Injection molding apparatus, injection molding method, and molded-product manufacturing method

US9387615B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9387615-B2
Application numberUS-201414490147-A
CountryUS
Kind codeB2
Filing dateSep 18, 2014
Priority dateSep 19, 2013
Publication dateJul 12, 2016
Grant dateJul 12, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An injection molding apparatus includes a stationary mold and a movable mold, and heats and cools at least one of the stationary mold and the movable mold when forming a molded product by injecting resin into a cavity formed by the stationary mold and the movable mold. The at least one mold to be heated and cooled is separable into a first mold member and a second mold member. When heating the at least one mold, the first mold member and the second mold member are separated from each other so that a space into which thermal fluid is to be injected is formed between the first mold member and the second mold member.

First claim

Opening claim text (preview).

What is claimed is: 1. An injection molding apparatus comprising: a stationary mold; and a movable mold, wherein at least one of the stationary mold and the movable mold is separable into a first mold member at a platen side and a second mold member at a cavity side, wherein when the first mold member and the second mold member are separated from each other, the first mold member and the second mold member are capable of forming, between the first mold member and the second mold member, a space into which thermal fluid is able to be injected, wherein the first mold member is composed of a material with thermal conductivity higher than that of the second mold member, and wherein a portion of the second mold member that is in contact with the cavity has a thickness ranging between 1 mm and 20 mm. 2. The injection molding apparatus according to claim 1 , wherein the space is a closed space excluding an inlet and outlet for the thermal fluid formed by the first mold member and the second mold member. 3. The injection molding apparatus according to claim 1 , wherein a projected area of the space onto the cavity is larger than an outer periphery of the cavity. 4. An injection molding method comprising: a step for heating at least one of a stationary mold and a movable mold; and a step for cooling the at least one mold to be heated, wherein the at least one mold to be heated and cooled is a mold that is separable into a first mold member at a platen side and a second mold member at a cavity side, wherein the step for heating includes forming a space between the first mold member and the second mold member by separating the first mold member and the second mold member from each other and injecting thermal fluid into the space, wherein the step for cooling includes bringing the first mold member and the second mold member into contact with each other, wherein the first mold member is composed of a material with thermal conductivity higher than that of the second mold member, and wherein a portion of the second mold member that is in contact with the cavity has a thickness ranging between 1 mm and 20 mm. 5. The injection molding method according to claim 4 , wherein the space is a closed space excluding an inlet and outlet for the thermal fluid formed by the first mold member and the second mold member. 6. The injection molding method according to claim 4 , wherein the step for heating is performed in a mold opening step for separating the stationary mold and the movable mold from each other, and wherein the first mold member and the second mold member are separated from each other prior to separating a mold, which is other than the at least one mold among the stationary mold and the movable mold, and the second mold member from each other. 7. The injection molding method according to claim 4 , wherein a projected area of the space onto the cavity is larger than an outer periphery of the cavity. 8. A method of manufacturing a molded product comprising: a step for heating at least one of a stationary mold and a movable mold; a mold closing step for bringing the stationary mold and the movable mold into contact with each other and forming a cavity; a step for forming a molded product by injecting resin into the cavity and cooling the resin; and a step for separating the stationary mold and the movable mold from each other and removing the molded product, wherein the step for heating the at least one mold includes separating the at least one mold into a first mold member and a second mold member so as to form a space between the first mold member and the second mold member, and injecting thermal fluid into the formed space, wherein the step for cooling the resin includes bringing the first mold member and the second mold member into contact with each other, wherein the first mold member is composed of a material with thermal conductivity higher than that of the second mold member, and wherein a portion of the second mold member that is in contact with the cavity has a thickness ranging between 1 mm and 20 mm. 9. The method of manufacturing a molded product according to claim 8 , wherein the at least one mold is the movable mold. 10. The method of manufacturing a molded product according to claim 8 , wherein the at least one mold is the stationary mold.

Assignees

Inventors

Classifications

  • using gas or steam (B29C45/7331 takes precedence) · CPC title

  • using mould parts movable during or after injection, e.g. injection-compression moulding {(B29C45/1705 and B29C45/572 take precedence)} · CPC title

  • Conductive · CPC title

  • Thickness · CPC title

  • B29C33/046Primary

    using gas · CPC title

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Frequently asked questions

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What does patent US9387615B2 cover?
An injection molding apparatus includes a stationary mold and a movable mold, and heats and cools at least one of the stationary mold and the movable mold when forming a molded product by injecting resin into a cavity formed by the stationary mold and the movable mold. The at least one mold to be heated and cooled is separable into a first mold member and a second mold member. When heating the …
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification B29C33/046. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).