Method for manufacturing light source assembly

Patent metadata

Field	Value
Publication number	US-10118253-B2
Application number	US-201414467044-A
Country	US
Kind code	B2
Filing date	Aug 24, 2014
Priority date	Apr 15, 2014
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

A light source assembly and a method for manufacturing the same are provided. The method for manufacturing the light source assembly includes the following steps. A back plate and a light bar are provided, in which the light bar includes a substrate and plural light emitting diodes disposed on a mounting surface of the substrate. The light bar is disposed on the back plate and a weld-processing area which includes an air interface is formed between the light bar and the back plate. The light bar and/or the back plate are/is melted by welding to form melted materials for filling the weld-processing area to fix the substrate on the back plate.

First claim

What is claimed is:

1. A method for manufacturing a light source assembly, the method comprising:
providing a back plate and a light bar, wherein the light bar comprises a substrate and a plurality of light emitting diodes disposed on a mounting surface of the substrate;
providing at least one protrusion on a surface of the back plate or a bottom surface of the substrate
disposing the light bar on the protrusion so that the light bar is disposed inclinedly on the back plate to form an included angle which is smaller than 90 degrees between the substrate and the back plate, and forming a weld-processing area between the light bar and the back plate, wherein the weld-processing area comprises an air interface; and
melting at least one of the light bar and the back plate through welding to form melted materials for filling the weld-processing area to fix the substrate on the back plate.

2. The method of claim 1 , further comprising:
forming a welding layer after the melted materials fill the weld-processing area, wherein the substrate is fixed on the back plate via the welding layer.

3. The method of claim 1 , wherein the at least one protrusion is formed by stamping.

4. The method of claim 1 , wherein the step of providing the at least one protrusion comprises simultaneously forming at least one recess portion on an opposite surface of the surface of the back plate or an opposite surface of the bottom surface of the substrate, and the at least one recess is corresponding to the at least one protrusion.

5. The method of claim 1 , wherein the welding process comprises an operation of using a laser device to emit a laser beam to the weld-processing area, and the incident angle of the laser beam is in a range substantially from 12 degrees to 20 degrees.

6. The method of claim 1 , wherein a height of the at least one protrusion is in a range substantially from 0.04 mm to 0.12 mm.

7. The method of claim 1 , wherein the mounting surface of the substrate is vertical to a bottom surface of the substrate.

8. The method of claim 1 , wherein, when viewed in a cross section of the light source assembly taken along a width direction of the substrate, the included angle is formed between a line drawn along a height direction of the substrate, and a line drawn along a length direction of the back plate which is perpendicular to the height direction of the substrate.

Assignees

• Radiant Opto Electronics Corp

Inventors

• Chiu Yi-Jen
• Chang Jung-Yin

Classifications

• G02B6/009 Primary

  of the light source in the package (G02B6/0021 takes precedence) · CPC title

• B23K26/20 Primary

  Bonding (soldering by means of radiant energy B23K1/005) · CPC title

• B23K26/242

  Fillet welding, i.e. involving a weld of substantially triangular cross section joining two parts · CPC title