second emitter window;
forming a second oxide layer over the first epitaxial layer in the first emitter window;
forming a second mask layer over the second oxide layer and the first epitaxial layer in the first emitter window;
removing the first oxide layer from the second collector region in the second emitter window; and
forming a second epitaxial layer in the second emitter window following removal of the first oxide layer from the second collector region, wherein the second oxide layer in the first emitter window prevents growth of the second epitaxial layer in the first emitter window.

2. The method of claim 1 wherein:
removing the first oxide layer from the first collector region comprises removing a portion of the first oxide layer below the nitride layer to expose the base electrode stack; and
forming the first epitaxial layer comprises forming the first epitaxial layer with a portion of the first epitaxial layer underneath the nitride layer and in contact with the base electrode stack.

3. The method of claim 1 further comprising removing the first mask layer from the second emitter window following removal of the first oxide layer from the first collector region and prior to forming the first epitaxial layer, wherein the first oxide layer in the second collector region prevents growth of the first epitaxial layer in the second emitter window.

4. The method of claim 1 wherein a first silicon region extends over the first collector region in the first emitter window, a second silicon region extends over the second collector region in the second emitter window, and the method further comprises forming a selectively implanted collector in the first silicon region above the first collector region, wherein the first mask layer prevents formation of the selectively implanted collector in the second silicon region above the second collector region.

5. The method of claim 1 wherein forming the second oxide layer comprises forming the second oxide layer over the base electrode stack and the second emitter window concurrently with forming the second oxide layer over the first epitaxial layer.

6. The method of claim 5 wherein removing the first oxide layer from the second collector region in the second emitter window comprises removing both of the first and second oxide layers from the second collector region in the second emitter window.

7. The method of claim 1 wherein:
removing the first oxide layer from the second collector region comprises removing a portion of the first oxide layer below the nitride layer to expose the base electrode stack; and
forming the second epitaxial layer comprises forming the second epitaxial layer with a portion of the second epitaxial layer underneath the nitride layer and in contact with the base electrode stack.

8. The method of claim 1 further comprising removing the second mask layer in the first emitter window following removal of the first oxide layer from the second collector region in the second emitter window and prior to forming the second epitaxial layer, wherein the second oxide layer over the first collector region in the first emitter window prevents growth of the second epitaxial layer in the first emitter window.

9. The method of claim 1 wherein a first silicon region extends over the first collector region in the first emitter window, a second silicon region extends over the second collector region in the second emitter window, and the method further comprises forming a selectively implanted collector in the second silicon region above the second collector region, wherein the second mask layer prevents formation of the selectively implanted collector in the first silicon region above the first collector region.

10. The method of claim 1 further comprising removing the second oxide layer from the first epitaxial layer in the first emitter window following formation of the second epitaxial layer.

11. The method of claim 1 further comprising:
selecting a first epitaxial growth profile for the first epitaxial layer; and
selecting a second epitaxial growth profile for the second epitaxial layer, the second epitaxial growth profile differing from the first epitaxial growth profile.

12. The method of claim 1 further comprising:
selecting a first doping profile for the first collector region;
incorporating the first doping profile at the first collector region;
selecting a second doping profile for the second collector region, the second doping profile differing from the first doping profile; and
incorporating the second doping profile at the second collector region.

13. The method of claim 1 wherein providing the substrate comprises providing at least one of the first and second emitter windows with a selectively implanted collector formed in a silicon region above at least one of the first and second collector regions.

14. A method of manufacturing a semiconductor component comprises:
providing a substrate having first and second bipolar transistors partially formed therein, a base electrode stack formed over each of the first and second bipolar transistors, a first emitter window formed in the base electrode stack over a first collector region of the first bipolar transistor, and a second emitter window formed in the base electrode stack over a second collector region of the second bipolar transistor, wherein a nitride layer covers a sidewall of the base electrode stack in each of the first and second emitter windows and a first oxide layer extends over the first and second collector regions;
forming a first mask layer over the first oxide layer in the second emitter window;
removing the first oxide layer from the first collector region in the first emitter window;
removing the first mask layer from the second emitter window following removing the first oxide layer from the first collector region;
forming a first epitaxial layer in the first emitter window following removal of the first oxide layer from the first collector region, wherein the first oxide layer in the second emitter window prevents growth of the first epitaxial layer in the second emitter window;
forming a second oxide layer over the first epitaxial layer in the first emitter window;
forming a second mask layer over the second oxide layer and the first epitaxial layer in the first emitter window;
removing the first oxide layer from the second collector region in the second emitter window;
removing the second mask layer in the first emitter window follow

Assignees

• Nxp Usa Inc

Inventors

• John Jay Paul

Classifications

• H01L21/82285 Primary

  Electricity · mapped topic

• H01L27/0826

  Electricity · mapped topic

• H01L29/165

  Electricity · mapped topic

• H01L29/66242

  Electricity · mapped topic

• H01L29/7371

  Electricity · mapped topic