High-performance LED fabrication

Patent metadata

Field	Value
Publication number	US-10115865-B2
Application number	US-201715785950-A
Country	US
Kind code	B2
Filing date	Oct 17, 2017
Priority date	Sep 18, 2009
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

High-performance light-emitting diode together with apparatus and method embodiments thereto are disclosed. The light emitting diode devices emit at a wavelength of 390 nm to 470 nm or at a wavelength of 405 nm to 430 nm. Light emitting diode devices are characterized by having a geometric relationship (e.g., aspect ratio) between a lateral dimension of the device and a vertical dimension of the device such that the geometric aspect ratio forms a volumetric light emitting diode that delivers a substantially flat current density across the device (e.g., as measured across a lateral dimension of the active region). The light emitting diode devices are characterized by having a current density in the active region of greater than about 175 Amps/cm 2 .

First claim

What is claimed is:

1. An LED package comprising:
a ceramic substrate having a substrate top surface;
a plurality of traces overlaying said substrate top surface;
a plurality of contacts, each contact being electrically connected to one of said traces;
a reflective material disposed over at least a portion of said traces, said reflective material not extending above said plurality of contacts; and
a flip-chip LED die having LED contacts said LED contacts contacting said plurality of contacts.

2. The LED package of claim 1 , wherein said ceramic substrate is electrically isolated from said plurality of traces.

3. The LED package of claim 2 , wherein said LED chip is volumetric.

4. The LED package of claim 2 , wherein said ceramic substrate consists of an insulating material.

5. The LED package of claim 4 , wherein said substrate comprises at least one of a ceramic, oxide, or nitride.

6. The LED package of claim 1 , wherein said traces have a first footprint area and said contacts have a second footprint area, wherein said second footprint area is smaller than said first footprint area.

7. The LED package of claim 1 , wherein said reflective layer forms a surface and said contacts protrude above said surface.

8. The LED package of claim 1 , wherein said LED die fully covers said contacts.

9. The LED package of claim 1 , wherein said traces are covered completely.

10. The LED package of claim 1 , wherein said traces and said contacts comprise copper.

11. The LED package of claim 1 , wherein the reflective material does not cover said contacts.

12. The LED package of claim 1 , wherein said contacts cover a fraction of said traces and wherein said reflective material covers another fraction of said traces.

13. A method of preparing an LED package comprising:
disposing a plurality of traces over a ceramic substrate;
disposing a plurality of contacts over said substrate such that each contact is electrically connected to one of said traces;
disposing a reflective material over at least a portion of said traces, said reflective material not extending above said plurality of contacts; and
flip-chip mounting an LED die having LED contacts over said substrate such that said LED contacts contact said plurality of contacts.

14. The method of claim 13 , wherein said plurality of traces is disposed in a first layer, and said contacts are disposed in a subsequent second layer.

15. The method of claim 14 , wherein said reflective material is disposed in a third layer subsequent to said second layer.

16. The method of claim 13 , wherein said traces have a first footprint area and said contacts have a second footprint area, wherein said second footprint area is smaller than said first footprint area.

17. The method of claim 13 , wherein said reflective layer forms a surface and said contacts protrude above said surface.

18. The method of claim 13 , wherein said LED die fully covers said contacts.

19. The method of claim 13 , wherein said traces are covered completely.

20. The method of claim 13 , wherein the reflective material does not cover said contacts.

21. The method of claim 13 , wherein said contacts cover a fraction of said traces and wherein said reflective material covers another fraction of said traces.

Assignees

• Soraa Inc

Inventors

• Cich Michael J
• David Aurelien J F
• Hurni Christophe
• Aldaz Rafael
• Krames Michael Ragan

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H01L33/405

  Electricity · mapped topic

• H01L33/16

  Electricity · mapped topic

• H01L33/60

  Electricity · mapped topic

• H01L33/486

  Electricity · mapped topic