Microphone package with an integrated digital signal processor

Patent metadata

Field	Value
Publication number	US-10123112-B2
Application number	US-201514959478-A
Country	US
Kind code	B2
Filing date	Dec 4, 2015
Priority date	Dec 4, 2015
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

Systems and techniques for providing improved beam forming functionality and/or improve noise cancellation functionality in a microphone package are presented. In an implementation, a device includes a first microelectromechanical systems (MEMS) sensor, a second MEMS sensor, and a digital signal processor. The first MEMS sensor is contained in a first back cavity within the device. The second MEMS sensor is contained in a second back cavity within the device. The digital signal processor generates a cardioid microphone pattern based on data associated with the first MEMS sensor contained in the first back cavity and other data associated with the second MEMS sensor contained in the second back cavity, where the digital signal processor forms at least a portion of the first back cavity and the second back cavity.

First claim

What is claimed is:

1. A device, comprising:
a first microelectromechanical systems (MEMS) sensor contained in a first back cavity within the device;
a second MEMS sensor contained in a second back cavity within the device; and
a digital signal processor configured to generate a cardioid microphone pattern based on data associated with the first MEMS sensor contained in the first back cavity and other data associated with the second MEMS sensor contained in the second back cavity, wherein the digital signal processor forms a back wall of the first back cavity and at least a portion of the second back cavity, and wherein the second MEMS sensor is mechanically affixed to the digital signal processor associated with the second back cavity.

2. The device of claim 1 , wherein the back wall associated with the digital signal processor defines a back volume partition for the first back cavity and the second back cavity.

3. The device of claim 1 , wherein the back wall is shared between the first back cavity and the second back cavity.

4. The device of claim 1 , wherein a substrate forms another portion of the second back cavity.

5. The device of claim 4 , wherein the substrate comprises a first substrate portion and a second substrate portion separated by an opening associated with the first back cavity.

6. The device of claim 4 , wherein the substrate comprises a first substrate portion, a second substrate portion separated from the first substrate portion via an opening associated with the first back cavity, and a third substrate portion separated from the second substrate portion via another opening associated with the second back cavity.

7. The device of claim 1 , wherein the digital signal processor is configured to generate a noise suppressed signal based on a first cardioid signal associated with the first MEMS sensor contained in the first back cavity and a second cardioid signal associated with the second MEMS sensor contained in the second back cavity.

8. The device of claim 7 , wherein the digital signal processor is configured to generate the noise suppressed signal based on a level of difference between the first cardioid signal associated with the first MEMS sensor contained in the first back cavity and the second cardioid signal associated with the second MEMS sensor contained in the second back cavity.

9. The device of claim 7 , wherein the digital signal processor is configured to determine a first transfer function for the first cardioid signal associated with the first MEMS sensor contained in the first back cavity and a second transfer function for the second cardioid signal associated with the second MEMS sensor contained in the second back cavity.

10. The device of claim 9 , wherein the digital signal processor is configured to generate the noise suppressed signal based on the first transfer function and the second transfer function.

11. The device of claim 1 , wherein the digital signal processor is configured to generate a first cardioid microphone pattern based on the data associated with the first MEMS sensor contained in the first back cavity and a second cardioid microphone pattern based on the other data associated with the second MEMS sensor contained in the second back cavity.

12. The device of claim 1 , wherein the first back cavity comprises a third MEMS sensor and the second back cavity comprises a fourth MEMS sensor.

13. A system, comprising:
a digital signal processor configured to:
receive first data associated with a first microelectromechanical systems (MEMS) sensor contained in a first back cavity formed by the digital signal processor and a substrate, wherein the digital signal processor forms a back wall of the first back cavity;
receive second data associated with a second MEMS sensor contained in a second back cavity formed by the digital signal processor and the substrate, wherein the second MEMS sensor is mechanically affixed to the digital signal processor associated with the second back cavity, and
generate microphone data based on the first data associated with the first MEMS sensor contained in the first back cavity and the second data associated with the second MEMS sensor contained in the second back cavity.

14. The system of claim 13 , wherein the digital signal processor is configured to generate a cardioid microphone pattern based on the first data associated with the first MEMS sensor contained in the first back cavity and the second data associated with the second MEMS sensor contained in the second back cavity.

15. The system of claim 14 , wherein the digital signal processor is configured to generate a noise suppressed signal based on a set of cardioid signals associated with the cardioid microphone pattern.

16. The system of claim 13 , wherein the digital signal processor is configured to generate a noise suppressed signal based on a level of difference between a first cardioid signal associated with the first data and a second cardioid signal associated with the second data.

17. The system of claim 14 , wherein the digital signal processor is configured to determine a first transfer function for the first cardioid signal associated with the first data and a second transfer function for the second cardioid signal associated with the second data.

18. The system of claim 15 , wherein the digital signal processor is configured to generate the noise suppressed signal based on the first transfer function and the second transfer function.

19. A method, comprising:
bonding an application-specific integrated circuit (ASIC) associated with a digital signal processor to a first substrate associated with a first microelectromechanical systems (MEMS) sensor, wherein the ASIC and the first substrate form a first back cavity for the first MEMS sensor, and wherein the ASIC forms a back wall of the first back cavity; and
bonding a second substrate associated with a second MEMS sensor to the ASIC associated with the digital signal processor, wherein the ASIC and the second substrate form a second back cavity for the second MEMS sensor, and wherein the second MEMS sensor is mechanically affixed to the digital signal processor.

20. The method of claim 19 , wherein the bonding the ASIC to the first substrate includes bonding the ASIC to the first substrate via Eutectic bonding.

21. The method of claim 19 , wherein the bonding the second substrate to the ASIC includes bonding the second substrate to the ASIC via Eutectic bonding.

Assignees

• Invensense Inc

Inventors

• Murgia Carlo
• Lim James
• Assaderaghi Fariborz
• Minervini Anthony

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• H04R3/005 Primary

  for combining the signals of two or more microphones (specially adapted for hearing aids H04R25/407) · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title