Substrate processing apparatus, substrate processing method and substrate processing program

Patent metadata

Field	Value
Publication number	US-10128121-B2
Application number	US-201515304570-A
Country	US
Kind code	B2
Filing date	May 18, 2015
Priority date	May 20, 2014
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

A substrate processing apparatus is provided that includes a control part configured to control a substrate process in accordance with a processing procedure set in a process recipe. The process recipe is linked to a plurality of partial recipes obtained by dividing the processing procedure into functions. The control part controls the substrate process in accordance with processing procedures set in the linked plurality of partial recipes.

First claim

The invention claimed is:

1. A substrate processing apparatus comprising:
a chamber;
a control part configured to control a substrate process in accordance with a processing procedure set in a process recipe,
wherein the process recipe is linked to a plurality of partial recipes obtained by dividing the processing procedure into functions,
wherein the control part controls the substrate process in accordance with processing procedures set in the linked plurality of partial recipes,
wherein the plurality of partial recipes contains a partial recipe setting a processing procedure unique to the substrate process and a partial recipe setting a processing procedure common to the substrate process, and
wherein the partial processing recipe setting the unique processing procedure contains a plurality of partial recipes each setting a processing procedure of each process of a plurality of processes obtained by dividing the processing procedure unique to the substrate process thereinto, and the plurality of partial recipes are used to process different types of processing objects in the same chamber, all parameters of the plurality of partial recipes being preset fixed values.

2. The substrate processing apparatus as claimed in claim 1 , wherein the partial recipe setting the common processing procedure contains a partial recipe setting at least any of processing procedures of a preceding process and a post-process of the process performed by the unique processing procedure.

3. The substrate processing apparatus as claimed in claim 1 ,
wherein the process recipe is linked to a macro program, and
wherein the control part controls the substrate process in accordance with a sequence determined by the linked macro program.

4. The substrate processing apparatus as claimed in claim 1 ,
wherein the process recipe is linked to a checking program, and
wherein the control part checks a state of the substrate processing apparatus in accordance with the linked checking program.

5. The substrate processing apparatus as claimed in claim 1 , wherein the control part controls whether or not editing is authorized on a screen of the process recipe and the plurality of partial recipes based on first authority information showing an authority to edit each of the process recipe and the plurality of partial recipes.

6. The substrate processing apparatus as claimed in claim 1 , wherein the control part controls whether or not reference is authorized on a screen of the process recipe and the plurality of partial recipes based on second authority information showing an authority to refer to each of the process recipe and the plurality of partial recipes.

7. A substrate processing method to process a substrate in accordance with a process recipe setting a processing procedure of the substrate, the method comprising:
creating a process recipe linked to a plurality of partial recipes obtained by dividing the processing procedure into functions and being unitized; and
processing the substrate in accordance with processing procedures set in the plurality of partial recipes linked to the process recipe,
wherein the plurality of partial recipes contains a partial recipe setting a processing procedure unique to the substrate process and a partial recipe setting a processing procedure common to the substrate process, and
wherein the partial processing recipe setting the unique processing procedure contains a plurality of partial recipes each setting a processing procedure of each process of a plurality of processes obtained by dividing the processing procedure unique to the substrate process thereinto, and the plurality of partial recipes are used to process different types of processing objects in the same chamber, all parameters of the plurality of partial recipes being preset fixed values.

8. A substrate processing program to process a substrate in accordance with a process recipe setting a processing procedure of the substrate, comprising:
a process of creating a process recipe linked to a plurality of partial recipes obtained by dividing the processing procedure into functions and being unitized; and
a process of processing the substrate in accordance with processing procedures set in the plurality of partial recipes linked to the process recipe,
wherein the plurality of partial recipes contains a partial recipe setting a processing procedure unique to the substrate process and a partial recipe setting a processing procedure common to the substrate process, and
wherein the partial processing recipe setting the unique processing procedure contains a plurality of partial recipes each setting a processing procedure of each process of a plurality of processes obtained by dividing the processing procedure unique to the substrate process thereinto, and the plurality of partial recipes are used to process different types of processing objects in the same chamber, all parameters of the plurality of partial recipes being preset fixed values.

Assignees

• Tokyo Electron Ltd

Inventors

• Sasaki Mitsuru
• Miura Tatsuya
• Ohno Toshihiro
• Ono Kazumune
• Endo Shoko
• Kitahara Ryu

Classifications

• H10P72/04

  Apparatus for manufacture or treatment · CPC title

• H10P50/242 Primary

  of Group IV materials · CPC title

• H01J37/32926 Primary

  Software, data control or modelling · CPC title

• H01J37/32935

  Monitoring and controlling tubes by information coming from the object and/or discharge · CPC title

• H01L21/67011

  Electricity · mapped topic