Connector system with thermal surface

Patent metadata

Field	Value
Publication number	US-10122106-B2
Application number	US-201815881985-A
Country	US
Kind code	B2
Filing date	Jan 29, 2018
Priority date	Apr 24, 2013
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

A module can be configured to mate with a receptacle. The module includes a body with a thermal surface that is coupled to thermally active circuitry supported by the body. The receptacle is configured to allow air to flow over the thermal surface so as to dissipate thermal energy from the circuitry.

First claim

I claim:

1. A receptacle connector, comprising:
wafers with a card slot in a front face, the card slot having a first side and a second side, the wafers supporting a plurality of terminals, wherein some of the terminals are positioned on the first side and others of the terminals are positioned on the second side; and
a cage defining a port, the cage having a front edge and a rear wall, the cage positioned around the wafers so that the wafers are adjacent the rear wall, the port extending from the front edge to the wafers, the port having a port inlet at the front edge having a first inner perimeter and a module inlet with a second inner perimeter adjacent the wafers, the port transitioning from the first inner perimeter to the second inner perimeter at a location between the front edge and the front face, the second inner perimeter being smaller than the first inner perimeter.

2. The receptacle connector of claim 1 , wherein the port further includes an electromagnetic interference (EMI) gasket positioned in the module inlet, the EMI gasket configured, in operation, to engage a perimeter of an inserted plug connector so as to help reduce EMI.

3. The receptacle connector of claim 1 , wherein the port includes a vent wall that extends between the first inner perimeter and the second inner perimeter, the vent wall being configured so as to allow air that flows in through the inlet to flow out through the vent wall.

4. The receptacle connector of claim 3 , wherein the vent wall includes a plurality of apertures.

5. A connector system, comprising;
wafers with a card slot in a front face, the card slot having a first side and a second side, the wafers supporting a plurality of terminals, wherein some of the terminals are positioned on the first side and others of the terminals are positioned on the second side;
a cage defining a port, the cage having a front edge and a rear wall, the cage positioned around the wafers so that the wafers are is adjacent the rear wall, the port extending from the front edge to the wafers, the port having a port inlet at the front edge having a first inner perimeter and a module inlet with a second inner perimeter adjacent the wafers, the port transitioning from the first inner perimeter to the second inner perimeter at a location between the front edge and the front face, the second inner perimeter being smaller than the first inner perimeter; and
a module including a body having a mating face, the body having a thermal surface on a first side, the module having a paddle card positioned in the body and extending from the thermal surface to a position adjacent the mating face and circuitry positioned in the body, the circuitry configured to emit at least 1 watt of thermal energy, the circuitry thermally connected to the thermal surface.

6. The receptacle connector of claim 5 , wherein the port includes a vent wall that extends between the first inner perimeter and the second inner perimeter.

7. The receptacle connector of claim 6 , wherein the vent wall includes a plurality of apertures.

8. A plug connector, comprising:
a body having a mating face at a mating end, the body being elongated and extending in a first direction that is parallel with an insertion direction, the body having a thermal surface on a first side, the thermal surface having fins that extend along the first side toward the mating end;
a paddle card positioned in the body and extending to a position adjacent the mating face; and
circuitry positioned in the body, the circuitry configured to emit at least 1 watt of thermal energy, the circuitry thermally connected to the thermal surface, wherein the thermal surface includes at least 50% more surface area than a corresponding flat surface.

9. The connector of claim 8 , wherein the paddle card is a first paddle card, the body further supporting a second paddle card.

10. The connector of claim 8 , wherein the body has a height that is a first distance and the thermal surface extends above the first side a second distance that is at least half the first distance.

11. The connector of claim 8 , wherein the body extends beyond a mating end of the paddle card at the mating end of the body.

Assignees

• Molex Llc

Inventors

• Regnier Kent E

Classifications

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• H01R43/205

  with a panel or printed circuit board · CPC title

• H01R12/721 Primary

  cooperating directly with the edge of the rigid printed circuits · CPC title

• H05K7/20127

  Natural convection · CPC title

• H05K7/20154

  Heat dissipaters coupled to components · CPC title