Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Patent metadata

Field	Value
Publication number	US-10115870-B2
Application number	US-201615360316-A
Country	US
Kind code	B2
Filing date	Nov 23, 2016
Priority date	Sep 3, 2008
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

First claim

The invention claimed is:

1. A method of manufacturing a plurality of light emitting devices, each comprising a resin package that includes a first lead, a second lead and a resin part, and a light emitting element mounted on the resin package, each resin package including a first outer side surface and a second outer side surface opposing the first outer side surface, the method comprising:
providing a structure comprising:
a lead frame including first portions to become the first leads, and second portions to become the second leads, and
a resin-molded body,
wherein the structure includes a plurality of areas, each of which will become one of the resin packages, and each of which has a first outer side corresponding to the first outer side surface of the corresponding resin package, and a second outer side opposing the first outer side and corresponding to the second outer side surface of the corresponding resin package,
wherein each area of said structure has a concave portion on its upper side,
wherein the lead frame is exposed from the resin-molded body at a bottom face of each concave portion, such that a part of one of the first portions and a part of one of the second portions of the lead frame are located at each respective bottom face, separated by a portion of the resin-molded body,
wherein the lead frame has a plurality of first notch parts in which a portion of the resin-molded body is disposed,
wherein, in each area, a respective one of the first notch parts is located between said first portion to become the first lead and said second portion to become the second lead, and extends from the first outer side of said area to the second outer side of said area, and
wherein, in each area, in a plane of an uppermost surface of the lead frame, a width of each first notch part at the first and second outer sides is wider than a width of the first notch part within the bottom face of the concave portion in a direction along the first and second outer sides;

mounting light emitting elements on the bottom faces of the concave portions; and
cutting said structure so as to expose the portion of the resin-molded body disposed in each first notch part, to thereby obtain a plurality of light emitting devices in each of which both the first lead and the second lead are exposed from the resin part and substantially coplanar with a portion of the resin part disposed in the first notch part at each of the first and second outer side surfaces.

2. The method of manufacturing a plurality of light emitting devices according to claim 1 further comprising:
arranging sealing members to cover the light emitting elements in the concave portions.

3. The method of manufacturing a plurality of light emitting devices according to claim 1 , wherein the resin-molded body contains a light reflecting material.

4. The method of manufacturing a plurality of light emitting devices according to claim 1 , wherein the first notch parts are located such that the resin package obtained after cutting said structure has the first lead exposed from the resin part at three outer side surfaces of the resin package and the second lead exposed from the resin part at three outer side surfaces of the resin package.

5. The method of manufacturing a plurality of light emitting devices according to claim 1 , wherein providing said structure comprises:
sandwiching the lead frame having the first notch parts between an upper mold and a lower mold; and
depositing a resin that becomes the resin-molded body into a space formed by sandwiching the lead frame between the upper mold and the lower mold, including spaces in the first notch parts, and solidifying the resin such that said structure has the concave portions formed therein, the lead frame is exposed from the resin-molded body at the bottom faces of the concave portions, and a bottom surface of the lead frame is exposed from the resin-molded body.

6. The method of manufacturing a plurality of light emitting devices according to claim 1 , wherein the lead frame includes a silver plating over its entire surface.

7. The method of manufacturing a plurality of light emitting devices according to claim 1 , wherein the resin-molded body comprises a triazine derivative epoxy resin.

8. The method of manufacturing a plurality of light emitting devices according to claim 1 , wherein a portion of the resin molded body fills an entirety of each of the first notch parts.

9. The method of manufacturing a plurality of light emitting devices according to claim 1 ,
wherein each area further has a third outer side corresponding to a third outer side surface of the corresponding resin package, and a fourth outer side opposing the third outer side and corresponding to a fourth outer side surface of the corresponding resin package,
wherein the lead frame further has a plurality of second notch parts,
wherein, in each area, at least one of the second notch parts is located at each of the third and fourth outer sides of said area, and a portion of the resin-molded body is disposed in the second notch part at each of the third and fourth outer sides,
wherein, after cutting said structure, in each of the light emitting devices, the first lead is exposed from the resin part and substantially coplanar with the portion of the resin part disposed in the second notch part at the third outer side surface, and
wherein, after cutting said structure, in each of the light emitting devices, the second lead is exposed from the resin part and substantially coplanar with the portion of the resin part disposed in the second notch part at the fourth outer side surface.

10. The method of manufacturing a plurality of light emitting devices according to claim 9 ,
wherein each light emitting device has a substantially rectangular outer shape as viewed from an upper side of the light emitting device.

11. The method of manufacturing a plurality of light emitting devices according to claim 9 , wherein, in each area, the first notch part and the second notch parts extend over at least half of a surrounding periphery of said area, as viewed from the upper side of said area.

12. The method of manufacturing a plurality of light emitting devices according to claim 9 , wherein the first and second notch parts are located such that the resin package obtained after cutting said structure has the first lead exposed from the resin part at three outer side surfaces of the resin package and the second lead exposed from the resin part at three outer side surfaces of the resin package.

13. The method of manufacturing a plurality of light emitting devices according to claim 9 , wherein the second notch parts are located such that the resin package obtained after cutting said structure has the first lead exposed from the resin part at two or more places at the third outer side surface of the resin package and the second lead exposed from the resin part at two or more places at the fourth outer side surface of the resin package.

14. The method of manufacturing a plurality of light emitting devices according to claim 9 , wherein the lead frame includes a silver plating over its entire surface.

15. A light emitting device comprising:
a resin package comprising a resin part, a first lead, and a second lead, the resin package having a concave portion having a bottom face at which a part of an upper surface of the first lead and a part of an upper surface of the second lead are exposed from the resin part; and
a light emitting element mounted on the bottom face of the concave portion,
wherein the resin package includes a first outer side surface and a seco

Assignees

• Nichia Corp

Inventors

• Ichikawa Hirofumi
• Hayashi Masaki
• Sasaoka Shimpei
• Miki Tomohide

Classifications

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• B29C2793/009

  after shaping · CPC title

• B29C45/0055 Primary

  Shaping · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title