Frame elements for package structures comprising printed circuit boards (PCBs)

Patent metadata

Field	Value
Publication number	US-10129972-B2
Application number	US-201514928055-A
Country	US
Kind code	B2
Filing date	Oct 30, 2015
Priority date	Oct 30, 2015
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material.

First claim

We claim:

1. An apparatus, comprising:
a substrate having an upper surface and a lower surface;
an electronic component disposed over the substrate;
an upper metallization disposed over the upper surface;
a frame element disposed directly on the upper metallization, the frame element comprising an outer wall disposed along a perimeter of the substrate, and a plurality of compartments disposed within a perimeter of the frame element, the frame element being configured to provide structural rigidity to the apparatus;
an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element, the encapsulating material having upper surface and sides; and
an electrically conductive layer disposed over the upper surface and the sides of the encapsulating material.

2. The apparatus of claim 1 , wherein the electronic component is one of a plurality of electronic components, and at least one of the plurality of electronic components has a first height that is a maximum electronic component height.

3. The apparatus of claim 2 , wherein the frame element has a second height that is not greater than the first height.

4. The apparatus of claim 3 , wherein the encapsulating material has a thickness that is greater than the first height.

5. The apparatus of claim 1 , wherein the electrically conductive layer is disposed over a sidewall of the substrate.

6. The apparatus of claim 2 , wherein the frame element has a second height that is greater than the first height.

7. The apparatus of claim 6 , wherein the encapsulating material has a thickness that is substantially the same as the second height.

8. The apparatus of claim 1 , wherein the frame element comprises an electrically conductive material.

9. The apparatus of claim 1 , wherein the frame element comprises a dielectric material.

10. The apparatus of claim 1 , wherein the substrate comprises a plurality of layers.

11. The apparatus of claim 10 , wherein the substrate comprises a plurality of electrically conductive vias.

12. The apparatus of claim 1 , wherein each of the plurality of compartments are substantially surrounded by walls of the frame element.

13. The apparatus of claim 12 , wherein the electronic component is one of a plurality of electronic components, and each of the plurality of compartments comprises at least one of the plurality of electronic components.

14. The apparatus of claim 12 , wherein the electronic component is one of a plurality of electronic components, and at least one of the electronic components has a first height that is a maximum electronic component height.

15. The apparatus of claim 14 , wherein the frame element has a second height that is not greater than the first height.

16. The apparatus of claim 15 , wherein the encapsulating material has a thickness that is greater than the second height.

17. The apparatus of claim 1 , wherein the frame element configured to provide electromagnetic shielding.

18. The apparatus of claim 14 , wherein the frame element has a second height that is greater than the first height.

19. The apparatus of claim 18 , wherein the encapsulating material has a thickness that is substantially the same as the second height.

20. The apparatus of claim 13 , wherein the frame element comprises an electrically conductive material configured to provide electromagnetic shielding of electronic components disposed in different compartments of the frame element.

21. The apparatus of claim 12 , wherein the frame element comprises a dielectric material.

22. The apparatus of claim 12 , wherein the substrate comprises a plurality of layers.

23. The apparatus of claim 22 , wherein the substrate comprises a plurality of electrically conductive vias.

24. The apparatus of claim 1 , wherein the plurality of compartments comprise respective interior walls separating one of the plurality of compartments from another of the plurality.

25. The apparatus of claim 1 , wherein the substrate has sides, and the electrically conductive layer is disposed over the sides of the substrate.

26. The apparatus of claim 1 , wherein the electrically conductive layer is electrically connected to a reference ground.

27. The apparatus of claim 1 , wherein the electrically conductive layer is not electrically connected to a reference ground.

28. The apparatus of claim 1 , further comprising a lower metallization disposed over the lower surface of the substrate.

29. The apparatus of claim 1 , wherein the upper metallization has a substantially identical shape as the frame element.

Assignees

• Avago Technologies General Ip
• Avago Tech Int Sales Pte Lid

Inventors

• Fritz Martin
• Gebauer Bernhard
• Elbrecht Lueder
• Handtmann Martin
• Wiedenmann Oliver
• Scherer Sergej

Classifications

• H05K2203/1316

  Moulded encapsulation of mounted components · CPC title

• H05K2201/2018

  Presence of a frame in a printed circuit or printed circuit assembly · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/0298

  Multilayer circuits · CPC title