Precision dual annealing apparatus

US10126053B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10126053-B2
Application numberUS-201615255871-A
CountryUS
Kind codeB2
Filing dateSep 2, 2016
Priority dateSep 2, 2016
Publication dateNov 13, 2018
Grant dateNov 13, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A dual annealing apparatus and use thereof for precision annealing of an article are provided. In one aspect, an annealing apparatus includes: a first heating plate opposite a second heating plate; a first cooling source associated with the first heating plate; and a second cooling source associated with the second heating plate, wherein the first heating plate and the second heating plate are independently controllable, and wherein the first cooling source and the second cooling source are independently controllable. A method for annealing an article using the annealing apparatus is also provided.

First claim

Opening claim text (preview).

What is claimed is: 1. An annealing apparatus, comprising: a first heating plate opposite a second heating plate; an annealing chamber in between the first heating plate and the second heating plate; a first cooling source associated with the first heating plate; and a second cooling source associated with the second heating plate, wherein the first heating plate and the second heating plate are independently controllable, and wherein the first cooling source and the second cooling source are independently controllable. 2. The annealing apparatus of claim 1 , wherein the first heating plate and the second heating plate are each formed of a metal selected from the group consisting of: graphite, copper, and combinations thereof. 3. The annealing apparatus of claim 1 , further comprising: a first power source; and a first controller connecting the first heating plate to the first power source. 4. The annealing apparatus of claim 3 , further comprising: a second power source; and a second controller connecting the second heating plate to the second power source. 5. The annealing apparatus of claim 4 , wherein the first controller and the second controller each comprises a proportional-integral-derivative (PID) controller. 6. The annealing apparatus of claim 1 , wherein the annealing chamber comprises a quartz chamber. 7. The annealing apparatus of claim 1 , wherein the annealing chamber comprises a first half and a second half which when combined form an airtight enclosure. 8. The annealing apparatus of claim 1 , wherein the first half of the annealing chamber is attached to the first heating plate, and wherein the second half of the annealing chamber is attached to the second heating plate. 9. The annealing apparatus of claim 1 , wherein the first cooling source comprises: a first enclosure, adjacent to the first heating plate, containing a first fan; and a first set of vents in a side of the first enclosure facing the first heating plate. 10. The annealing apparatus of claim 9 , wherein the first cooling source comprises: a second set of vents in a side of the first enclosure facing away from the first heating plate. 11. The annealing apparatus of claim 9 , wherein the first cooling source further comprises: an adjustable shutter configured to divert air from the first fan toward either the first set of vents or the second set of vents. 12. The annealing apparatus of claim 9 , wherein the second cooling source comprises: a second enclosure, adjacent to the second heating plate, containing a second fan; and a third set of vents in a side of the second enclosure facing the second heating plate. 13. The annealing apparatus of claim 1 , further comprising: rails for introducing an article between the first heating plate and the second heating plate. 14. The annealing apparatus of claim 1 , wherein the first cooling source comprises: a first water-cooled heat sink that is positionable to be either i) in a contact position with the first heating plate, or ii) in a non-contact position with the first heating plate. 15. The annealing apparatus of claim 14 , wherein the second cooling source comprises: a second water-cooled heat sink that is positionable to be either i) in a contact position with the second heating plate, or ii) in a non-contact position with the second heating plate. 16. The annealing apparatus of claim 15 , wherein the first water-cooled heat sink and the second water-cooled heat sink each comprises: a heat plate base; a conduit configured to circulate water through the heat plate base; and a first contact plate on the heat plate base. 17. The annealing apparatus of claim 16 , further comprising: a second contact plate on each of the first heating plate and the second heating plate, wherein the second contact plate is aligned with the first contact plate. 18. A method for annealing an article, comprising: providing an annealing apparatus having a first heating plate opposite a second heating plate, a first cooling source associated with the first heating plate, a second cooling source associated with the second heating plate, a first controller connecting the first heating plate to a first power source, and a second controller connecting the second heating plate to a second power source; introducing the article between the first heating plate and the second heating plate; and annealing a first side of the article using the first heating plate and a second side of the article using the second heating plate, wherein a temperature of the first heating plate is independently controlled during the annealing using the first cooling source and the first controller, and wherein a temperature of the second heating plate is independently controlled during the annealing using the second cooling source and the second controller, and wherein the annealing apparatus further comprises an annealing chamber in between the first heating plate and the second heating plate, the method further comprising: drawing a vacuum in the annealing chamber. 19. The method of claim 18 , wherein the first cooling source includes a first enclosure, adjacent to the first heating plate, containing a first fan, and wherein the second cooling source comprises a second enclosure, adjacent to the second heating plate, containing a second fan, the method further comprising: independently cooling the first heating plate using the first fan; and independently cooling the second heating plate using the second fan. 20. The method of claim 18 , wherein the first cooling source includes a first water-cooled heat sink with an adjustable position, and wherein the second cooling source includes a second water-cooled heat sink with an adjustable position, the method further comprising: independently cooling the first heating plate by adjusting the position of the first water-cooled heat sink such that the first water-cooled heat sink is in a contact position with the first heating plate; and independently cooling the second heating plate by adjusting the position of the second water-cooled heat sink such that the second water-cooled heat sink is in a contact position with the second heating plate.

Assignees

Inventors

Classifications

  • Arrangements of controlling devices · CPC title

  • Cooling of charges therein · CPC title

  • electrically heated · CPC title

  • Cooling of furnaces or of charges therein (casings, linings, walls or roofs incorporating cooling arrangements F27D1/12) · CPC title

  • Vacuum · CPC title

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What does patent US10126053B2 cover?
A dual annealing apparatus and use thereof for precision annealing of an article are provided. In one aspect, an annealing apparatus includes: a first heating plate opposite a second heating plate; a first cooling source associated with the first heating plate; and a second cooling source associated with the second heating plate, wherein the first heating plate and the second heating plate are …
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification F27B9/042. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Nov 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).