Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Patent metadata

Field	Value
Publication number	US-9537071-B2
Application number	US-201514928550-A
Country	US
Kind code	B2
Filing date	Oct 30, 2015
Priority date	Sep 3, 2008
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

First claim

The invention claimed is:

1. A light emitting device comprising:
a resin package comprising a resin part and a metal part including first and second metal plates, said resin package having four outer lateral surfaces and having a concave portion having a bottom surface; and
a light emitting element mounted on the bottom surface of the concave portion and electrically connected to the metal part,
wherein at least a portion of an outer lateral surface of the resin part and at least a portion of an outer lateral surface of the metal part are coplanar at each of the four outer lateral surfaces of the resin package,
wherein a notch is formed in the metal part at each of the four outer lateral surfaces of the resin package,
wherein the resin part is located at left and right sides of a portion of the metal part at at least two of the four outer lateral surfaces of the resin package, and
wherein each of the first and second metal plates is substantially flat.

2. The light emitting device according to claim 1 , wherein the light emitting device further comprises a sealing member that contains two or more kinds of phosphors.

3. The light emitting device according to claim 1 , wherein the metal part is exposed from the resin part at corners of the resin package.

4. The light emitting device according to claim 1 , wherein at least a portion of the light emitting element is exposed from the resin part.

5. The light emitting device according to claim 1 , wherein the metal part includes a base portion and a metal layer disposed on each of an upper surface and a lower surface of the base portion, the metal layers being made of a material that is different from that of the base portion.

6. The light emitting device according to claim 5 , wherein the metal layer is disposed at all surfaces of the metal part except a portion of an outer lateral surface of the metal part.

7. The light emitting device according to claim 5 , wherein:
the resin part is disposed over a first portion of the metal layer at the upper surface of the metal part, and
a second portion of the metal layer at the upper surface of the metal part is exposed from the resin part.

8. The light emitting device according to claim 1 , wherein the resin part contains a light reflecting material.

9. The light emitting device according to claim 8 , wherein the light reflecting material is titanium dioxide.

10. The light emitting device according to claim 9 , wherein the resin part contains 10 to 60% by weight of the titanium dioxide.

11. The light emitting device according to claim 1 , wherein the resin part is made using a thermosetting resin.

12. The light emitting device according to claim 1 , wherein the metal part has a step portion, a concave portion, and/or a convex portion.

13. The light emitting device according to claim 1 , wherein the metal part has means for providing a difference in level to expand a bonding area with a conductive material upon mounting.

14. A light emitting device comprising:
a resin package comprising a resin part and a metal part including first and second metal plates, said resin package having four outer lateral surfaces and having a concave portion having a bottom surface; and
a light emitting element mounted on the bottom surface of the concave portion and electrically connected to the metal part,
wherein at least a portion of an outer lateral surface of the resin part and at least a portion of an outer lateral surface of the metal part are coplanar at each of the four outer lateral surfaces of the resin package,
wherein a notch is formed in the metal part at each of the four outer lateral surfaces of the resin package,
wherein the resin part is located at left and right sides of a portion of the metal part at at least two of the four outer lateral surfaces of the resin package,
wherein the metal part comprises two or more major laterally extending upper surfaces, and
wherein all of the two or more major laterally extending upper surfaces are coplanar.

15. A light emitting device comprising:
a resin package comprising a resin part and a metal part including first and second metal plates, said resin package having four outer lateral surfaces and having a concave portion having a bottom surface; and
a light emitting element mounted on the bottom surface of the concave portion and electrically connected to the metal part,
wherein at least a portion of an outer lateral surface of the resin part and at least a portion of an outer lateral surface of the metal part are coplanar at each of the four outer lateral surfaces of the resin package,
wherein a notch is formed in the metal part at each of the four outer lateral surfaces of the resin package,
wherein the resin part is located at left and right sides of a portion of the metal part at at least two of the four outer lateral surfaces of the resin package, and
wherein all upper edges of the metal part are coplanar.

16. A light emitting device comprising:
a resin package comprising a resin part and a metal part including at least two metal plates, said resin package having four outer lateral surfaces and having a concave portion having a bottom surface; and
a light emitting element mounted on the bottom surface of the concave portion and electrically connected to the metal part,
wherein at least a portion of an outer surface of the resin part and at least a portion of an outer surface of the metal part are coplanar at an outer bottom surface of the resin package,
wherein at least a portion of an outer lateral surface of the resin part and at least a portion of an outer lateral surface of the metal part are coplanar at each of the four outer lateral surfaces of the resin package,
wherein a notch is formed in the metal part at each of the four outer lateral surfaces of the resin package,
wherein the resin part is located at left and right sides of a portion of the metal part at at least two of the four outer lateral surfaces of the resin package, and
wherein a lower surface of the metal part is exposed from the resin part in a region directly under the light emitting element.

17. The light emitting device according to claim 16 , wherein the resin part is made using a thermosetting resin.

18. The light emitting device according to claim 16 , wherein the metal part has a step portion, a concave portion, and/or a convex portion.

19. The light emitting device according to claim 16 , wherein the light emitting device further comprises a sealing member that contains two or more kinds of phosphors.

20. The light emitting device according to claim 16 , wherein the metal part is exposed from the resin part at corners of the resin package.

21. The light emitting device according to claim 16 , wherein the metal part includes a base portion and a metal layer disposed on each of an upper surface and a lower surface of the base portion, the metal lavers being made of a material that is different from that of the base portion.

22. The light emitting device according to claim 21 , wherein the metal layer is disposed at all surfaces of the metal part except an outer lateral surface of the metal part.

23. The light emitting device according to claim 21 , wherein:
the resin part is disposed over a first portion of the metal layer at the upper surface of the metal part, and
a second portion of the metal layer on the upper surface of the metal part is exposed from the resin part.

24. The light emitting

Assignees

• Nichia Corp

Inventors

• Ichikawa Hirofumi
• Hayashi Masaki
• Sasaoka Shimpei
• Miki Tomohide

Classifications

• B29C2793/009

  after shaping · CPC title

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• B29C45/0055 Primary

  Shaping · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title