Multi-axis integrated MEMS inertial sensing device on single packaged chip

Patent metadata

Field	Value
Publication number	US-10132630-B2
Application number	US-201414162718-A
Country	US
Kind code	B2
Filing date	Jan 23, 2014
Priority date	Jan 25, 2013
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

A multi-axis integrated MEMS inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device. The structure is spatially configured with efficient use of the design area of the chip by adding the accelerometer device to the center of the gyroscope device. The design architecture can be a rectangular or square shape in geometry, which makes use of the whole chip area and maximizes the sensor size in a defined area. The MEMS is centered in the package, which is beneficial to the sensor's temperature performance. Furthermore, the electrical bonding pads of the integrated multi-axis inertial sensor device can be configured in the four corners of the rectangular chip layout. This configuration guarantees design symmetry and efficient use of the chip area.

First claim

What is claimed is:

1. A multi-axis integrated MEMS inertial sensing device, the device comprising:
a substrate member having a surface region, the surface region has an inner portion and an outer portion, the outer portion completely surrounding the inner portion;
at least one bond pad overlying each of four corners of the outer portion of the surface region;
a first MEMS inertial sensor overlying the inner portion of the surface region, the first MEMS inertial sensor comprising an accelerometer, the accelerometer being disposed completely inside the inner portion of the surface region; and
a second MEMS inertial sensor overlying the outer portion of the surface region;
wherein the second MEMS inertial sensor comprises a 3-axis gyroscope which includes one or more pairs of one-axis gyroscope sensors, the two one-axis gyroscope sensors of each pair being configured to sense along one common direction in space and being located symmetrically at opposite sides of the accelerometer, the gyroscope being disposed completely inside the outer portion of the surface region;
wherein the 3-axis gyroscope comprises x-axis gyroscope sensors, y-axis gyroscope sensors, and z-axis gyroscope sensors;
wherein the x-axis gyroscope sensors are placed along one axis of the substrate, and y-axis gyroscope sensors and the z-axis gyroscope sensors are placed along an orthogonal axis of the substrate;
wherein the multi-axis integrated MEMS inertial sensing device further comprises a cap wafer having a Z-travel stop structure spatially configured overlying the inner portion, thereby allowing high damping to the accelerometer and low damping to the 3-axis gyroscope.

2. The multi-axis integrated MEMS inertial sensing device of claim 1 wherein the two one-axis gyroscope sensors of each pair is located symmetrically at opposite sides of the accelerometer in a symmetric rectangular geometry.

3. The multi-axis integrated MEMS inertial sensing device of claim 1 wherein the first MEMS inertial sensor includes a 3-axis accelerometer.

4. The multi-axis integrated MEMS inertial sensing device of claim 3 wherein the 3-axis accelerometer comprises a proof mass anchored to the substrate member within the inner portion.

5. The multi-axis integrated MEMS inertial sensing device of claim 1 , wherein the 3-axis gyroscope is a single mask layer device.

6. The multi-axis integrated MEMS inertial sensing device of claim 5 wherein the 3-axis gyroscope comprises a proof mass anchored to the substrate member within the outer portion.

7. The multi-axis integrated MEMS inertial sensing device of claim 1 wherein each x-axis gyroscope sensor comprises a proof mass, a displacement driver, and an anchor structure, where the displacement driver and the anchor structure are disposed inside the proof mass.

8. An integrated MEMS device comprises:
a semiconductor substrate comprising a central region and a border region completely surrounding the central region;
a three-axis accelerometer formed only within the central region of the semiconductor substrate; and
a three-axis gyroscope formed only within the border region of the semiconductor substrate, wherein the three-axis accelerometer is surrounded by portions of the three-axis gyroscope along both an X-axis and a Y-axis of the substrate;
wherein the three-axis gyroscope comprises x-axis gyroscope sensors, y-axis gyroscope sensors, and z-axis gyroscope sensors;
wherein the x-axis gyroscope sensors are placed along one axis of the substrate, and y-axis gyroscope sensors and the z-axis gyroscope sensors are placed along an orthogonal axis of the substrate;
wherein each x-axis gyroscope sensor comprises a proof mass, a displacement driver, and an anchor structure, where the displacement driver and the anchor structure are disposed inside the proof mass;
wherein the integrated MEMS device further comprises a cap wafer having a Z-travel stop structure spatially configured overlying the central region, thereby allowing high damping to the three-axis accelerometer and low damping to the three-axis gyroscope.

9. The integrated MEMS device of claim 8 wherein the central region is selected from a group consisting of: rectangular, square, quadrilateral, and polygonal.

10. The integrated MEMS device of claim 8 wherein the three-axis accelerometer comprises a proof mass anchored to the semiconductor substrate within the central region.

11. The integrated MEMS device of claim 8 wherein the proof mass of the three-axis gyroscope is anchored to the semiconductor substrate within the border region.

12. The integrated MEMS device of claim 8 wherein two gyroscope sensors of each pair of gyroscope sensors for each of X, Y, and Z axes are located symmetrically at opposite sides of the three-axis accelerometer.

13. A multi-axis integrated MEMS inertial sensing device, the device comprising:
a semiconductor substrate comprising a central region and a border region around the central region;
at least one bond pad overlying each of the corners of the border region;
a three-axis accelerometer overlying the central region;
a three-axis gyroscope overlying the border region, wherein the three-axis gyroscope comprises a pair of gyroscope sensors for each of X, Y, and Z axes, the two gyroscope sensors of each pair being located symmetrically at opposite sides of the three-axis accelerometer, wherein the pair of gyroscope sensors for the X axis are placed along one axis of the substrate, and the pair of gyroscope sensors for the Y axis and the pair of gyroscope sensors for the Z axis are placed along an orthogonal axis of the substrate; and
a cap wafer having a Z-travel stop structure, the Z-travel stop structure spatially configured overlying the central region, thereby allowing high damping to the three-axis accelerometer and low damping to the three-axis gyroscope;
wherein each of the gyroscope sensors for the X, Y, and Z axes comprises a proof mass, a displacement driver, and an anchor structure, where the displacement driver and the anchor structure are disposed inside the proof mass.

14. The multi-axis integrated MEMS inertial sensing device of claim 13 wherein the three-axis accelerometer comprises a proof mass anchored to the semiconductor substrate within the central region.

15. The multi-axis integrated MEMS inertial sensing device of claim 13 wherein the three-axis gyroscope comprises a proof mass anchored to the semiconductor substrate within the border region.

16. The multi-axis integrated MEMS inertial sensing device of claim 15 wherein the three-axis gyroscope comprises x-axis displacement sensors, y-axis displacement sensors, and z-axis displacement sensors;
wherein the three-axis gyroscope comprises a displacement driver configured to displace the proof mass; and
wherein the x-axis displacement sensors, y-axis displacement sensors, and z-axis displacement sensors provide displacement data in response to displacement of the proof mass by the displacement driver.

Assignees

• Mcube Inc

Inventors

• Lee Terrence
• Zhang Wenhua
• Sridharamurthy Sudheer
• Yoneoka Shingo

Classifications

• G01C19/56 Primary

  Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces · CPC title

• B81B2201/0235

  Accelerometers · CPC title

• B81B7/0038

  using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters · CPC title

• G01P15/18

  in two or more dimensions · CPC title

• G01P15/02

  by making use of inertia forces {using solid seismic masses}(G01P15/14 takes precedence) · CPC title